• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.400-403
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• 2003

Etching characteristics of (Pb,Sr)$TiO_3$(PST) thin films were investigated using inductively coupled chlorine based plasma system as functions of gas mixing ratio, RF power and DC bias voltage. It was found that increasing of Ar content in gas mixture lead to sufficient increasing of etch rate and selectivity of PST to Pt. The maximum etch rate of PST film is $562\;{\AA}$/min and the selectivity of PST film to Pt is 0.8 at $Cl_2/(Cl_2+Ar)$ of 20 %. It was proposed that sputter etching is dominant etching mechanism while the contribution of chemical reaction is relatively low due to low volatility of etching products.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.5
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• pp.104-109
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• 2007

Photochemical patterning of self-assembled mono layers (SAMs) has been performed by diode pumped solid state (DPSS) 3rd harmonic Nd:$YVO_4$ laser with wavelength of 355 nm. SAMs patternings of parallel lines have subsequently been used either to generate compositional chemical patterns or fabricate microstructures by a wet etching. This paper describes a selective etching process with patterned SAMs of alkanetiolate molecules on the surface of gold. SAMs formed by the adsorption of alkanethiols onto gold substrate employs as very thin photoresists. In this paper, the influence of the interaction between the functional group of SAMs and the etching solution is studied with optimal laser irradiation conditions. The results show that hydrophobic functional groups of SAMs are more effective for selective chemical etching than the hydrophilic ones.

• Transactions on Electrical and Electronic Materials
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• v.12 no.4
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• pp.144-147
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• 2011

In this work, we present a study regarding the etching characteristics on titanium nitride (TiN) thin films using an inductively coupled plasma system. The TiN thin film was etched using a $N_2/BCl_3$/Ar plasma. The studied etching parameters were the gas mixing ratio, the radio frequency (RF) power, the direct current (DC)-bias voltages, and the process pressures. The baseline conditions were as follows: RF power = 500 W, DC-bias voltage = -150 V, substrate temperature = $40^{\circ}C$, and process pressure = 15 mTorr. The maximum etch rate and the selectivity of the TiN to the $SiO_2$ thin film were 62.38 nm/min and 5.7, respectively. The X-ray photoelectron spectroscopy results showed no accumulation of etching byproducts from the etched surface of the TiN thin film. Based on the experimental results, the etched TiN thin film was obtained by the chemical etching found in the reactive ion etching mechanism.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.182-185
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• 2003

Etching characteristics of (PB,Sr)$TiO_3$(PST) thin films Were investigated using inductively coupled chlorine based plasma system as functions of gas mixing ratio, RF power and DC bias voltage. It was found that increasing of Ar content in gas mixture' lead to sufficient increasing of etch rate and selectivity of PST to Pt. The maximum etch rate of PST film is 562 ${\AA}$/min and the selectivity of PST film to Pt is 0.8 at $Cl_2/(Cl_2+Ar)$ of 20 %. It was proposed that sputter etching is dominant etching mechanism while the contribution of chemical reaction is relatively low due to low volatility of etching products.

• Journal of IKEEE
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• v.25 no.1
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• pp.128-132
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• 2021

In this paper, the surface of electrodes used in solar cells was roughened using wet etching method among surface texturing method, and after surface treatment, dye sensitive solar cell using TiO2 oxide semiconductor was produced. The surface spectroscopic properties of surface treated electrodes were analyzed according to etching time, and by evaluating the electrical properties of TiO2 dye-sensitized solar cells produced according to etching time, the study on improving the efficiency of solar cells according to surface treatment was conducted. As a result, solar cells that etched the electrode surface for 10 minutes could see an improvement of about 27.46[%] over their existing efficiency.

• Tribology and Lubricants
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• v.40 no.3
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• pp.71-77
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• 2024

Hydrogen has emerged as an eco-friendly and sustainable alternative to fossil fuels. However, the utilization of hydrogen requires high-pressure compression, storage, and transportation, which poses challenges to the durability of compressor components, particularly the diaphragm. This study aims to improve the durability of 304 stainless steel diaphragms in hydrogen compressors by optimizing their surface roughness and corrosion resistance through wet etching. The specimens were prepared by immersing 304 stainless steel in a mixture of sulfuric acid and hydrogen peroxide, followed by etching in hydrochloric acid for various durations. The surface morphology, roughness, and wettability of the etched specimens were characterized using optical microscopy, surface profilometry, and water contact angle measurements. The friction and wear characteristics were evaluated using reciprocating sliding tests. The results showed that increasing the etching time led to the development of micro/nanostructures on the surface, thereby increasing surface roughness and hydrophilicity. The friction coefficient initially decreased with increasing surface roughness owing to the reduced contact area but increased during long-term wear owing to the destruction and delamination of surface protrusions. HCl-30M exhibited the lowest average friction coefficient and a balance between the surface roughness and oxide film formation, resulting in improved wear resistance. These findings highlight the importance of controlling the surface roughness and oxide film formation through etching optimization to obtain a uniform and wear-resistant surface for the enhanced durability of 304 stainless steel diaphragms in hydrogen compressors.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.213-216
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• 2007

LGP (light guide plate) of LCD-BLU (Liquid Crystal Display - Back Light Unit) is one of the major components which affects the product quality of LCD. In the present study, the optical patterns of LGP(2.2") are manufactured by three different methods, namely, laser ablation, chemical etching and LiGA - reflow, respectively. The pattern surface images and roughness of mold and product were compared to check the optical characteristics. From the results of measurement the optical patterns fabricated by LiGA - reflow method showed the best geometric structure as intended in design and the lowest roughness among those.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.385-385
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• 2010

In this work, we have investigated the etching characteristics of $TiO_2$ and selectivity of $TiO_2$ over $SiO_2$ thin films as resistance in ReRAM using the inductively coupled plasma. The etch rate and selectivity were measured by varying the $BCl_3$ addition into Ar plasma. The maximum etchrate was obtained at 110.1nm/min at $BCl_3$/Ar=5sccm/10sccm, 500W for RFpower, -100v for DC-bias voltage, and 2Pa for the process pressure. The etched $TiO_2$ surface was investigated with X-ray photo electron spectroscopy. We explained the etching mechanism in two etch mechanisms, physiclas puttering and chemical reaction.

• Journal of the Korean Ceramic Society
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• v.31 no.5
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• pp.485-490
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• 1994

The reactive ion etching characteristics of aluminum oxide films, prepared by PECVD, were investigated in the CCl4 plasma. The atomic chlorine concentration and the DC self bias were determined at various etching conditions, and their effects on the etch rate of aluminum oxide film were studied. The bombarding energy of incident particles was found to play the more important role in determining the etch rate of aluminum oxide rather than the atomic chlorine concentration. It is considered to be because the bombardment of ions or neutral atoms breaks the strong Al-O bonds of aluminum oxide to help activate the formation reaction of AlCl3 which is the volatile etch product.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.497-500
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• 1999

This paper reports on the fabrication and characteristics of recessed gate GaN MESFETs fabricated using a photoelectrochemical wet etching method. The unique etching process utilizes photo-resistive mask and KOH based etchant. GaN MESFETs with successfully recessed gate structure was characterized in terms of dc and RF performance. The fabricated GaN MESFET exhibits a current saturation at $V_{DS}$ = 4 V and a pinch-off at $V_{GS}$ =-3V The peak drain current of the device is about 230mA/mm at 300 K and the value is remained almost same for 500K operation. The $f_{T}$ and $f_{max}$ from the device are 6.357Hz and 10.25 GHz, respectively.y.y.