• Transactions on Electrical and Electronic Materials
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• 제1권4호
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• pp.7-10
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• 2000

Bi$_2$Sr$_2$CuI$\_$x/(Bi(2001)) thin films are fabricated by atomic layer by layer deposition using ion beam sputtering(IBS) method. During the deposition , 10 %-ozone/oxygen mixture gas of typical 25.0$\times$10$\^$-5/ Torr is applied with ultraviolet light irradiation for oxidation. XRD and RHEED investigations reveal out that a buffer layer with some different compositions is formed at the early deposition stage of less then 10 units cell and then c-axis oriented Bi(2201) is grown.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 추계학술대회 논문집
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• pp.97-100
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• 2000

Bi$_2$Sr$_2$CuO$\sub$x/(Bi(2201)) thin films are fabricated by atomic layer by layer deposition using ion beam sputtering(IBS) method. During the deposition, 10 %-ozone/oxygen mixture gas of typical 5.0 ${\times}$ 10$\^$-5/. Torr is applied with ultraviolet light irradiation for oxidation. XRD and RHEED investigations reveal out that a buffer layer with some different compositions is formed at the early deposition stage of less than 10 units cell and then c-axis oriented Bi(2201) is grown.

• 한국표면공학회지
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• 제31권6호
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• pp.345-358
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• 1998

The evolution of surface roughness and morphology in epitaxial Si and $Si_{0.7}Ge{0.3}$ alloys grown by UHV opm-beam sputter deposition onto nominally-singular, [100]-, and [110]-mi-scut Si(001) was investigated by stomic force microscopy and trasmission electron microscopy. The evolution of surface roughness of epitaxial Si films grown at $300^{\circ}C$ is inconsistent with conventional scaling and hyperscaling laws for kineti roughening. Unstable growth leading to the formation of mounds separated by a well-defined length scale is observed on all substrates. Contraty to previous high-temperature growth results, the presence of steps during deposition at $300^{\circ}C$ increases the tendency toward unstable growth resulting in a much earlier development of mound structures and larger surface roughnesses on vicival substrates. Strain-induced surface roughening was found to dominate in $Si_{0.7}Ge{0.3}$ alloys grown on singular Si(001) substrates at $T_S\ge450^{\circ}C$ where the coherent islands are prererentially bounded along <100> directions and eshibt {105} facetting. Increasing the film thickness above critical values for strain relaxation leads to island coalescence and surface smoothening. At very low growth temperatures ($T_s\le 250^{\circ}C$), film surfaces roughen kinetically, due to limited adatom diffusiviry, but at far lower rates than in the higher-temperature strain-induced regime. There is an intermediate growth temperature range, however, over which alloy film surfaces remain extremely smooth even at thicknesses near critical values for strain relaxation.

• 한국초전도ㆍ저온공학회논문지
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• 제6권2호
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• pp.7-10
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• 2004

A study regarding the epitaxial growth of single $Y_2O_3$ buffer layer on biaxially textured Ni and NiW substrates using pulsed laser deposition is presented. Different deposition conditions were employed and compared in order to obtain good epitaxial $Y_2O_3$ film, furthermore importantly, to obtain good YBCO superconducting films. Following YBCO film deposited by PLD on the top of $Y_2O_3$ films have a good structure and superconducting properties. The J$_{c}$ of YBCO films on $Y_2O_3$ /Ni and $Y_2O_3$ /NiW were $1.0{\times}10^6 A/cm^2 and 1.1\times}10^6 A/cm^2$<.TEX> at 77K and self-field respectively, which indicated that $Y_2O_3$ is a suitable candidate as a single buffer layer for the fabrication of YBCO coated conductor.r.

• 한국초전도저온공학회:학술대회논문집
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• 한국초전도저온공학회 2003년도 학술대회 논문집
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• pp.88-91
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• 2003

The crystal structure and properties of YBa$_2$Cu$_3$$O_{7-x}$(YBCO) and CeO$_2$ thin films deposited on r-plane (1(equation omitted)02) sapphire substrate by pulsed- laser deposition(PLD) have been investigated. C-axis oriented epitaxial YBCO thin films with critical temperature (Tc) of 88 K were routinely grown on (200) oriented CeO$_2$ buffer layers with thickness in the range between 20 to 80 nm. When the thickness of the (200)oriented CeO$_2$ buffer layer increases over than 80 nm, the superconducting properties of YBCO thin films on that were deteriorated. The decrease in Tc of YBCO thin films was explained by the microcrack formation in CeO$_2$ buffer layer. These results indicate that the thickness of the (200) oriented CeO$_2$ buffer layer is critical to the epitaxial YBCO thin nim growth on r-plane (1(equation omitted)02) sapphire substrate.e.

• 한국결정학회지
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• 제5권2호
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• pp.85-92
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• 1994

펄스 레이저 증착법을 이용하여 강유전체 Bi4T13012 박막을 laA109(001) 위에 성장시켰다. 넓은 영역의 온도에서 증착한 박막의 상 형성과 구조적 성질을 X선 회절법을 이용하여 조사하였다. 740℃에서 증착한 박막은 박막의 c-축이 기판에 수직한 형태의 에피 성장의 경향을 보인다. 펄스 레이저 증착법을 이용하여 Bi4Ti3O12/YBa2Cu3O7-x/LaAlO3 복합구조를 in-situ 성장시켰다. Yba2Cu3O7-x의 a-, b-축이 LaAlO3와 완벽하게 평행하게 배열되어 있지 않음에도 불구하고, Bi4Ti3012 박막은 에피 성장의 경향을 보인다.

• 한국진공학회지
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• 제5권3호
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• pp.206-212
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• 1996

저압MOCVD 방법을 이용하여 76 Torr에서 $In_{1-x}Ga_xAs$ 에피층을 성장하였다. 성장온도에 따른 성장속도의 변화는 크지 않았으며, 격자불일치와 성장온도, $AsH_3/(TMIn+TMGa)$ 비에 따라 표면형상이 변화하는 경향성을 관찰하였다. 깨끗한 byaus을 가지는 $In_{1-x}Ga_xAs$ 에피층의 5K PL 측정을 통하여 2.8meV 반가폭을 가지는 결정성이 좋은 에피가 성장되었음을 확인하였다. 성장온도에 따른 조성의 변화는 크지 않았으며, 고체상에서의 $In_{1-x}Ga_xAs$ 조성은 기체상에서의 원료가스의 확산단계에 의해 결정되었다. 격자불일치와 성장온도가 $In_{1-x}Ga_xAs$ 에피층의 전기적 특성을 결정하는 가장 중요한 변수로 확인되었고, 최적조건에서 성장한 에피층에 대해 상온에서 $8{\times}10^{14}/cm^3$의 전자농도와 11,000$\textrm{cm}^2$/V.sec 의 전자이동도를 얻었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
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• pp.73-76
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• 2001

We deposited epitaxial $Ba_{0.6}Sr_{0.4}TiO_{3}(BST)$ films having thickness of 400 nm on MgO(001) substrates, where a 10 nm thick $Ba_{1-x}Sr_{x}TiO_{3}$ (x = 0.1 - 0.7) interlayer was inserted between BST and MgO to manipulate the stress of the BST films. Since the main difference of those epitaxial BST films was the lattice constant of the interlayers, we were very successful in controlling the stress of the BST films. BST films under small tensile stress showed larger dielectric constant than that without stress as well as those under compressive stress. Stress relaxation was investigated using epitaxial BST films with various thicknesses grown on different interlayers. For BST films grown on $Ba_{0.7}Sr_{0.3}TiO_{3}$ interlayers, the critical thickness was about 600 nm. On the other hand, the critical thickness of single-layer BST film was less than 100 nm.

• Journal of Korean Vacuum Science & Technology
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• 제1권1호
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• pp.38-44
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• 1997

Epitaxial growth of SiC films on Si(111) substrates without carbonization was carried out n the temperature range of 900-100$0^{\circ}C$ under high vacuum conditions by single source chemical vapor deposition (CVD) of 1,3-disilabutane (H$_3$SiCH$_2$SiH$_2$$CH_3$). The monocrystalline nature of the films was confirmed by XRD, RHEED and cross-sectional TED. Cross-sectional TEM image indicated that no void exists and the boundary is clear and smooth at the SiC-Si(111) interface. RBS and AES analyses also showed that the films are stoichiometric and homogeneous in depth, From the results, this single source growth techniqe of using 1,3-disilabutane has been found suitable and effective for epitaxial growth of stoichiometric SiC on Si(111) without carbonization at temperatures below 100$0^{\circ}C$.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집
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• pp.73-76
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• 2001

We deposited epitaxial $Ba_{0.6}$S $r_{0.4}$Ti $O_3$(BST) films having thickness of 400 nm on MgO(001) substrates, where a 10 nm thick $Ba_{1-x}$S $r_{x}$Ti $O_3$(x=0.1-0.7) interlayer was inserted between BST and MgO to manipulate the stress of the BST films. Since the main difference of those epitaxial BST films was the lattice constant of the interlayers, we were very successful in controlling the stress of the BST films. BST films under small tensile stress showed larger dielectric constant than that without stress as well as those under compressive stress. Stress relaxation was investigated using epitaxial BST films with various thicknesses grown on different interlayers. For BST films grown on $Ba_{0.7}$S $r_{0.3}$Ti $O_3$ interlayers, the critical thickness was about 600 nm. On the other hand, the critical thickness of single-layer BST film was less than 100 nm.00 nm.m.m.m.