• Proceedings of the KSME Conference
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• 2007.05a
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• pp.527-531
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• 2007

The classical continuum theory-based thin film model is independent of their size and the surface effect can be ignored. But the surface to bulk ratio becomes very large in nano-size structures such as nano film, nano wire and nano beam. In this case, surface effect plays an important role and its contribution of the surface effect must be considered. Molecular dynamics simulation has been a conventional way to analyze these ultra-thin structures but structures in the range between submicro and micro are difficult to analyze by classical molecular dynamics due to the restriction of computing resources and time. Therefore, in present study, the continuum-based method is considered to predict the overall physical and mechanical properties of the structures in nano-scale, especially, for the thin-film. The proposed continuum based-thin plate finite element is efficient and reliable for the prediction of nano-scale film behavior.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 1994.10a
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• pp.288-294
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• 1994

A study of prediction and qualification techniques for structure borne booming noise is presented in this paper. Result from acoustic normal mode finite element analysis of a 1/2 size vehicle cavity sample model is compared to the that from an experiment. Coupled structural-acoustic analysis is performed on a 1/4 size vehicle cavity sample model surrounded by 2 mm thick normal steel plates. Interior noise levels around passensger's ear position are predicted and reduced by structural modification based on panel participation factor analysis about the sample cavity model. Futhermore, optimization technique in application of anti-vibration pad is studied.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2000.10a
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• pp.101-104
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• 2000

Milli-structure components are classified as component group whose size is between macro and micro scale. that is, about less than 20mm and larger than 1mm. The forming of these components has a typical phenomenon of bulk deformation with thin sheets because of the forming size. In order to conventional metal forming, where numerical process simulation is already idly applied, the micro-forming process is characterized by some scale effects which have to be considered in an advanced process simulation. milli-structure rectangular cup drawing is analyzed and designed using the finite element method and experiment. The result of the finite element analysis is confirmed by a series of experiment.

• Transactions of Materials Processing
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• v.10 no.7
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• pp.573-578
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• 2001

The flow stress of 304 stainless steel during hot forming process were determined by conducting hot compression tests at the range of 1273 K∼1423 K and 0.05 /s∼2.0 /s as these are typical temperature and strain rate in hot forging operation. In this material, Dynamic recrystallization was found to be the major softening mechanism with this conditions as Previous studies. Based on the observed phenomena, a constitutive model of flow stress was assumed as a function of strain, strain rate, temperature. In the constitutive model, the effects of strain hardening and dynamic recrystallization were taken into consideration. A finite element method connected to constitutive model was performed to predict the dynamic recrystallization behaviors and also stress-strain curves in hot compression of 304 stainless steel.

• Transactions of Materials Processing
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• v.10 no.6
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• pp.471-477
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• 2001

Milli-structure components are classified as a component group whose size is between macro and micro scales, that is, about smaller than 20mm and larger than 1mm. The forming of these components has a typical phenomenon of bulk deformation with thin sheets because of the forming size. In this study, milli-structure rectangular cup drawing is analyzed and measured using the finite element method and experiments. Special containers or cases of cellular phone vibrator to save installation space are produced by rectangular-shaped drawing. A systematic approach is established for the design and the experiment of the forming processes for rectangular milli-structure cases. To verify the simulation results, the experimental investigations were also carried out on a real industrial product. The numerical analysis by FEM shows good agreement with the experimental results in view of the deformation shape of the product.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.11
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• pp.1844-1853
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• 2001

In the present investigation, it was attempted to design the rolling pass schedule fur a clean steel of 0.1C-1.5Mn-0.25Si with the objective of the austenite grain refinement. As the method of approach, a coupled mathematical modeling technique was proposed which consists of a recrystallization model and a flow stress modes. The validity of the coupled model was examined through comparison with results of continuous and discontinuous compression tests at various temperatures, strains and strain rates. The coupled model was incorporated with the finite element method to set up a systematic design methodology far the rolling path schedule for austenite grain refinement. Two path schedules were obtained and discussed in the paper with regard to rolling path time, average grain size, grain size deviation in thickness, etc.

• Journal of the Korean Society for Precision Engineering
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• v.14 no.7
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• pp.116-125
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• 1997

An investigation was performed to study the impact damage in CFRP laminated composites subjected to impact loading. A finite element model has been developed for predicting the impact damage in laminated composite plates resulting from the ballistic impact. The finite element model was based on the higher-order shear deformation theory and was used to predict the initial intraply matrix cracking and the shape and size of interface delamination in laminated composites. Numerical simulation was performed and then the initiation of the matrix cracking and the shape and size of impacted induced delamination were predicted, and te results were compared with those of impact experiments with the same dimension and stacking sequences. A linear relationship holds between impact velocity and length and width of delamination. As impact velocity is increased, the increase of delamination length is highger than the increase of delamination width.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2003.04a
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• pp.504-512
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• 2003

Simulation programs have been developed and used as an attempt to improve the accuracy of Non-Destructive Evaluation(NDE) techniques. The applicability of these programs is very limited, however, because it is difficult to describe the delicacy of the propagation of stress waves. To investigate the applicability of the finite element analysis for stress wave-based NDE techniques numerical simulation for Impact-Echo method and SASW method is performed. The numerical studies are performed to determine the essential parameters such as contact time of impact load, mesh size and time step size. These studies show that the choice of parameter is very important for improving the accuracy and confidence of the numerical procedure and, thereby, the applicability of the numerical analysis for stress wave-based NDE techniques

• Journal of Power System Engineering
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• v.5 no.4
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• pp.11-17
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• 2001

Micronization of sensor is a trend of the silicon sensor development with regard to a piezoresistive silicon pressure sensor, the size of the pressure sensor diaphragm have become smaller year by year, and a microaccelerometer with a size less than $200{\sim}300{\mu}m$ has been realized, In this paper, we study some of the bonding processes of SCS(single crystal silicon) insulator wafer for the microaccelerometer. and their subsequent processes which might affect thermal loads. The finite element method(FEM) has been a standard numerical modeling technique extensively utilized in micro structural engineering discipline for design of SCS insulator wafers. Successful temperature distribution analysis and design of the SCS insulator wafers based on the tunneling current concept using microaccelerometer depend on the knowledge about normal mechanical properties of the SCS and $SiO_2$ layer and their control through manufacturing processes.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1999.03b
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• pp.249-252
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• 1999

A numerical analysis was perfomed to predict flow curves and dynamic recrystallization behaviors of Al-5%Mg alloy on the basis of results of hot compression tests. The hot compression tests were carried out in the ranges of 350-50$0^{\circ}C$ and 5$\times${{{{ {10 }^{-3 } }}}}~3$\times${{{{ {10 }^{0 } }}}}/sec to obtain the Zener-Hollmon parameter. In the modelling equation the effects os strain hardening and dynamic recrystallization were taken into consideration. A model for predicting the evolution of microstructure in Al-5%Mg alloy during thermomechanical processing was developed in terms of dynamic recrystallization phenomena, The microstructure model was combined with finite element modeling(FEM) to predict microstructure development Model predictions showed good agreement with microstructures obtained in compression tests.