Trend in Camera Module Technology for Mobile Phone

• Yoon, Young-Kwon
• • Proceedings of the International Microelectronics And Packaging Society Conference
  • /
  • 2006.10a
  • /
  • pp.1-20
  • /
  • 2006
• PDF

Lead-free Solders on the Electronics (전자부품에서의 무연솔더)

• 김미진;김문일;신규식;정재필
• • Journal of the Microelectronics and Packaging Society
  • /
  • v.7 no.4
  • /
  • pp.49-56
  • /
  • 2000
• PDF

Trend of Printed electronics Industry (신문고 - 인쇄전자산업 현황 및 제언)

• Go, Byeong-Cheon
• • The monthly packaging world
  • /
  • s.208
  • /
  • pp.42-44
  • /
  • 2010
• PDF

Offset Printing Technology and Printed Electronics (특집 - 옵셋 프린팅 기술과 인쇄전자)

• Chae, Ho-Cheol
• • The monthly packaging world
  • /
  • s.209
  • /
  • pp.44-52
  • /
  • 2010
• PDF

Flexo Printable Electronics Technology (특집 - 플렉소 인쇄전자기술)

• Jeong, Gi-Yeong
• • The monthly packaging world
  • /
  • s.209
  • /
  • pp.53-57
  • /
  • 2010
• PDF

Organic Semiconductor Ink and Printable Electronics Technology (특집 - 인쇄전자용 유기반도체 잉크 개발 및 응용)

• Im, Jong-Seon
• • The monthly packaging world
  • /
  • s.209
  • /
  • pp.64-77
  • /
  • 2010
• PDF

Recent Technology Trends in BGA and Flip Chip

• Lee, Young-Min
• • Proceedings of the International Microelectronics And Packaging Society Conference
  • /
  • 1999.05a
  • /
  • pp.54-69
  • /
  • 1999
• PDF

PCB Market and Technology Changes Driven by Mobile Phone (PCB의 최신 기술 동향)

• Lee Jinho
• • Proceedings of the International Microelectronics And Packaging Society Conference
  • /
  • 2003.04a
  • /
  • pp.21-37
  • /
  • 2003
• PDF

Printed Electronics and Industrialize Prospect (특집 - 인쇄 전자 사업화 전망과 인쇄 공정 신기술 개발 사례)

• Choe, Dong-Gwon
• • The monthly packaging world
  • /
  • s.216
  • /
  • pp.54-61
  • /
  • 2011
• PDF

Printed Electronics Ink (특집 - 인쇄전자의 발전과 기능성잉크의 역할)

• Mun, Seok-Yeong
• • The monthly packaging world
  • /
  • s.216
  • /
  • pp.45-53
  • /
  • 2011
• PDF

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