• 제목/요약/키워드: electronic boards

검색결과 119건 처리시간 0.024초

유기용매와 인산칼륨 용액을 이용한 폐 인쇄회로기판에서 비금속성분의 분리 (Separation of Non-Metallic Components in Waste Printed Circuit Boards (WPCBs) using Organic Solvent and Potassium Phosphate Solution)

  • 이재천;정진기;김종석
    • 공업화학
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    • 제23권4호
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    • pp.367-371
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    • 2012
  • 폐 인쇄회로기판(WPCBs)은 Cu, Ni, Au, Ag, Pd 등의 희귀금속을 함유하고 있다. 폐 전자제품의 양이 지속적으로 증가하므로, WPCBs에서 희귀금속을 회수하는 방법에 대한 연구가 필요하다. WPCBs에서 유리섬유 보강 에폭시수지로부터 금속과 유리섬유 및 에폭시 수지로 원재료로 분리하는 방법으로 화학적 재활용 방법은 어려운 방법으로 알려져 있다. 본 연구에서는 WPCBs에서 금속 및 비금속성분을 분리하는 화학적 방법으로 에폭시 수지의 해중합을 methylpyrrolidone와 dimethylformamide 용매에서 $K_3PO_4$ 촉매를 사용하였다. WPCBs의 반응온도를 $160{\sim}200^{\circ}C$범위에서 진행하였고 반응시간을 2~12 h하여 반응을 진행하였다. WPCBs의 반응 후 얻은 재생 유리섬유를 열중량분석기를 통해 분석하였으며 WPCBs에서 에폭시 수지의 용해도를 조사하였다.

AVR 기반 아두이노 호환 보드를 위한 통합 프로그래머 (Unified Programmer for AVR-Based Arduino-Compatible Boards)

  • 허경용;류대우
    • 한국정보통신학회논문지
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    • 제25권1호
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    • pp.96-101
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    • 2021
  • 아두이노는 오픈 소스 마이크로컨트롤러 프로젝트 중 하나로 AVR 마이크로컨트롤러를 사용한 아두이노 보드가 흔히 사용된다. AVR 마이크로컨트롤러에서는 일반적으로 ISP(In System Programming) 방식 업로드를 사용하지만, 아두이노에서는 부트로더를 통한 시리얼 방식 업로드를 기본으로 하며 이를 위해 전용 마이크로컨트롤러를 보드에 내장하고 있다. 아두이노에서 ISP 방식 업로드를 사용하기 위해서는 별도의 전용 업로드 장치가 필요하지만, 아두이노 보드에는 포함되어 있지 않다. 이 논문에서는 ISP 방식 업로드와 시리얼 방식 업로드를 하나의 전용 마이크로컨트 롤러를 통해 처리할 수 있는 통합 프로그래머를 제안하고, 통합 프로그래머를 사용하여 ISP 방식과 시리얼 방식 업로드가 가능함을 보인다. 이외에도 제안하는 통합 프로그래머는 USB-시리얼 변환장치로 동작하여 컴퓨터와의 시리얼 통신을 지원하며 아두이노의 부트로더를 굽는 것도 가능하다. 통합 프로그래머의 모든 동작은 실험 결과를 통해 확인할 수 있다.

두개의 브랜치 라인을 갖는 와이파이 이동통신용 이중 대역 모노폴 안테나의 설계와 제작 (Design and Fabrication of Dual-band Compact Monopole Antenna with Two Branches for Wi-Fi Mobile Applications)

  • 정계택;주영림;윤중한
    • 한국전자통신학회논문지
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    • 제8권1호
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    • pp.41-47
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    • 2013
  • 본 논문에서는 두개의 브랜치 라인을 갖는 와이파이 이동통신용 이중 대역 모노폴 안테나를 설계 및 제작하였다. 제안된 안테나는 평면형 모노폴 설계를 기본으로 두 개의 브랜치 방사 선로를 구성함으로서 이중대역 특성을 갖도록 설계하였다. 제안된 안테나의 접지면 크기는 전형적인 셀룰라 ㅋ폰의 접지면에 적합하게 설계하여 이동통신용 단말기의 PCB와 호환될 수 있도록 하였다. 제안된 안테나는 최적화된 파라메타을 얻기 위해 상용 툴(CST)을 사용하여 시뮬레이션 하였으며 얻어진 최적화된 수치를 이용하여 제안된 안테나를 제작하였다. 제작된 안테나는 와이파이 이동통신의 동작하는 상위 주파수 대역과 하위 주파수 대역에서 반사손실, 이득, 방사패턴의 특성을 측정하였다.

고온초전도 SQUID 신호 검출을 위한 3채널용 FLL 회로 (Integrated 3-Channel Flux-Locked-Loop Electronics for the Readout of High-$T_c$ SQUID)

  • 김진목;김인선;유권규;박용기
    • Progress in Superconductivity
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    • 제5권1호
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    • pp.55-60
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    • 2003
  • We designed and constructed integrated 3-channel flux-locked-loop (FLL) electronic system for the control and readout of high-T$_{c}$ SQUIDs. This system consists of low noise preamplifiers, integrators, interface circuits, and software. FLL operation was carried out with biased signals of 19 KHz modulated current and 150 KHz modulated flux, which are reconstructed as detected signals by preamplifier and demodulator. Computer controlled interface circuits regulate FLL circuit and adjust SQUID parameters to the optimum operating condition. The software regulates interface circuits to make an auto-tuning for the control of SQUIDs, and displays readout data from FLL circuit. 3-channel SQUID electronic system was assembled with 3 FLL-interface circuit boards and a power supply board in the aluminum case of 56 mm ${\times}$ 53 mm${\times}$ 150 mm. Overall noise of the system was around 150 fT/(equation omitted)Hz when measured in the shielded room, 200 fT/(equation omitted)Hz in a weakly shielded room, respectively.y.

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유공압 부품이 내장된 인쇄회로기판을 활용한 내시경 수술용 기복기의 개발 (Development of the Insufflator for Endoscopic Surgery using the Fluidic System in Printed Circuit Board)

  • 이희남;김인영;지영준
    • 대한의용생체공학회:의공학회지
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    • 제32권1호
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    • pp.32-36
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    • 2011
  • The insufflators in endoscopic surgery supply carbon dioxide to make the air-filled cavity in the abdomen. It contains many kinds of pneumatic and electronic parts and they are connected with the air tubes and electrical wires. The printed circuit boards (PCB) perform wiring, holding and cooling tasks in electronic systems. In this study, the PCB is used as the air channel for insufflators to decrease the cost, volume, and the malfunction according to aging of the device. Three layers of PCB made of FR4 are combined with prepreg as adhesive which has the internal airway channel according to the design. By mounting the pressure sensors and valves, the PCB based fluidic system is implemented. After calibration of flow sensor, the flow rate of the gas also can be measured. The climate test, temperature test, and biocompatibility test showed this idea can be used in insufflators for laparoscopic surgery.

무전해 니켈 도금액 제조와 복합제에 따른 도금 특성 (Preparation of nickel Plating solution and the characteristics of deposition with complexents)

  • 정승준;박종은;손원근;박수길
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1999년도 추계학술대회 논문집 학회본부 C
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    • pp.909-911
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    • 1999
  • Metalization technology of the fine patterns by electroless plating is required in place of electrodeposition as high-density printed circuit boards (PCB) become indispensable with the miniaturization of electronic components. Electroless nickel plating is a suitable diffusion barrier between conductor metals, such as Al and Cu, and solder is essetional in electronic packaging in order to sustain a long period of service. Moreover, Electroless nickel has particular characteristics including non-magnetic property, amorphous structure, wear resistance, corrosion protection and thermal stability. In this study fundamental aspects of electroless nickel deposition were studied with effect of complexeing agents of different kinds. Then, the property of electroless deposit are controlled by the composition of the deposition solution, the deposition condition such as temperature and pH value and so on. the characteristics of the deposits has been carried out.

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차량 내 네트워크 선정에 따른 ESC 성능 분석을 위한 ECU-In-the-Loop 시뮬레이션 (ECU-In-the-Loop Simulation for ESC Performance Analysis on the Selection of In-vehicle Networks)

  • 양승문;김성엽;기영훈;안현식
    • 한국자동차공학회논문집
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    • 제21권5호
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    • pp.87-96
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    • 2013
  • This paper shows how the performance of an ESC(Electronic Stability Control) system can be affected by the selection of in-vehicle network protocols such as CAN or FlexRay. The vehicle control performance under ESC operation is analyzed by EILS(ECU-In-the-Loop Simulation). The experimental set-up for the EILS of the ESC system consists of two 32-bit microcontroller boards communicated with CAN or FlexRay protocols. A 7-DOF vehicle model and an ESC algorithm with 2-DOF reference vehicle model are implemented on each microcontroller respectively. It is shown by experimental results that the ESC system using the FlexRay protocol can achieve better performance than that using the CAN protocol for a fast and accurate lane changing.

집속 아르곤 이온 레이저 빔을 이용한 레이저 유도 직접 구리 패터닝 (Laser-Induced Direct Copper Patterning Using Focused $Ar^+$ Laser Beam)

  • 이홍규;이경철;안민영;이천
    • 한국전기전자재료학회논문지
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    • 제13권11호
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    • pp.969-975
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    • 2000
  • Laser direct writing of micro-patterned copper lines has been achieved by pyrolytic decomposition of copper formate films (Cu(HCOO)$_2$.4$H_2O$), as a metallo-organic precursor, using a focused CW Ar$^{+}$ laser beam (λ=514nm) on PCB boards and glass substrates. The linewidth and thickness of the lines wee investigated as a functin of laser power and scan speed. The profiles of the lines were measured by scanning electron microscope (SEM), surface profiler ($\alpha$-step) and atomic force measured by scanning electron microscope (SEM), surface profiler ($\alpha$-step) and atomic force microscopy (AFM). The electrical resistivities of the patterned lines were also investigated as a function of laser parameters using probe station and semiconductor analyzer. We compared resistivities of the patterned copper lines with these of the Cu bulk. Resistivities decreased due to changes in morphology and porosity of the deposit, which were about 3.8 $\mu$$\Omega$cm and 12$\mu$$\Omega$cm on PCB and glass substrates after annealing at 30$0^{\circ}C$ for 5 minutes.s.

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임베디드 커패시터용 세라믹(BaTiO3)-고분자(에폭시) 필름의 세라믹 분말 형상 및 함량에 따른 전기적 특성 (Effect of Ceramic Powder Content and Shape on the Electrical Properties of Ceramic(BaTiO3)-polymer(Epoxy) Composite for Embedded Capacitors)

  • 한정우;윤중락;제해준;이동호;이경민
    • 한국전기전자재료학회논문지
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    • 제22권6호
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    • pp.495-500
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    • 2009
  • The ceramic($BaTiO_3$)-polymer(epoxy) composites have been widely investigated as dielectric materials for embedded capacitors in printed circuit boards (PCBs). The dielectric properties of $BaTiO_3$/epoxy composites prepared using the agglomerated $BaTiO_3$ particles were investigated in the present study. The dielectric constants of the composites prepared using the agglomerated $BaTiO_3$ particles were about 2 times higher than those of the composites with the dispersed $BaTiO_3$ particles. The insulation resistance of the composites prepared using the agglomerated $BaTiO_3$ particles were lower than those of the composites with dispersed $BaTiO_3$ particles. As a result, there is tradeoff between high dielectric constant and insulation resistance in the $BaTiO_3$/epoxy composites. So it is important to select proper agglomerated or dispersed $BaTiO_3$ particles in accordance with needs.

A Study on the Deposit Uniformity and Profile of Cu Electroplated in Miniaturized, Laboratory-Scale Through Mask Plating Cell for Printed Circuit Board (PCBs) Fabrication

  • Cho, Sung Ki;Kim, Jae Jeong
    • Korean Chemical Engineering Research
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    • 제54권1호
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    • pp.108-113
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    • 2016
  • A miniaturized lab-scale Cu plating cell for the metallization of electronic devices was fabricated and its deposit uniformity and profile were investigated. The plating cell was composed of a polypropylene bath, an electrolyte ejection nozzle which is connected to a circulation pump. In deposit uniformity evaluation, thicker deposit was found on the bottom and sides of substrate, indicating the spatial variation of deposit thickness was governed by the tertiary current distribution which is related to $Cu^{2+}$ transport. The surface morphology of Cu deposit inside photo-resist pattern was controlled by organic additives in the electrolyte as it led to the flatter top surface compared to convex surface which was observed in the deposit grown without organic additives.