• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2008.03a
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• pp.427-430
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• 2008

Electroforming is one of the key technologies for the regenerative thrust chamber of the rocket engine. To use nickel electroforming method for the thrust chamber, direct electroforming of nickel on cupper and the welding method between different materials are needed. Minimizing the internal stress is one of the important factor for making thick electroforming,. Also minimizing contamination(ex. Sulfur containing compound) is another important factor for the stability of quality. This paper includes advanced methods for thick nickel electroforming, those of strength test results and EDS/EPMA inspection results. Advanced for electroforming process makes the achievement of Electro-beam welding between Inconel718(Manifold) and Nickel Electroforming. This paper also includes the influence of the electroforming precipitation angle on strength. Thus advanced electroforming improvement processes and the test results make achievement for manufacturing of the regenerative thrust chamber with direct nickel thick electroforming on cupper materials.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.1
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• pp.15-20
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• 2015

I developed a high-quality metal door with a hologram-pattern design using a high-speed electroforming process. In this study, the major processes were master production, conducting grant, nickel-sulfamate acid electroforming, ablation treatment, and final dressing. The processing system was provided with a nickel sulfamate pole, and a rotary-pole PP-plating jig in a circular tank. This approach could reduce defects and errors, as much as possible, by its use of a hologram pattern to create the master of a metal door. The thin-sheet metal-creation process for the door built-in metal pattern using electroforming with hologram was successful.

• Transactions of Materials Processing
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• v.13 no.3
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• pp.279-284
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• 2004

Electroforming is the highly specialized use of electrodeposition for the manufacture of metal parts and basically a specialized form of electroplating. So, we can apply electrochemical system analysis for electroforming process. Electrochemical systems are concerned with the interplay between electricity and chemistry, namely the measurements of electrical quantities, such as current density, potential, and charge, and their relationship to chemical parameters. This paper based on the basic equations of electrics and electrochemical kinetics, was employed for a theoretical explanation of the current density distribution on electroforming process. We calculated current density distribution and potential distribution on cathode. Also, calculated current density distribution of vertical direction. It was shown that current density is related with distance of between anode and cathode and mass transfer process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.537-538
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• 2012

• Journal of Internet of Things and Convergence
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• v.9 no.3
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• pp.61-67
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• 2023

In order to optimize the pulse electroforming copper process, a double hidden layer BP (Back Propagation) neural network is constructed. Through sample training, the mapping relationship between electroforming copper process conditions and target properties is accurately established, and the prediction of microhardness and tensile strength of the electroforming layer in the pulse electroforming copper process is realized. The predicted results are verified by electrodeposition copper test in copper pyrophosphate solution system with pulse power supply. The results show that the microhardness and tensile strength of copper layer predicted by "3-4-3-2" structure double hidden layer neural network are very close to the experimental values, and the relative error is less than 2.32%. In the parameter range, the microhardness of copper layer is between 100.3~205.6MPa and the tensile strength is between 112~485MPa.When the microhardness and tensile strength are optimal,the corresponding process conditions are as follows: current density is 2A-dm-2, pulse frequency is 2KHz and pulse duty cycle is 10%.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.581-582
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• 2008

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2006.05a
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• pp.314-317
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• 2006

Electroformed part is widely used in modem manufacturing industries, especially semi-conductor division. It is basically a specialized form of electroplating. So, it has very similar parameters with electroplating. The object of this study is development of the fine metal mask by electroforming process. In this paper considered two parameters. The first is relationship of UV exposure and soft baking time. The other one is thickness uniformity of electroformed parts by distance of between electrodes. This paper presents the fabrication method of fine metal mask by electroforming process.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.449-453
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• 2005

Electrochemical systems find widespread technical application. Industrial electrolytic process include electroplating, electroforming, and electropolishing. Electroforming and electroplating is widely used in the manufacture of metal parts. This paper based on the basic equations of electrics and electrochemical kinetics, was employed for a theoretical explanation of the current density distribution on electroforming process. We calculated current density distribution and potential distribution on cathode. Also, calculated current density distribution of vertical direction. It was shown that current density is related with distance of between anode and cathode and mass transfer process. And make an experiment on its relation and electroformed thickness. It shows that it is useful method using FEM with multi-physics to estimate electroformed thickness.

• Transactions of Materials Processing
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• v.20 no.2
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• pp.93-98
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• 2011

Electroforming is a kind of metal molding technology. After gilding on the possession object(conductivity, nonconductivity) separate it with possession object and produce a part or duplicate. This process has an excellent ability of duplicating detailed figure. To simplify the manufacturing process of a rotary screen, this study was adopted electroforming technology and produced silicon rubber mandrel. Furthermore, to indicate the optimal condition for the acquisition of high-qualified rotary screen product, the experiment was executed with pH, time, sulfamate nickel solution according to density which were the main factors to decide the condition, then compared it with the product made by original "S" company in Holland. As a result, the figure of hole was more obvious and correct. Also the open size increased by more than 2-3%.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2002.05a
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• pp.94-97
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• 2002

Micromolding methods are most suitable for mass production of plastic microlens and lens array with low cost. Among the procedures related with micromolding of microlens array, fabrication of mold insect which contains micro cavity of lens shape is the most important stage. In this study, nickel mold inserts for 45 $\mu\textrm{m}$ and 95 $\mu\textrm{m}$ diameters lens way were fabricated using electroforming process. The mother for metal mold inset was made using reflow method. A micro compression molding with polymer powders was used to test the qualities of the metal mold insets. Micro lens profile and surface roughness was measured by interferometric technique and AFM, respectively. The final molded lens replicated the mother well, and had good surface quality.