• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1990.10a
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• pp.39-44
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• 1990

Polycrystalline CdS films were grown on glass substrate with conducting indium tin oxide(ITO) by electrodeposition. The average size of the plate-shape grains o the CdS films was from 0.3um to 0.05um, and the adhesion to ITO was excellent. The optical band gap of the electrodeposited CdS films was in the range from 2.51eV to 2.68 eV. The optical transmittance was 80% and the electrical resistivity varied from 10$^3$ to 10$\^$5/$\Omega$-cm depending on the deposition condition.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.156-157
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• 2011

고경도 Ni-Co 합금 도금액 개발을 위하여 Ni과 Co의 함량 조성비와 전류밀도에 따라 전기도금을 실시하였다. Ni과 Co의 함량비는 Ni의 농도를 일정하게 유지시키고 Co의 농도를 10~30g/${\ell}$로 하여 실험을 하였다. Ni과 Co의 함량 조성비에 따른 합금 도금층의 성분을 EDS를 이용하여 분석하였고 전류밀도별 표면형상을 FE-SEM을 이용하여 분석하였다. 그리고 도금층의 성분에 따른 경도값을 비커스 경도계를 이용하여 분석하였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.133-134
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• 2011

전기도금을 이용하여 $TiO_2$ 입자들을 니켈 도금층에 넣은 Ni-$TiO_2$ 복합체를 만들때 pH, 전류형태에 따른 열적안정성에 대한 영향을 평가하였다. pH 범위는 1, 2, 3.4 였으며, 전류형태는 직류, duty cycle 50%의 펄스를 사용하였다. pH가 낮으면 도금속도는 낮아졌으나 $TiO_2$의 부피분율은 증가하였고, 펄스를 이용하면 도금속도는 증가하였으나 $TiO_2$ 부피분율은 감소하였다. 경도는 pH가 낮으면 상온에서는 낮았으나 고온에서는 상대적으로 경도값이 높았다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.05a
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• pp.55-55
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• 2015

오늘날 전해동박은 리튬이온전지의 집전체, PCB, FPCB등의 핵심부품으로써, 산업 전반에 걸쳐 널리 사용되고 있다. 그러나 전자 회로의 미세화로 인한 열 발생, 낮은 강도에 의한 신뢰성 하락 등이 문제가 되고 있는 실정이다. 구리에 나노 쌍정을 높은 밀도로 형성하게 되면, 전기 저항의 변화 없이 기계적 강도를 높이는데 도움이 된다. 특히 펄스 전해증착에서는 높은 전류밀도가 인가되기 때문에 고밀도의 나노쌍정을 얻을 수 있다는 점이 여러 논문에서 보고되었다. 이번 연구에서는 펄스도금 조건에서 온도 조건의 변화를 통해 강도가 향상됨을 알 수 있었다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.05a
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• pp.57-57
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• 2015

전해동박(Electrodeposited Copper Foil)은 전기도금 공정으로 제조되는 얇은 구리 포일로서, 주로 TV, PC, 스마트폰 등 전자제품의 인쇄회로기판에서 전기신호를 전달하는 회로소재로 사용이 되며, 최근에는 모바일 IT, 전기자동차, 지능형 로봇, 그린 에너지 산업 등에서 필수적으로 적용되는 소재로 이용이 급증하고 있는 핵심소재이다. FPCB/PCB용 전해동박은 최근 휴대폰, PC와 더불어 전 세계적으로 열풍이 불고 있는 스마트폰, 태블릿 등의 최신 전자 모바일기기의 보급이 가속화됨에 따라 해당 제품들의 다기능화, 고집적화가 진행되고 있으며, 5G 이후의 Mobile 기기를 중심으로 하는 차세대 전자기기의 소재 분야의 선점을 위해서 광폭(600 mm 이상) 제품 제조가 가능한 전해 동박으로 다양한 표면처리의 $18{\sim}2{\mu}m$ 급의 얇은 두께를 갖는 경제성이 확보된 고특성 동박이 필요로 되는 상황이다. 이와 더불어 PCB/FPCB에서 요구하는 동박기술의 소개 및 현재 연구 개발 Trend를 소개하고자 한다.

• Journal of Surface Science and Engineering
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• v.32 no.3
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• pp.372-376
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• 1999

The deposited Cu film on the ferrite magnet was more deposited comparing with that on the plastic magnet. The Cu film became thicker on the S pole comparing with that on the N pole in the both of magnets. The thickness and texture coefficient of deposited copper film affected with direction of line of magnetic force. The difference of pole had little or no effect to the texture coefficient of deposited nickel film. The reaction rate on ferrite magnet and S pole was faster comparing with that on plastic magnet and N pole.

• Journal of Surface Science and Engineering
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• v.30 no.2
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• pp.128-135
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• 1997

The effect of the polyethyledglycol(PEG) on the surface morphology and crystal orientation of electrodeposited zinc from a chloride (1.5M Zinc+7.0M chloriode) have been studied by means of electrochemical methodes, scanning electron microscopy, surface appearance measurement and X-ray diffraction patterns. The resistance of electrodeposit increased, whereas the evolution of hydrogen decreased with incrasing of molecular weight of the PEG. Large grains of electrodeposit were obtained from bath in the absence of organid additive. When the PEG was added, fine grained crystals were observed and the surface roughness was relatively small, but surface appearance deteriorated. The preferred orientation with a(101) plane parallel to the surface was obtained from the PEG addited bath.

• Journal of Surface Science and Engineering
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• v.32 no.3
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• pp.244-248
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• 1999

Photoelectrodeposition of copper on semiconductive B-doped diamond films was investigated. There are cleasr morphology differences between photodeposited copper and electrodeposited copper. Photoelecrodeposition proceeded as uniform 2-dimensional growth. On the other hand electrodeposition proceeded as scarce random deposition. By applying this effect we have succeeded in forming a conductive pattern on semiconductive B-doped diamond with the aid of a photo-mask. And it was suggested that the surface reforming caused by photoelectrochemical process could be easily detected by the following metal (copper) deosition method, which is demonstrated as 'Diamond photographic phenomenon'.

• Journal of Surface Science and Engineering
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• v.18 no.3
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• pp.95-104
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• 1985

A study has been made of preferred orientation, crose sectional microstructure, surface morphology and mechanical properties of copper foils fabricated by electrodeposition on 304 stainless steel plate from copper sulfate baths for high speed plating. The preferred orientation of the copper foils changed from the [110] to the [111] to ture with decreasing bath temperature and increasing cathode current density. The foils with the [110] texture had the field oriented texture type structure and the surface of many asperities grooved approximately perpendicular to the subtrate. A specimen with the [111]+[311] texture had the lower strength than one with the [10] texture, if they were obtained under similar electrolysis conditions.

• Journal of Surface Science and Engineering
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• v.16 no.4
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• pp.173-187
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• 1983

Zinc was electrodeposited at temperature from 20$^{\circ}C$ to 60$^{\circ}C$ over the ranges of the current density from 2 to 20 A/dm2 in acid chloride bath. The cathode overpotentials increased with increasing current density and decreasing tem-perature. The (10$.$3)-(10$.$2) preferred orientation developed at cathode overpotentials below about 450mV, the (10$.$3)(10$.$2)-(10$.$1) texture developed at overpotentials between 500mV and 950mV, and the (00$.$1) (10$.$3) texture developed at cathode overpotentials about 1000mV. The (00$.$1) (10$.$3) preferred orientation was also formed at the lower potentials between 400mV and 850mV at temperatures above 40$^{\circ}C$. The preferred orientations of the zinc deposits was discussed was discussed with both cathode overpo-tential and surface energy of deposit lattice planes. The pyramid type of structure with macrostep developed at low cathode overpotentials and the truncated pyramidal type developed at higher overpotenial.