• Title/Summary/Keyword: electrochemical deposition

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Electrochemical Performance of High-Voltage Lithium-Ion Batteries with NCM Cathode Varying the Thickness of Coating Layer by Atomic Layer Deposition (Atomic Layer Deposition의 두께 변화에 따른 NCM 양극에서의 고전압 리튬 이온 전지의 전기화학적 특성 평가)

  • Im, Jinsol;Ahn, Jinhyeok;Kim, Jungmin;Sung, Shi-Joon;Cho, Kuk Young
    • Journal of the Korean Electrochemical Society
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    • v.22 no.2
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    • pp.60-68
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    • 2019
  • High-voltage operation of the lithium ion battery is one of the advantageous approaches to obtain high energy capacity without changing the conventional cell components and structure. However, operating at harsh condition inevitably results in severe side reactions at the electrode surface and structural disintegration of active material particles. Herein we coated layers composed of $Al_2O_3$ and ZnO on the electrode based on NCM using atomic layer deposition (ALD). Thicker layers of novel Al-doped ZnO (AZO) coating compared to conventional ALD coated layers are prepared. Cathode based on NCM with the varying AZO coating thickness are fabricated and used for coin cell assembly. Effect of ALD coating thickness on the charge-discharge cycle behavior obtained at high-voltage operation was investigated.

A Study on the Cobalt Electrodeposition of High Aspect Ratio Through-Silicon-Via (TSV) with Single Additive (단일 첨가제를 이용한 고종횡비 TSV의 코발트 전해증착에 관한 연구)

  • Kim, Yu-Jeong;Lee, Jin-Hyeon;Park, Gi-Mun;Yu, Bong-Yeong
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2018.06a
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    • pp.140-140
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    • 2018
  • The 3D interconnect technologies have been appeared, as the density of Integrated Circuit (IC) devices increases. Through Silicon Via (TSV) process is an important technology in the 3D interconnect technologies. And the process is used to form a vertically electrical connection through silicon dies. This TSV process has some advantages that short length of interconnection, high interconnection density, low electrical resistance, and low power consumption. Because of these advantages, TSVs could improve the device performance higher. The fabrication process of TSV has several steps such as TSV etching, insulator deposition, seed layer deposition, metallization, planarization, and assembly. Among them, TSV metallization (i.e. TSV filling) was core process in the fabrication process of TSV because TSV metallization determines the performance and reliability of the TSV interconnect. TSVs were commonly filled with metals by using the simple electrochemical deposition method. However, since the aspect ratio of TSVs was become a higher, it was easy to occur voids and copper filling of TSVs became more difficult. Using some additives like an accelerator, suppressor and leveler for the void-free filling of TSVs, deposition rate of bottom could be fast whereas deposition of side walls could be inhibited. The suppressor was adsorbed surface of via easily because of its higher molecular weight than the accelerator. However, for high aspect ratio TSV fillers, the growth of the top of via can be accelerated because the suppressor is replaced by an accelerator. The substitution of the accelerator and the suppressor caused the side wall growth and defect generation. The suppressor was used as Single additive electrodeposition of TSV to overcome the constraints. At the electrochemical deposition of high aspect ratio of TSVs, the suppressor as single additive could effectively suppress the growth of the top surface and the void-free bottom-up filling became possible. Generally, copper was used to fill TSVs since its low resistivity could reduce the RC delay of the interconnection. However, because of the large Coefficients of Thermal Expansion (CTE) mismatch between silicon and copper, stress was induced to the silicon around the TSVs at the annealing process. The Keep Out Zone (KOZ), the stressed area in the silicon, could affect carrier mobility and could cause degradation of the device performance. Cobalt can be used as an alternative material because the CTE of cobalt was lower than that of copper. Therefore, using cobalt could reduce KOZ and improve device performance. In this study, high-aspect ratio TSVs were filled with cobalt using the electrochemical deposition. And the filling performance was enhanced by using the suppressor as single additive. Electrochemical analysis explains the effect of suppressor in the cobalt filling bath and the effect of filling behavior at condition such as current type was investigated.

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Electrochemical Properties of Additive-Free Nanostructured Cobalt Oxide (CoO) Lithium Ion Battery Electrode (첨가제 없이 제작된 나노구조 코발트 산화물 리튬이온 배터리 전극의 전기 화학적 특성)

  • Kim, Juyun;Park, Byoungnam
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.31 no.5
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    • pp.335-340
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    • 2018
  • Transition metal oxide materials have attracted widespread attention as Li-ion battery electrode materials owing to their high theoretical capacity and good Li storage capability, in addition to various nanostructured materials. Here, we fabricated a CoO Li-ion battery in which Co nanoparticles (NPs) are deposited into a current collector through electrophoretic deposition (EPD) without binding and conductive agents, enabling us to focus on the intrinsic electrochemical properties of CoO during the conversion reaction. Through optimized Co NP synthesis and electrophoretic deposition (EPD), CoO Li-ion battery with 630 mAh/g was fabricated with high cycle stability, which can potentially be used as a test platform for a fundamental understanding of conversion reaction.

CdSe-sensitized Photoelectrochemical Solar Cell Prepared by Spray Pyrolysis Deposition Method

  • Im, Sang-Hyuk;Lee, Yong-Hui;Seok, Sang-Il
    • Journal of the Korean Electrochemical Society
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    • v.14 no.2
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    • pp.104-109
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    • 2011
  • We fabricated CdSe-sensitized photoelectrochemical solar cell by depositing CdSe nanoparticles on nanoporous $TiO_2$ (np-$TiO_2$) via spray pyrolysis deposition method. By adjusting the amount of CdSe-sensitizer deposited on np-$TiO_2$, we can fabricate an efficient CdSe-sensitized solar cell (${\eta}$ = 3.0% under 1 sun irradiation) in polysulfide liquid electrolyte.

Synthesis and Characterization of Graphene Counter Electrode By Electrophoretic Deposition for Dye-Sensitized Solar Cells

  • Choe, Yun-Su;Gong, Jae-Seok;Choe, Hyeon-Gwang;Jeon, Min-Hyeon
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.160-160
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    • 2013
  • Dye-sensitized solar cells (DSSCs) have attracted much attention because of their moderate light-to-electricity conversion efficiency, easy fabrication, and low cost. At present, platinum (Pt) is used as a counter electrode in DSSCs. However, it is found that Pt dissolves in iodide electrolyte solutions and creates chemical compound such as PtI4 and H2PtI6. Carbon based materials are one of candidates for a counter electrode of DSSCs. We prepare two types of graphite oxides by different chemical treatments; original graphite oxide, hydrazine treated graphite oxide. Each graphite oxide and magnesium nitrate dispersed in deionized water are prepared as solutions for electrophoretic deposition (EPD). Each graphite oxide electrode is deposited on fluorine-doped tin oxide (FTO) substrate by EPD method. Structural and electrochemical properties of each electrode are investigated by field-emission scanning electron microscopy and electrochemical impedance spectroscopy, respectively.

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A Study on Electroless Ni-B Plating with DMAB as Reducing Agent. I. The Electrochemical Behavior of Precipitation Reaction on Austenite Stainless Steel Substrates (DMAB를 사용한 무전해 Ni-B 합금 도금 I. 오스테나이트 스텐레스강 상의 석출반응에 대한 전기화학적 거동)

  • 이창래;박해덕;강성군
    • Journal of the Korean institute of surface engineering
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    • v.32 no.2
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    • pp.172-181
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    • 1999
  • The effect of the DMAB concentration, temperature, deposition time, and stabilizer concentration on the precipitation reaction of the electroless nickel plating using dimethylamine borane (DMAB) as reducing agent was investigated to by the weight gain and electrochemical method. The deposition rate was dependent with DMAB concentration. The polarization resistance of the precipitation reaction was reduced with DMAB concentration. The precipitation reaction rate of Ni-B deposits was controlled by the oxidation rate of DMAB as the source of electron. The boron content of the deposit was constant at about 5.5wt%, even when DMAB concentration in the solution was increased. The effect of temperature and stabilizer ($Pb(NO_3)_2$) concentration on deposition rate was shown to have co-dependent behaviors.

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Electrochemical Characteristics of Zn and Si Ion-doped HA Films on Ti-6Al-4V by PEO Treatment

  • Lim, Sang-Gyu;Hwang, In-Jo;Choe, Han-Cheol
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2016.11a
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    • pp.199-199
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    • 2016
  • Commercially pure titanium (cp-Ti) and Ti alloys (typically Ti-6Al-4V) display excellent corrosion resistance and biocompatibility. Although the chemical composition and topography are considered important, the mechanical properties of the material and the loading conditions in the host have, conventionally. Ti and its alloys are not bioactive. Therefore, they do not chemically bond to the bone, whereas they physically bond with bone tissue. The electrochemical deposition process provides an effective surface for biocompatibility because large surface area can be served to cell proliferation. Electrochemical deposition method is an attractive technique for the deposition of hydroxyapatite (HAp). However, the adhesions of these coatings to the Ti surface needs to be improved for clinical used. Plasma electrolyte oxidation (PEO) enables control in the chemical com position, porous structure, and thickness of the $TiO_2$ layer on Ti surface. In addition, previous studies h ave concluded that the presence of $Ca^{+2}$ and ${PO_4}^{3-}$ ion coating on porous $TiO_2$ surface induced adhesion strength between HAp and Ti surface during electrochemical deposition. Silicon (Si) in particular has been found to be essential for normal bone and cartilage growth and development. Zinc (Zn) plays very important roles in bone formation and immune system regulation, and is also the most abundant trace element in bone. The objective of this work was to study electrochemical characteristcs of Zn and Si coating on Ti-6Al-4V by PEO treatment. The coating process involves two steps: 1) formation of porous $TiO_2$ on Ti-6Al-4V at high potential. A pulsed DC power supply was employed. 2) Electrochemical tests were carried out using potentiodynamic and AC impedance methoeds. The morphology, the chemical composition, and the micro-structure an alysis of the sample were examined using FE-SEM, EDS, and XRD. The enhancements of the HAp forming ability arise from $Si/Zn-TiO_2$ surface, which has formed the reduction of the Si/Zn ions. The promising results successfully demonstrate the immense potential of $Si/Zn-TiO_2$ coatings in dental and biomaterials applications.

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EFFECTS OF SURFACE ROUGHNESS AND MULTILAYER COATING ON THE CORROSION RESISTANCE OF Ti-6Al-4V ALLOY

  • Ko, Yeong-Mu;Choe, Han-Cheol
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2003.10a
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    • pp.134-135
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    • 2003
  • The dental implant materials required good mechanical properties, such as fatigue strength, combined with a high resistance to corrosion. For increasing fatigue resistance and delaying onset of stress corrosion cracking, shot peening has been used for > 50 years to extend service life of metal components. However, there is no information on the electrochemical behavior of shot peened and hydroxyapatite(HA) coated Ti-6Al-4V alloys. To increase fatigue strength, good corrosion resistance, and biocompatibility, the electrochemical characteristics of Ti/TiN/HA coated and shot peened Ti-6Al-4V alloys by electron beam physical vapor deposition(EB-PVD) have been researched by various electrochemical method in 0.9%NaCl. Ti-6Al-4V alloys were prepared under the condition of hydrogen and vacuum arc furnace. The produced materials were quenched at 1000$^{\circ}C$ under high purity dried Ar atmosphere and were hold at 500$^{\circ}C$ for 2 hrs to achieve the fatigue strength(1140㎫) of materials. Ti-6Al-4V alloys were prepared under the condition of hydrogen and vacuum arc furnace. Shot peening(SP) and sand blasting treatment was carried out for 1, 5, and 10min. On the surface of Ti-6Al-4V alloys using the steel balls of 0.5mm and alumina sand of 40$\mu\textrm{m}$ size. Ti/TiN/HA multilayer coatings were carried out by using electron-beam deposition method(EB-PVD) as shown Fig. 1. Bulk Ti, powder TiN and hydroxyapatite were used as the source of the deposition materials. Electrons were accelerated by high voltage of 4.2kV with 80 - 120mA on the deposition materials at 350$^{\circ}C$ in 2.0 X 10-6 torr vacuum. Ti/TiN/HA multilayer coated surfaces and layers were investigated by SEM and XRD. A saturated calomel electrode as a reference electrode, and high density carbon electrode as a counter electrode, were set according to ASTM GS-87. The potentials were controlled at a scan rate of 100 mV/min. by a potentiostat (EG&G Co.273A) connected to a computer system. Electrochemical tests were used to investigate the electrochemical characteristics of Ti/TiN/HA coated and shot peened materials in 0.9% NaCl solution at 36.5$^{\circ}C$. After each electrochemical measurement, the corrosion surface of each sample was investigated by SEM.

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Porous Nickel-Tin Nano-Dendritic Electrode for Rechargeable Lithium Battery (리튬 이차 전지를 위한 다공성 니켈-주석 나노 수지상 전극)

  • Jung, Hye-Ran;Shin, Heon-Cheol
    • Korean Journal of Materials Research
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    • v.20 no.11
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    • pp.592-599
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    • 2010
  • A porous nickel-tin nano-dendritic electrode, for use as the anode in a rechargeable lithium battery, has been prepared by using an electrochemical deposition process. The adjustment of the complexing agent content in the deposition bath enabled the nickel-tin alloys to have specific stoichiometries while the amount of acid, as a dynamic template for micro-porous structure, was limited to a certain amount to prevent its undesirable side reaction with the complexing agent. The ratios of nickel to tin in the electro-deposits were nearly identical to the ratios of nickel ion to tin ion in the deposition bath; the particle changed from spherical to dendritic shape according to the tin content in the deposits. The nickel to tin ratio and the dendritic structure were quite uniform throughout the thickness of the deposits. The resulting nickel-tin alloy was reversibly lithiated and delithiated as an anode in rechargeable lithium battery. Furthermore, the resulting anode showed much more stable cycling performance up to 50 cycles, as compared to that resulting from dense electro-deposit with the same atomic composition and from tin electrodeposit with a similar porous structure. From the results, it is expected that highly-porous nickel-tin alloys presented in this work could provide a promising option for the high performance anode materials for rechargeable lithium batteries.