• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.6
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• pp.489-494
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• 2009

In this study, In order to improve dielectric and piezoelectric properties of Lead-free piezoelectric ceramics, $0.95(K_{0.5}Na_{0.5})NbO_3-0.05Li(Sb_{0.8}Nb_{0.2})O_3+0.2\;wt%Ag_2O+0.4\;wt%MnO_2+Xwt%CuO$ were investigated as a function of the amount of CuO addition. With increasing the amount of CuO addition, density was increased up to 0.4 wt.% CuO and then decreased above. And also, electro mechanical coupling factor ($k_p$) was decreased. At the 0.4 wt% CuO added specimen sintered at $1020^{\circ}C$, $k_p$, Qm, density, dielectric constant (${\varepsilon}_r$) and $d_{33}$[pC/N] showed the optimal value of $4.37\;g/cm^3$, 0.354, 305, 645, and 144 pC/N respectively.

• Proceedings of the Korean Vacuum Society Conference
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• 2000.02a
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• pp.90-90
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• 2000

이온빔을 이용한 리소그래피의 경우 미크론 이하의 미세구조를 형성할 수 있는 유용한 수단으로서 방사광 X-선과 함께 주목을 받고 있으며, 이와 같은 미세구조 제작은 MEMS (Micro Electro-Mechanical System) 개발에 있어서 매우 중요하다. 그러나 이온빔을 이용한 리소그래피에 대한 연구가 많이 이루어져 있지 않은 상태이다. MeV급 양정사 빔을 이용한 리소그래피의 가능성을 확인하기 위하여 기본적인 실험을 수행하였으며, 최적 이온빔 조사 조건 및 최적 현상 조건을 도출하였다. Resist로는 PMMA를 사용하였으며, 1.8 MeV 양성자 빔을 사용하여 50$\mu\textrm{m}$ 깊이의 구조물을 만들었다. 1.8MeV 양성자 빔의 조사선량이 7x1013ions/cm2 이상이 되면 PMMA 내부에 기포가 형성되므로 적정 조사선량을 4x1013 ions/cm2으로 결정하였다. 또한 선량을 4x1013ions/cm2 으로 고정하고 선량률을 변화시켜주면 선량률이 8x1011ions/cm2S 일 때부터 시료에 기포나 터짐 현상 등의 문제가 발생하였으며 5x1010~~1x1010ions/cm2s 의 선량률이 조사시간, 결함측면에서 가장 적합한 영역임을 알 수 있었다. 현상제로는 20% morpholine, 5% etanolamine 60% diethylenglykol-monobutylether, 15% 증류수를 혼합하여 사용하였다. 현상 온도를 30~5$0^{\circ}C$로 변화시켜서 현상을 한 결과, 4$0^{\circ}C$에서 현상 소요시간은 1시간 이내이며 SEM으로 관찰된 표면의 상태도 제일 양호한 결과를 보였다. 82 mesh 밀도, 선굵기 60$\mu\textrm{m}$, 크기 20x20 mm인 백금 망을 마스크로 사용하여 실제 3차원 미세구조를 제작하여 보았다. 그림 1에서 제작된 구조물의 SEM 사진을 보여주었으며, 식각된 면의 조도가 매우 뛰어나며 모서리의 직각성도 우수함을 확인할 수 있다. 이와 같이 도출된 시험 조건을 기초로 하여 리소그래피 후에 전기 도금을 이용한 금속 몰드 제작 및 이온빔 리소그래피 장점을 최대한 살릴수 있는 미세구조 제작에 대한 연구를 계속 추진할 계획이다.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.216.1-216.1
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• 2013

PZT 박막은 강유전 특성과 압전소자 특성을 나타내는 물질로 DRAM (dynamic random acess memory)과 FRAM (ferroelectric RAM) 등의 기억소자용 capacitor와 MEMS (micro electro mechanical system) 소자의 압전 물질로 사용하기 위한 연구가 진행중에 있다. 하지만 이러한 연구에서는 PZT 박막의 전기적 특성 향상을 주목적으로 연구가 진행되어 왔다. 특히, 박막 공정중 발생하는 plasma에 의한 PZT의 전기적 특성 변화가 박막 표면의 물리적 변화에 기인할 것으로 추정하고 있지만 이에 대한 구체적인 연구는 미비하다. 이 연구에서는 plasma에 의한 PZT 박막 표면의 물리적 특성 변화를 연구하기 위하여 PZT 박막을 sol-gel을 이용하여 Si 기판위에 약 100 nm의 두께로 증착하였으며, 이후 최대 300 W의 Ar plasma로 plasma power을 증가시켜 각각 10분간 plasma처리를 실시하였다. PZT 박막 표면의 nano-mechanics 특성을 분석하기 위하여 Nano-indenter와 Kelvin Probe Force Microscopy (KPFM)을 사용하여 surface hardness, surface morphology를 확인하였고 특히, surface potential 분석을 통하여 PZT 박막 표면의 plasma에 의한 박막 극 표면의 전기적 특성 변화를 연구하였다. 이 연구로 plasma에 의한 PZT 박막은 표면으로부터 최대 43 nm 깊이에서의 hardness는 최대 5.1 GPa에서 최소 4.3 GPa의 분포로 plasma power 변화에 의한 특성은 측정 불가능하였다. 이는 plasma에 의한 영향이 시료 극 표면에 국한되어 나타나기 때문으로 추정되며 이를 보완하기 위하여 surface potential을 분석하였다. 결과에 의하면 plasma power가 0 W에서 300 W로 증가함에 따라 potential이 30 mV에서 -20 mV로 감소하였으나 potential의 분산은 100 W에서 최대인 17 mV로 측정되었으며, 이때 RMS roughness역시 가장 높은 20.145 nm로 측정되었다. 특히, 100 W에서 potential에서는 물결 모양과 같은 일정한 패턴의 potential 무늬가 확인되었다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.362-365
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• 2005

Currently Chemical Mechanical Planarization (CMP) has become an essential step in the overall semiconductor wafer fabrication technology. Especially the CMP pad conditioner, one of the diamond tools, is required to have strong diamond retention. Strong cohesion between diamond grits and metal matrix prevents macro scratch on the wafer. If diamond retention is weak, the diamond will be pulled out of metal matrix. The pulled diamond grits are causative of macro scratch on wafer during CMP process. Firstly, some results will be reported of cohesion between diamond grits and metal matrix on the diamond tools prepared by three different manufacturing methods. A measuring instrument with sharp cemented carbide connected with a push-pull gauge was manufactured to measure the cohesion between diamond grits and metal matrix. The retention force of brazed diamond tool was stronger than the others. The retention force was also increased in proportion to the contact area of diamond grits and metal matrix. The brazed diamond tool has a strong chemical combination of the interlayer composed of chrome in metal matrix and carbon which enhance the interfacial cohesion strength between diamond grits and metal matrix. Secondly, we measured real-time data of the coefficient of friction and the pad wear rate by using CMP tester (CETR, CP-4). CMP pad conditioner samples were manufactured by brazed, electro-plated and sintered methods. The coefficient of friction and the pad wear rate were shown differently according to the arranged diamond patterns. Consequently, the coefficient of friction is increased according as the space between diamonds is increased or the concentration of diamonds is decreased. The pad wear rate is increased according as the degree of diamond protrusion is increased.

• Journal of the Korean Society for Nondestructive Testing
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• v.27 no.4
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• pp.313-320
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• 2007

Recently, a new class of single-crystal piezoelectric materials such as lead metanibobate doped with lead titanate (PMN-PT) has been synthesized and were found to further enhance the electro-mechanical coupling factor compared to piezo-ceramic materials. This paper describes fabrication and evaluation of PMN-PT single crystal ultrasonic transducers for contact measurement of stainless steel that is one of the highly attenuative materials. The design conditions for ultrasonic transducer such as front matching layer between test materials and piezo-material and backing materials were investigated based on the simulation results by KLM model. The PMN-PT single crystal ultrasonic transducers with centre frequencies at 1 and 2.25 MHz were fabricated and their performances were evaluated.

• Journal of the Korean institute of surface engineering
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• v.51 no.4
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• pp.191-196
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• 2018

The self-annealing which leads evolution of microstructure in copper electroplating layers at room temperature occurs after forming deposition layer. During the process, crystal orientation, size and sheet resistance of plating layer change. Lastly, it causes the change of physical and mechanical characteristics such as a tensile strength of plating layer. In this study, the variation of incorporated impurities, microstructure and sheet resistance of copper plating layer formed by electroplating are measured with and without inorganic additives during the self-annealing. In case of absence of inorganic additives, the copper layer presents strong total intensity of incorporated impurities. During the self-annealing, such width of reduction was significant. Moreover, microstructure and crystal size are increased while the tensile strength is decreased noticeably. On the other hand, in the presence of inorganic additives, there is no observable distinction in the copper plating layer. According to the observation on movements of the incorporated impurities in electrodeposition copper layer, within 12 hours the impurities are continuously shifted from inside of the plating layer to its surface after as-deposited electroplating. Within 24 hours, except for the small portion of surface layer, it is considered that most of the microstructure is transformed.

• Journal of the Korean institute of surface engineering
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• v.51 no.4
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• pp.197-201
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• 2018

Dynamic nano-indentation method was applied to characterize thin electroformed Ni-P layers. The Ni-P layers were produced in a sulphamic acid bath at $50^{\circ}C$ in $0.02A/cm^2$ for 10-60 minutes. The chemical analyses by XRD and EDX showed that the Ni-P layers were very fine grains with mainly $Ni_3P$ with Ni. The surface roughness determined by atomic force microscopy increased with thickness, which was relative to the surface morphology. The nano-hardness and the stiffness of the thin Ni-P layers with thickness of 1.9, 6.2 and $7.5{\mu}m$ were 5.52, 6.52 and 6.77 [GPa] and 56.7, 76.2 and 108.0 [${\mu}N/nm$], respectively. The elastic modulus of the Ni-P layer increased with thickness such as 37.29, 54.50 and 78.76 [GPa], respectively. The surface roughness of the electroplated Ni-P layers with diverse thickness was 8.66, 18.56 and 35.22 [nm], respectively. The enhanced nano-mechanical properties were related to mainly residual stress of the Ni-P layers.

• Smart Structures and Systems
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• v.6 no.5_6
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• pp.641-659
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• 2010

Structural Health Monitoring (SHM) gradually becomes a technique for ensuring the health and safety of civil infrastructures and is also an important approach for the research of the damage accumulation and disaster evolving characteristics of civil infrastructures. It is attracting prodigious research interests and the active development interests of scientists and engineers because a great number of civil infrastructures are planned and built every year in mainland China. In a SHM system the sheer number of accompanying wires, fiber optic cables, and other physical transmission medium is usually prohibitive, particularly for such structures as offshore platforms and long-span structures. Fortunately, with recent advances in technologies in sensing, wireless communication, and micro electro mechanical systems (MEMS), wireless sensor technique has been developing rapidly and is being used gradually in the SHM of civil engineering structures. In this paper, some recent advances in the research, development, and implementation of wireless sensors for the SHM of civil infrastructures in mainland China, especially in Dalian University of Technology (DUT) and Harbin Institute of Technology (HIT), are introduced. Firstly, a kind of wireless digital acceleration sensors for structural global monitoring is designed and validated in an offshore structure model. Secondly, wireless inclination sensor systems based on Frequency-hopping techniques are developed and applied successfully to swing monitoring of large-scale hook structures. Thirdly, wireless acquisition systems integrating with different sensing materials, such as Polyvinylidene Fluoride(PVDF), strain gauge, piezoresistive stress/strain sensors fabricated by using the nickel powder-filled cement-based composite, are proposed for structural local monitoring, and validating the characteristics of the above materials. Finally, solutions to the key problem of finite energy for wireless sensors networks are discussed, with future works also being introduced, for example, the wireless sensor networks powered by corrosion signal for corrosion monitoring and rapid diagnosis for large structures.

• The Journal of the Acoustical Society of Korea
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• v.40 no.4
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• pp.270-277
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• 2021

In the power ultrasound fields, the flange position for fixing the transducer is an important factor influencing on electro-mechanical efficiency of the transducer. We suggested a practical method that can determine the installation position of the flange for different resonance modes of the bolt-clamped type Langevin ultrasonic transducer. A semicircular wedge-shaped jig was manufactured and moved along the lateral surface of the transducer. The vibration characteristics were examined after a constant pressure was applied to the semicircular wedge-shaped jig. By observing the change of the input admittance of the transducer depending on the position of the pressure application, the optimum position for the flange installation could be determined. The resonant modes of the transducer were calculated by a Mason's equivalent circuit, and the particle velocity distribution for each resonance mode was calculated by a transmission line model. Since the optimum positions determined from an experimental result show a good correspondence with the node positions of the vibration modes calculated by the transmission line model, the validity of the suggested method was verified.

• Journal of Korean Association for Spatial Structures
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• v.19 no.2
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• pp.63-72
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• 2019

Wireless sensors are more favorable in measuring structural response compared to conventional sensors in terms of them being easier to use with no issues with cables and them being considerably cheaper. Previous tests have been conducted to analyze the performance of MEMS (Micro Electro Mechanical Systems) sensor in sinusoidal excitation tests. This paper analyzes the performance of in-built MEMS sensors in devices by comparing with an ICP sensor as the reference. Earthquake input amplitude excitation in shaking table tests was done. Results show that MEMS sensors are more accurate in measuring higher input amplitude measurements which range from 100gal to 250gal than at lower input amplitudes which range from 10gal to 50gal. This confirms the results obtained in previous sinusoidal tests. It was also seen that natural frequency results have lower error values which range from 0% to 3.92% in comparison to the response spectra results. This also confirms that in-built MEMS sensors in mobile devices are good at estimating natural frequency of structures. In addition, it was also seen that earthquake input amplitudes with more frequency contents (Gyeongju) had considerably higher error values than Pohang excitation tests which has less frequency contents.