• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.185-189
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• 2002

Flexible displays such as plastic based LCDs and organic light-emitting diodes for mobile communication devices have been researched and developed at KETI in KOREA since 1997. The Plastic film substrate has so poor thermal tolerance and non-rigidness that the fabrication of active devices and panel assembly have to perform at low temperature and pressure. In addition, high thermal expansion of the substrate is also a serious problem for reliable metallic film deposition. In this paper, we investigated particularly on the fundamental characteristics of various plastic substrates and then, suggested novel methods that improve the fabrication processes of plastic LCD panel. In order to maintain stable substrate surface and uniform cell gap during panel assembly, we utilized newly-invented iii and vacuum chuck. Electro-optical characteristics of fabricated plastic LCD are better than or equivalent to those of typical glass based LCDs though it is thinner, lighter-weight and more robust.

• Advances in Computational Design
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• v.3 no.3
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• pp.303-318
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• 2018

This article presents a semi-analytical solution for an exponentially graded piezoelectric hollow sphere. The sphere interacts with electric displacement, elastic deformations, electric potentials, magneto-thermo-elasticity, and hygrothermal influences. The hollow sphere may be standing under both mechanical and electric potentials. Electro-magneto-elastic behavior of magnetic field vector can be described in the hollow sphere. All material, thermal and magnetic properties of hollow sphere are supposed to be graded in radial direction. A semi-analytical technique is improved to deduce all fields in which different boundary conditions for radial stress and electric potential are presented. Numerical examples for radial displacement, radial and hoop stresses, and electric potential are investigated. The influence of many parameters is studied. It is seen that the gradation of all material, thermal and magnetic properties has particular effectiveness in many applications of modern technology.

• International Journal of Quality Innovation
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• v.2 no.2
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• pp.69-92
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• 2001

The laser-assisted seeding (LAS) process has potential to replace conventional electroless copper plating in Printed Circuit Board (PCB) manufacturing since it combines the steps of laser drilling and plating into one single process. In the LAS process, the single extra LAS step can metallize a microvia. Thus, the process steps can be greatly reduced and the productivity enhanced, but also the high aspect ratio microvias can be metallized. The objectives of this paper are to study the LAS copper thickness within PCB microvias and the thermal reliability of the microvias produced by this process. It was found that results were satisfactory in both the reliability test and also the LAS copper thickness which both comply with IPC standard, the copper thickness produced by the LAS process is sufficient for subsequent electro-plating process. The reliability of the microvias produced by LAS process is acceptable which are free from any voids, corner cracks, and distortion in the plated copper.

• Transactions of the Korean Society of Mechanical Engineers
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• v.10 no.5
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• pp.661-669
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• 1986

In this study, the resistance spot welding process of an aluminum alloy was analyzed through the numerical simulation including the electric contact resistance and the heat generation in the electrode. The finite element model was used to solve the electro-thermal responses in weld cycles. The resistance of the contact area was represented as the contact element modeling, but the thermal resistance between the contact surfaces was neglected. Welding tests of Alclad 2024-T3 aluminum alloy were made not only to get the input data for the numerical simulation, but also to compare the numerical results. The contact resistance was determined initially by the contact resistance tests and assumed to decay exponentially up to the solidus temperature. The temperature distributions and dynamic resistance obtained numerically were in good agreement with the experimental results. Numerical results revealed that nugget growth depends mainly on the heat generated in the workpiece and its contact area. The heat generated in the electrode has, however, only a little effect on the nugget growth, and the heat generation in the electrode-workpiece interface is initially high but decrease repidly.

• Proceedings of the KIEE Conference
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• 1988.07a
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• pp.360-362
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• 1988

The new oxidation method was presented to grow the oxide layer by thermal reaction of $NH_{3}$ and $O_{2}$. The growth rate increased according as increase of partial pressure of $NH_{3}$. Optical transparent of the grown film was 12% compared with 17% of thermal oxidation when the wave number was $1,100cm^{-1}$. The oxide layer with good quaility was obtained.

• Journal of Electrical Engineering and Technology
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• v.7 no.3
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• pp.297-303
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• 2012

This paper presents the simulation results for the analysis of a lightning surge, switching transients and very fast transients within a thermal plant. The modeling of gas insulated substations (GIS) makes use of electrical equivalent circuits that are composed of lumped elements and distributed parameter lines. The system model also includes some generators, transformers, and low voltage circuits such as 24V DC rectifiers and control circuits. This paper shows the simulation results, via EMTP (Electro-Magnetic Transients Program), for three overvoltage types, such as transient overvoltages, switching transients, very fast transients and a lightning surge.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.9
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• pp.726-730
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• 2001

Temperature stabilities of dielectric constraints and resonant frequencies of the substrates are very important in piezoelectric ceramics oscillators and filters. In this study, it was investigated temperature stability of the length-extensional vibration mode of Pb(Zr$\_$y/Ti$\_$1-y/)O$_3$+x[wt%]Cr$_2$O$_3$ ceramics. The mode can be utilized in fabricating ultra-small 455 kHz IF devices. Addition of Cr$_2$O$_3$ in morphotrophic phase PZT decreased the variations of dielectric constant, electro-mechanical coupling factor k$\_$31/ and resonant frequency by thermal shock. As additive weight of Cr$_2$O$_3$increased, the temperature coefficient of resonant frequency changed from positive number to negative one. And the composition tith temperature coefficient of resonant frequency was shifted to the one with increased Cr$_2$O$_3$ additive weigh by thermal aging.

• Transactions on Electrical and Electronic Materials
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• v.7 no.6
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• pp.301-304
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• 2006

We studied the nematic liquid crystal (NLC) aligning capabilities using the new alignment material of the SiC (Silicon Carbide) thin film. The SiC thin film exhibits good chemical and thermal stability. The good thermal and chemical stability make SiC an attractive candidate for electronic applications. A vertical alignment of nematic liquid crystal by atomic beam exposure on the SiC thin film surface was achieved. The about $87^{\circ}$ of stable pretilt angle was achieved at the range from $30^{\circ}\;to\;45^{\circ}$ of incident angle. Consequently, the vertical alignment effect of liquid crystal electro-optical characteristic by the atomic beam alignment method on the SiC thin film layer can be achieved.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.1017-1022
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• 2004

Though the standard element density-based topology optimization method has been applied for the optimal design of multiphysics systems, some theoretical problems, such as material interpolation, undershoot temperature prediction, and unstable elements, still remain to be overcome. The objective of this investigation is to present a new topology optimization formulation based on the element connectivity parameterization (ECP) in order to avoid the numerical problems in multiphysics system design and improve optimization results. To show the validity of the proposed approach, the designs of an optimal thermal dissipation and an electro-thermal-compliant actuator were considered.

• Smart Structures and Systems
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• v.5 no.6
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• pp.591-612
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• 2009

New insights are presented in simplified modeling and analysis of free vibrations of piezoelectric - based smart structures and systems. These consist, first, in extending the wide used piezoelectric-thermal analogy (TA) simplified modeling approach in currently static actuation to piezoelectric free-vibrations under short-circuit (SC) and approximate open-circuit (OC) electric conditions; second, the popular piezoelectric strain induced - potential (IP) simplified modeling concept is revisited. It is shown that the IP resulting frequencies are insensitive to the electric SC/OC conditions; in particular, SC frequencies are found to be the same as those resulting from the newly proposed OC TA. Two-dimensional plane strain (PStrain) and plane stress (PStress) free-vibrations problems are then analyzed for above used SC and approximate OC electric conditions. It is shown theoretically and validated numerically that, for both SC and OC electric conditions, PStress frequencies are lower than PStrain ones, and that 3D frequencies are bounded from below by the former and from above by the latter. The same holds for the modal electro-mechanical coupling coefficient that is retained as a comparator of presented models and analyses.