• Progress in Superconductivity and Cryogenics
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• v.25 no.4
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• pp.24-27
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• 2023

Until now, many research activities have been conducted to commercialize high-temperature superconducting (HTS) wires for electric applications. Most of all researchers have focused on enhancing the piece length, critical current density, mechanical strength, and throughput of HTS wires. Recently, HTS magnet for generating high magnetic field shows degraded performance due to the deformation of HTS wire by high electro-magnetic force. The deformation can be derived from widthwise thickness non-uniformity of HTS wire mainly caused by wet processes such as electro-polishing of metal substrate and electro-plating of copper. Gradient sputtering process is designed to improve the thickness uniformity of HTS wire along the width direction. Copper stabilizing layer is deposited on HTS wire covered with specially designed mask. In order to evaluate the thickness uniformity of HTS wire after gradient sputtering process, the thickness distribution across the width is measured by using the optical microscope. The results show that the gradient deposition process is an effective method for improving the thickness uniformity of HTS wire.

• Journal of Institute of Control, Robotics and Systems
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• v.13 no.11
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• pp.1067-1073
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• 2007

This paper presents development of an special metal hydride(SMH) actuator system using a peltier module. The newly developed simple SMH actuator, consisting of the plated hydrogen-absorbing alloy as a power source, Peltier elements as a heat source and a cylinder with metal bellows as a functioning part, has been developed. The SMH actuator is characterized by its small size, low weight, noiseless operation and a compliance similar to that of human body. A new SMH actuator that uses reversible reactions between the heat energy and mechanical energy of a hydrogen absorbing alloy. It is well known that hydrogen-absorbing alloys can reversibly absorb and desorb a large amount of hydrogen, more than about 1000 times of their own volume. To improve the thermal conductivity of the hydrogen-absorbing alloy, an electro-less copper plating has been carried out. For this purpose, the effects of the electro-less copper plating and the dynamic characteristics of the SMH actuator have been studied. The hydrogen equilibrium pressure increases and hydrogen is desorbed by heating the hydrogen-absorbing alloys, whereas by cooling the alloys, the hydrogen equilibrium pressure decreases and hydrogen is absorbed. The SMH actuator has the characteristic of being light and easy to use. Therefore, it is suitable for medical and rehabilitation applications.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.551-555
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• 2005

This paper presents the temperature-pressure characteristics of SMH actuator using a peltier module. The simple SMH actuator, consisting of the plated hydrogen-absorbing alloy as a power source, Peltier elements as a heat source and a cylinder with metal bellows a functioning part has been developed. The SMH actuator is characterized by its small size, low weight, noiseless operation and a compliance similar to that of the human body. A new special metal hydride(SMH) actuator that uses the reversible reaction between the heat energy and mechanical energy of a hydrogen absorbing ally. It is well known that hydrogen-absorbing alloys can reversibly absorb and desorb a large amount of hydrogen, more than about 1000 times as their own volume. To improve the thermal conductivity of the hydrogen-absorbing alloy, an electro-less copper plating has been carried out. The effects of the electro-less copper plating and the dynamic characteristics of the SMH actuator have been studied. The hydrogen equilibrium pressure increases and hydrogen is desorbed by heating the hydrogen-absorbing alloys, whereas by cooling the alloys, the hydrogen equilibrium pressure decreases and hydrogen is absorbed. Therefor, the SMH actuator has the characteristic of being light and easy to use and so is suitable for use in medical and rehabilitation applications.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.16 no.4
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• pp.759-764
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• 2012

Copper Pillar Tin Bump (CPTB) was investigated for high density chip interconnect technology development, which was prepared by electroplating and electro-less plating methods. Copper pillar tin bumps that have $100{\mu}m$ pitch were introduced with fabrication process using a KM-1250 dry film photoresist (DFR), with copper electroplating for Copper Pillar Bump (CPB) formation firstly, and then tin electro-less plating on it for control oxidation. Electric resistivity and mechanical shear strength measurements were introduced to characterize the oxidation effects and bonding process as a function of thermo-compression. Electrical resistivity increased with increasing oxidation thickness, and shear strength had maximum value with $330^{\circ}C$ and 500 N at thermo-compression process. Through the simulation work, it was proved that the CPTB decreased in its size of conduction area as time passes, however it was largely affected by the copper oxidation.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2010.10a
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• pp.726-729
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• 2010

Copper Pillar Tin Bump (CPTB) was investigated for high density chip interconnect technology development, which was prepared by electroplating and electro-less plating methods. Copper pillar tin bumps that have $100{\mu}m$ pitch were introduced with fabrication process using a KM-1250 dry film photoresist (DFR), with copper electroplating for Copper Pillar Bump (CPB) formation firstly, and then tin electro-less plating on it for control oxidation. Electric resistivity and mechanical shear strength measurements were introduced to characterize the oxidation effects and bonding process as a function of thermo-compression. Electrical resistivity increased with increasing oxidation thickness, and shear strength had maximum value with $330^{\circ}C$ and 500 N thermo-compression process. Through the simulation work, it was proved that when the CPTB decreased in its size, it was largely affected by the copper oxidation.

• Journal of the Korean Society of Marine Environment & Safety
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• v.17 no.2
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• pp.155-160
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• 2011

In these days, there are increasing demands for weight reduction in many industrial fields including marine industries. Therefore, magnesium thin films for lightweight materials were prepared on magnesium alloy substrate. The influence of gas pressure and substrate bias voltages on the crystal orientation and morphology of the films was determined by using X-ray diffraction and FE-SEM, respectively. And the effect of crystal orientation and morphology of the magnesium thin films on corrosion behavior was estimated by measuring electro-chemical anodic polarization curves in deaerated 3% NaCl solution. From the results, corrosion resistance of Mg thin films was improved by controlling the crystal orientation and morphology of the films with effective use of plasma ion plating technique.

• Journal of the Korean institute of surface engineering
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• v.49 no.2
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• pp.111-118
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• 2016

A method to quantitatively analyze the defects formed by the hydrogen evolution during electroplating was suggested based on the theoretical approach of the small angle neutron scattering technique. In case of trivalent chrome layers, an isolated defect size due to the hydrogen evolution was about 40 nm. Direct and pulse plating conditions gave the average defect size of about 4.9 and $4.5{\mu}m$ with rod or calabash shape, respectively. Current density change of the pulse plating from $1.5A/dm^2$ to $2.0A/dm^2$ enlarged the average defect size from 3.3 to $7.8{\mu}m$. The defect morphology like rod or calabash was originated by inter-connecting the isolated defects. Small angle neutron scattering was useful to quantitatively evaluate defect morphology of the deposit.

• Korean Journal of Materials Research
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• v.19 no.6
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• pp.344-348
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• 2009

The electrolyte effects of the electroplating solution in Cu films grown by ElectroPlating Deposition(EPD) were investigated. The electroplated Cu films were deposited on the Cu(20 nm)/Ti (20 nm)/p-type Si(100) substrate. Potentiostatic electrodeposition was carried out using three terminal methods: 1) an Ag/AgCl reference electrode, 2) a platinum plate as a counter electrode, and 3) a seed layer as a working electrode. In this study, we changed the concentration of a plating electrolyte that was composed of $CuSO_4$, $H_2SO_4$ and HCl. The resistivity was measured with a four-point probe and the material properties were investigated by using XRD(X-ray Diffraction), an AFM(Atomic Force Microscope), a FE-SEM(Field Emission Scanning Electron Microscope) and an XPS(X-ray Photoelectron Spectroscopy). From the results, we concluded that the increase of the concentration of electrolytes led to the increase of the film density and the decrease of the electrical resistivity of the electroplated Cu film.

• Journal of Korea Society of Waste Management
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• v.35 no.7
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• pp.653-659
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• 2018

In the industrial wastewater that occupies a large proportion of river pollution, the wastewater generated in textile, leather, and plating industries is hardly decomposable. Though dyeing wastewater has generally been treated using chemical and biological methods, its characteristics cause treatment efficiencies such as chemical oxygen demand (COD) and suspended solids (SS) to be reduced only in the activated sludge method. Currently, advanced oxidation technology for the treatment of dyeing wastewater is being developed worldwide. Electro-coagulation is highly adapted to industrial wastewater treatment because it has a high removal efficiency and a short processing time regardless of the biodegradable nature of the contaminant. In this study, the effects of the current density and the electrolyte condition on the COD removal efficiency in dyeing wastewater treatment by using electro-coagulation were tested with an aluminum anode and a stainless steel cathode. The results are as follows: (1) When the current density was adjusted to $20A/m^2$, $40A/m^2$, and $60A/m^2$ under the condition without electrolyte, the COD removal efficiency at 60 min was 62.3%, 72.3%, and 81.0%, respectively. (2) The removal efficiency with NaCl addition was 7.9% higher on average than that with non-addition at all current densities. (3) The removal efficiency with $Na_2SO_4$ addition was 4.7% higher on average than that with non-addition at all current densities.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.1
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• pp.47-54
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• 2021

For the bonding of smaller PCB solder bumps of less than 100 microns, an experiment was performed to make up a tin plating solution and find plating conditions in order to produce a bump pattern through tin electroplating, replacing the previous PCB solder bumps process by microballs. After SR patterning, a Cu seed layer was formed, and then, through DFR patterning, a pattern in which Sn can be selectively plated only within the SR pattern was formed on the PCB substrate. The tin plating solution was made based on methanesulfonic acid, and hydroquinone was used as an antioxidant to prevent oxidation of divalent tin ions. Triton X-100 was used as a surfactant, and gelatin was used as a grain refiner. By measuring the electrochemical polarization curve, the characteristics of organic additives in Triton X-100 and gelatin were compared. It was confirmed that the addition of Triton X-100 suppressed hydrogen generation up to -1 V vs. NHE, whereas gelatin inhibited hydrogen generation up to -0.7 V vs. NHE. As the current density increased, there was a general tendency that the grain size became finer, and it was observed that it became finer when gelatin was added.