• Journal of the Korean Society of Safety
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• v.33 no.4
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• pp.1-7
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• 2018

This paper is analyzed for the thermal characteristics(1 year) of the 6 components(DC breaker, DC filter(including capacitor and discharge resistance), IGBT(Insulated gate bipolar mode transistor), AC filter, AC breaker, etc.) of a photovoltaic power generation-based PCS(Power conditioning system) below 20 kW. Among the modules, the discharge resistance included in the DC filter indicated the highest heat at $125^{\circ}C$, and such heat resulting from the discharge resistance had an influence on the IGBT installed on the rear side the board. Therefore, risk priority through risk priority number(RPN) of FMEA(Failure modes and effects analysis) sheet is conducted for classification into top 10 %. According to thermal characteristics and FMEA, it is necessary to pay attention to not only the in-house defects found in the IGBT, but also the conductive heat caused by the discharge resistance. Since it is possible that animal, dust and others can be accumulated within the PCS, it is possible that the heat resulting from the discharge resistance may cause fire. Accordingly, there are two options that can be used: installing a heat sink while designing the discharge resistance, and designing the discharge resistance in a structure capable of avoiding heat conduction through setting a separation distance between discharge resistance and IGBT. This data can be used as the data for conducting a comparative analysis of abnormal signals in the process of developing a safety device for solar electricity-based photovoltaic power generation systems, as the data for examining the fire accidents caused by each module, and as the field data for setting component management priorities.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.9
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• pp.749-755
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• 2007

Recently, novel MEMS probe cards can support reliable wafer level chip test with high density probing capacity. However, manufacturing cost and process complexity are crucial weak points for low cost mass production. To overcome these limitations, we have developed micro spring structured MEMS probe card. For fabrication of micro spring module, a wire bonder and electrolytic polished gold wires are used. In this case, stringent tension force control is essential to guarantee the low level contact resistance of micro spring for reliable probing performance. For this, relation between tension force of fabricated probe card and contact resistance is characterized. Compare to conventional probe cards, developed MEMS probe card requires fewer fabrication steps and it can be manufactured with lower cost than other MEMS probe cards. Also, due to the small contact scratch patterns, we expect that it can be applied to bumping types chip test which require higher probing density.

• Journal of the Korean Society of Safety
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• v.31 no.1
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• pp.48-53
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• 2016

This paper deals with analysis of complex grounding system using electromagnetic simulation method. Electrical devices could be damaged by transient voltage such as a lightning surge. Therefore the measures to protect the equipments from transient, such as a lightning are required. The ground system is important in this respect. The representative parameter of grounding system performance is earth ground resistance. Precise prediction of earth resistance is required, because it is difficult to modify and change after the completion of the grounding system construction. Numerical modeling is often used in numerical analysis to identify the electrical characteristics of the grounding system. However complex systems are difficult to predict grounding characteristics by numerical analysis. If the total electric field of the earth in general is similar to the antenna model, in that the incident electric field and expressed as a sum of the scattering field. In this study, the electromagnetic field simulation tool "ANSYS HFSS" module containing the antenna model was used to analyze performance of ground system. Both the simple and complex grounding system were analyzed by simulation tool and experimental method. As a result simulation method is effective to predict performance of a complex ground system.

• Proceedings of the KIEE Conference
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• 2003.07c
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• pp.1958-1960
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• 2003

Here we describe a unique self-oscillating mixer (SOM) design using a modified defected ground structure (DGS) for down-converter. Proposed SOM is consisted of self-oscillator, which can produce negative resistance and select resonance frequency, and input/output matching filter. As the advantage of this SOM can be reused by module that mix signals with transistor that is used to oscillator, it is simply and low-costly designed Also, there is easy advantage to be applied in RFIC/ MMIC technology because it offers excellent high Q value in spite of using micro-strip structure. Designed self-oscillating frequency is 1.04GHz and RF frequency established is 0.8GHz. It was achieved 20dB conversion loss and phase noise of -95dBc/Hz at 100KHz offset frequency over intermediate frequency (IF). The equivalent circuit parameters for DGS are extracted by using a three dimensional EM simulator and simple circuit analysis method.

• Journal of Advanced Marine Engineering and Technology
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• v.40 no.4
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• pp.325-329
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• 2016

In this study, we investigated the feasibility of using printed Indium Tin Oxide (ITO) film as a remote sensor for Hazardous and Noxious Substances (HNS). To improve the quality of the ITO films, binder mixing ratio, Sn concentration in ITO, thermal treatment temperature, and printing process conditions were optimized. We fabricated an electrical resistance-type liquid sensor, and to confirm the sensor operation, the change in resistance in air and seawater was monitored. The change in resistance of the ITO sensor was explained in terms of reduction reaction on the surface. Further, the sensor was controlled by Arduino, and the remote data acquisition was demonstrated.

• Journal of Electrical Engineering and Technology
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• v.13 no.1
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• pp.240-249
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• 2018

Individual DC voltage balance problem is an inherent issue for cascaded H-bridge (CHB) based converter. When the CHB-based static synchronous compensator (STATCOM) is operating at zero current mode, the software-based individual DC voltage balancing control techniques may not work because of the infinitesimal output current. However, the different power losses of each cell would lead to the individual DC voltages unbalance. The uneven power losses on the local supplied cell-controllers (including the control circuit and drive circuit) would especially cause the divergence of individual DC voltages, due to their characteristic as constant power loads. To solve this problem, this paper proposes an adaptive voltage balancing module which is designed in the cell-controller board with small size and low cost circuits. It is controlled to make the power loss of the cell a constant resistance load, thus the DC voltages are balanced in zero current mode. Field test in a 10kV STATCOM confirms the performance of the proposed method.

• Progress in Superconductivity and Cryogenics
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• v.8 no.2
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• pp.43-45
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• 2006

Recently, the resistive Fault Current Limiter (SFCL) made with Coated Conductor (CC) has been researched with an advanced capability in CC. Current limiting elements must be connected in series in order to fabricate the resistive SFCL having large capacity. By the way, unless the applied voltage in the SFCL is distributed to the elements when the fault occurred, those elements will be critically damaged. Thus simultaneous quench of the elements is an important factor to design the resistive SFCL. In this paper, simultaneous quench characteristics of current limiting module by using BSCCO 2223 were researched before manufacturing the resistive SFCL by using CC. At the first fault stage, the elements generated the resistance at the same time. However, the unequal voltage is applied to the each element in process of time. The method is suggested to solve the problem of the unequal distribution. These experimental results will play an important part in developing for the resistive SFCL by using CC.

• Proceedings of the KIEE Conference
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• 2004.07e
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• pp.110-113
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• 2004

PV model is presented based on the shockley diode equation. The simple model has a photo-current source, an single diode junction and a series resistance and includes temperature dependences. An accurate PV module electrical model is presented, matching with boost converter MPPT strategy and demosnstarted in Matlab for a typical general purpose solar cell. Given solar insolation and temperature, the model returns current vector and MPP.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.11
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• pp.1050-1054
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• 2006

There have been intensive and continuous efforts in the field of DLC coating process because of their feature, like high hardness, high elasticity, abrasion resistance and chemical stability and have been applied widely the industrial areas. In this research, optimal grinding condition was investigated using Microlens Process Machine for the development of aspheric glass lens which is to be used for mobile phone module with 3 mega pixel and 2.5X optical zoom, and tungsten carbide(WC) mold cote was manufactured using high performance ultra precision machining and the effects of DLC coating on the form accuracy(PV) and surface roughness(Ra) of WC mold core was evaluated.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.441-441
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• 2007

As Rhenium-Iridium{Re-Ir) coating possesses such features as, high hardness, high elasticity, abrasion resistance and chemical stability, there have been exerted continuous efforts in research works in a variety of fields, and this technology has also been applied widely to industrial areas. In this research, the optimal grinding condition was identified using Microlens Process Machine in order to contribute to the development of aspheric glass lens for mobile phone module having 3 mega pixel and 2.5X zoom, and molding core(WC) was manufactured having performed ultra-precision machining. Effects of Re-Ir coating on form accuracy (P-V) of molding core and surface roughness(Ra) were measured and evaluated.