• Journal of the Korea Society of Computer and Information
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• v.3 no.3
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• pp.107-112
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• 1998

In this paper, filter designed and produced to use hi-Z low-Z filter which is easy to produce microstrip line and uses space less than used stub filter. This filter has very short electrical length of lines, that is Bl＜$\pi$/4, lowpass prototype series inductor replaced high impedance line section and shunt capacitance replaced low impedance line section. Replaced each section designed microstrip lines and effective permittivity of the given microstrip calculated and each section width and length calculated dna filter used design. Designed filter compared the theory value of touchstone with the experiment value of real produced filter and an analyzed response charictristic.

• Transactions of the Korean hydrogen and new energy society
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• v.26 no.2
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• pp.184-191
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• 2015

As the power electronics system increases the frequency, the power loss and thermal management are paid more attention. This research presents a real time model of dissipation power with junction temperature response for 120kw IGBT inverter which is applied to the thermal management of high power IGBT inverter. Since the computational time is critical for real time simulation, look-up tables of IGBT module characteristic curve are implemented. The power loss from IGBT provides a clue to calculate the temperature of each module of IGBT. In this study, temperature of each layer in IGBT is predicted by lumped capacitance analysis of layers with convective heat transfer. The power loss and temperature of layers in IGBT is then communicated due to mutual dependence. In the dynamic model, PWM pulses are employed to calculation real time IGBT and diode power loss. Under Matlab/Simulink$^{(R)}$ environment, the dynamic model is validated with experiment. Results showed that the dynamic response of power loss is closely coupled with effective thermal management. The convective heat transfer is enough to achieve proper thermal management under guideline temperature.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.59 no.5
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• pp.860-865
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• 2010

When a circuit breaker is opened, a large capacitance around the buses, the circuit breaker and the potential transformer (PT) might cause PT ferroresonance. During PT ferroresonance, the iron core repeats saturation and unsaturation even though the supplied voltage is a rated voltage. This paper describes an analytical analysis of PT ferroresonance in the transient-state. To analyze ferroresonance analytically, the iron core is modelled by a simplified two-segment core model in this paper. Thus, a nonlinear ordinary differential equation (ODE) for the flux linkage is changed into a linear ODE with constant coefficients, which enables an analytical analysis. In this simplified model, each state, which is either saturated or unsaturated state, corresponds to one of the three modes, i.e. overdamping, critical damping and underdamping. The flux linkage and the voltage in each state are obtained analytically by solving the linear ODE with constant coefficients. The proposed transient analysis is effective in the more understanding of ferroresonance and thus can be used to design a ferroresonance prevention or suppression circuit of a PT.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.4
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• pp.5-8
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• 2009

In this paper, a high-quality low-temperature co-fired ceramic (LTCC) solenoid inductor using a solder ball and an air cavity on a silicon wafer for three-dimensional (3-D) system-in-package (SiP) is proposed. The LTCC multi-layer solenoid inductor is attached using Ag paste and solder ball on a silicon wafer with the air cavity structure. The air cavity is formed on a silicon wafer through an anisotropic wet-etching technology and is able to isolate the LTCC dielectric loss which is equivalent to a low k material effect. The electrical coupling between the metal layer and the LTCC dielectric layer is decreased by adopting the air cavity. The LTCC solenoid inductor using the solder ball and the air cavity on silicon wafer has an improved Q factor and self-resonant frequency (SRF) by reducing the LTCC dielectric resistance and parasitic capacitance. Also, 3-D device stacking technologies provide an effective path to the miniaturization of electronic systems.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.4
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• pp.74-84
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• 2003

Conventional test algorithms do not effectively detect faults by word-line and bit-line coupling noise resulting from the increase of the density of memories. In this paper, the possibility of faults caused by word-line coupling noise is shown, and new fault model, WLSFs(Word-Line Sensitive Fault) is proposed. We also introduce the algorithm considering both word-line and bit-line coupling noise simultaneously. The algorithm increases probability of faults which means improved fault coverage and more effective test algorithm, compared to conventional ones. The proposed algorithm can also cover conventional basic faults which are stuck-at faults, transition faults and coupling faults within a five-cell physical neighborhood.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.9 no.3
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• pp.343-353
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• 1997

This paper presents a theoretical model for predicting transient behaviors during storage process of the cool storage system using the R141b clathrate. Introduction of the lumped capacitance method along with a brine reservoir having large thermal capacity yields a set of simplified energy equations. Based on the Arrhenius equation and the known experimental findings, the formation rate of clathrate for which the degree of subcooling is properly accounted is newly developed. An effective nondimensionalization of the model equations facilitates the closure of modeling as well as parametric study. Calculated results for a specific case not only simulate a typical pattern of temperautre variation in the tank successfully, but also agree reasonably well with available data. The effect of each characteristic parameter on the system performance is also investigated. It is revealed that the dominant among relevant parameters are the activation energy of reaction, the degree of subcoling and the initial mass fraction of refrigerant. Finally, the uncertainty associated with modeling of the shaft work variation appears to need further studies.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.4 s.33
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• pp.61-67
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• 2004

The structural, electrical properties of the electrolytic capacitors were examined. By the addition of additives to hydrochloric acid solution increased the dielectric aluminum surface layer. For etch tunnels formed in hydrochloric acid, the away and density of the tunnels was not uniform, while for those formed in hydrochloric acid with additives the distribution presented relative uniformity. When the etched surface formed in hydrochloric acid with $5\%$ ethylene glycol, the enlargement of specific surface area was more effective.

• Particle and aerosol research
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• v.15 no.4
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• pp.183-190
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• 2019

Here, we introduce porous graphene balls (PGB) showing superior electrochemical properties as supercapacitor electrode materials. PGB was fabricated via activation of graphene oxides (GO) by H₂O₂ and aerosol spray drying in series. Effect of activation on the morphology, specific surface area, pore volume, and electrochemical properties were investigated. As-prepared PGB showed spherical morphology containing pores, which lead to the effective prevention of restacking in graphene sheets. It also exhibited a large surface area, unique porous structures, and high electrical conductivity. The electrochemical properties of the PGB as electrode materials of supercapacitor are investigated by using aqueous KOH under symmetric two-electrode system. The highest specific capacitance of PGB was 279 F/g at 0.1 A/g. In addition, the high rate capability (93.8% retention) and long-term cycling stability (92.2%) of the PGB were found due to the facilitated ion mobility between the porous graphene layers.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.30-32
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• 2005

The effects of mole ratio and Ti-ion on the dielectric properties and microstructure of modified $CaZrO_3$ composition such as $(Ca_{0.7}Sr_{0.3})_m(Ti_yZr_{1-y})O_3$ were investigated. Ti ions substituted on Zr-sites in these modified $CaZrO_3$ composition strongly affect the sintering density and microstructure of the fired ceramic body. With increasing the amount of Ti substituted on Zr-sites, the sintered density rapidly increased and the dense microstructures were obtained for the compositions having mole ratio of 1.01, whereas the sintered density and microstructures are nearly constant with the content of Ti-ion for the compositions having mole ratio of 0.99. With increasing the content of Ti ion, the curve of TCC (temperature coefficient of capacitance) as a function of temperature rotated clockwise and satisfied the COG characteristics for both of compositions with mole ratio of 0.99 and 1.01. The content of Ti ion seems to be more effective than mole with respect to the controlling of firing and TCC.

• International Journal of Precision Engineering and Manufacturing
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• v.9 no.4
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• pp.3-10
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• 2008

Micro-electrical discharge machining (micro-EDM) is an effective method for machining all types of conductive materials regardless of hardness. Since micro-EDM is an electro-thermal process, the energy supplied by the pulse generator is an important factor in determining the effectiveness of the process. In this study, an investigation was conducted on the micro-EDM of tungsten carbide (WC) to compare the performance of transistor and resistance/capacitance (RC) pulse generators in obtaining the best quality micro-hole. The performance was measured by the machining time, material removal rate, relative tool wear ratio, surface quality, and dimensional accuracy. The RC generator was more suited for minimizing the pulse energy, which is a requirement for fabricating micro-parts. The smaller-sized debris formed by the low-discharge energy of RC micro-EDM could be easily flushed away from the machined zone, resulting in a surface free of burrs and resolidified molten metal. The RC generator also required much less time to obtain the same quality micro-hole in WC. Therefore, RC generators are better suited for fabricating micro-structures, producing good surface quality and better dimensional accuracy than the transistor generators, despite their higher relative tool wear ratio.