• Applied Chemistry for Engineering
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• v.25 no.1
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• pp.84-89
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• 2014

In this work, Ag-$TiO_2$ nanocomposites were prepared via the sonochemical deposition of Ag nanometals on $TiO_2$ nanoparticles. The size of deposited Ag nanometals was ranged in 1~3 nm and the number of Ag nanometals deposited on $TiO_2$ increased in proportion to the dosage amounts of Ag precursors. As-prepared Ag-$TiO_2$ was loaded on the sterilized agar plate together with an aliquot volume of diluted E-coli, followed by 30 min irradiation of the solar simulated light ($600{\sim}1800{\mu}w/cm^2$). Finally, the agar plate was incubated for 24 h at $37^{\circ}C$ and the number of survived colonies were counted. It was experimentally confirmed that Ag-$TiO_2$ exhibited the higher antimicrobial activity than that of pure $TiO_2$, based on measuring the colony number of control sample. The survived colony numbers on the agar plate decreased with the increase of dosage amounts of Ag-$TiO_2$ and the irradiated intensity of solar simulated light for 30 min before incubating. The increase of Ag nanometal doposition induced the progressive enhancement of antimicrobial activity, but rather reduced the photocatalytic activity of Ag-$TiO_2$ probably due to the excessive presence of Ag nanometals on $TiO_2$ matrix.

• Analytical Science and Technology
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• v.12 no.2
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• pp.159-165
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• 1999

The adsorption and separation behaviors of transition metal ions using a merrifield resin bound 1,12-diaza-3,4:9,10-dibenzo-5,8-dioxacyclopentadecane (NTOE) and 1,12,15-triaza-3,4:9,10-dibenzo-5,8-dioxacycloheptadecane(NDOE) were investigated in aqueous solution. The orders of adsorption degree(E) and distribution ratio(D) of transition metal ions were Cu(II)$t_R$) of metal ions were affected by adsorption degree(E) and distribution ratio(D). This results showed good separation efficiency of Ag(I) from mixed metal solution.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.1315-1318
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• 2008

It is well-known that PIN technology is beneficial for numerous OLED applications, e.g. active and passive matrix displays, lighting and signage. Furthermore, it can be used for other organic electronic applications such as OTFTs and organic solar cells. Here, the state of the art of the PIN technology and the latest results from the different application fields are presented.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.46 no.2
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• pp.8-15
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• 2014

A novel antibacterial paper coated with chitosan-based silver (Ag) nanocomposite prepared by green synthesis has been investigated for a wide range of application in food, agricultural and medical packaging. Green synthesis of Ag nanoparticles (AgNPs) was carried out by a chemical reaction involving a mixture of chitosan-silver nitrate (AgNO3) in an autoclave at 15 psi, $121^{\circ}C$, for 15-120 sec. AgNPs and their formation in chitosan were confirmed by both UV-Vis spectroscopy and transmission electron microscope (TEM). Fourier transform infrared spectroscopy (FTIR) study showed that free amino groups in chitosan act as an effective reductant and AgNPs stabilizer. Antibacterial test of coated paper with as-prepared chitosan-AgNPs was performed qualitatively against E. coli based on the formation of halo zones around coated papers and it was shown to be effective in suppressing the growth of E. coli with increasing Ag contents in coating layer.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.4
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• pp.81-86
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• 2003

Electromigration of Sn-3.5Ag solder bump was investigated using flip chip specimens which consisted of upper Si chip and lower Si substrate. While the resistance of the flip chip sample did not almost change until the time right before the failure, the resistivity increased abruptly at the moment when complete failure of the solder joint occurred in the flip chip sample. At current densities of $3\times 10^4$∼$4\times 10^4$A/$\textrm{cm}^2$, the activation energy for electromigration of the Sn-3.5Ag solder bump was characterized as ∼0.7 eV. Failure of the Sn-3.5Ag solder bump occurred at the solder/UBM interface due to the formation and propagation of voids at cathode side of the solder bump.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.365-365
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• 2013

본 실험에서는 RF magnetron sputter장비와 evaporator장비를 이용하여 다층박막 IGZO/Ag/IGZO를 제작하였다. 소결된 타겟은 In:Ga:ZnO 1:1:1mol%로 조성된 타겟을 사용하였으며, Ag는 99.999%의 순도를 가진다.다층박막 OMO구조의 Oxide layer는sputter장비를 이용 IGZO막을 제작하였으며, Metal layer는 evaporator 장비를 이용 Ag막을 제작하였다. 변수로는 Metal layer 두께에 따른 구조적, 광학적 특성 변화를 연구하였다. Oxide layer의 RF sputter 공정 조건으로는 초기압력 $3.0{\times}10^{-6}$ Torr 이하로 하였으며, 증착압력 $2.0{\times}10^{-2}$ Torr, RF power 30 W, Ar 50 sccm으로 고정시켰으며, Metal layer의 evaporator 공정조건으로는 $5.0{\times}10^{-6}$ 이하, 전압은 0.3V, 기판 회전속도는 2RPM 두께는 Thickness moniter로 3. 5. 7. 9. 11. 13. 15 nm를 확인하며 증착하였다. 분석결과로는 AFM측정결과 거칠기는 2 nm이하의 거칠기를 확인했으며, XRD측정결과 Bragg's 법칙($2\;dsin{\Theta}=n{\lambda}$)를 만족하는 피크를 찾을 수 없어 비정질 구조임을 확인할 수 있었다. 투과도 측정결과 가시광 영역에서 최대 80% 이상의 투과율을 보여주었으며, IR영역에서는 30% 이하의 투과율을 보여주었다. 에너지 밴드갬 계산결과 4.5~4.6 eV를 갖는 것을 확인하였으며, Low-e 분야에 사용가능함을 보여주었다.

• Korean Journal of Crystallography
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• v.9 no.2
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• pp.96-106
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• 1998

수평 전기로에서 AgInS2 다결정을 합성하여 HWE 방법으로 AgInS2 단결정 박막을 반절연성 GaAs(100) 위에 성장하였다. AgInS2 단결정 박막은 증발원과 기판의 온도를 각각 680℃, 410℃로 성장하였다. 이때 단결정 박막의 결정성이 10 K에서 측정한 광발광 스펙트럼은 597.8 nm(2.0741 eV) 근처에서 엑시톤 방출 스펙트럼이 가장 강하게 나타났으며, 또한 이중결정 X-선 요동곡선(DCRC)의 반폭치(FWHM)도 121 arcsec로 가장 작게 측정되어 최적 성장 조건임을 알 수 있었다. Hall 효과는 van der Pauw 방법에 의해 측정되었으며, 온도에 의존하는 운반자 농도와 이동도는 293 K에서 각각 9.35×1023개/㎥, 2.94×10-2㎡/V·s였다. AgInS2 단결정 박막의 광전류 단파장대 봉우리들로부터 10 K에서 측정된 ΔCr(crystal field splitting)은 0.15eV, ΔSo(spin orbit coupling)는 0.0089 eV였다. 광전도 셀로서 응용성을 알아보기 위해 감도(γ), pc/dc(photocurrent/darkcurrent), 최대허용소비전력(maximum allowable power dissipation: MAPD), 응답시간(response time)등을 측정한 결과, S 증기 분위기에 열처리한 광전도 셀의 경우 γ=0.98, pc/dc=1.02×106, MAPD=312 mW, 오름시간(rise time)=10.4 ms, 내림시간(decay time)=10.8 ms로 가장 좋은 특성을 얻었다.

• Analytical Science and Technology
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• v.9 no.3
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• pp.221-234
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• 1996

Basic studies for the effective extraction of dibenzylammonium dibenzyldithiocarbamate(DBADBDC) complexes of Ag(I), Pd(II), Au(III) and Pt(IV) into chloroform have been conducted. The effects of pH on the extraction of ligand itself and metal cemplexes showed that DBADBDC itself was uniformly extracted in the pH range of 2~9 and metal complexes were effectively extracted at the pH range as follows. That is, Ag(I) : in an acidic aqua medium, Pd(II) : > 4, Au(III) : wide range, and Pt(IV) : > 3. The distribution ratio and extractabilities were obtained from the partition and extraction equilibria of metal-DBDC complexes between aqueous solution and chloroform. Ag(I) : log D=4.226 : E(%)=99.9% in the aqueous solution of pH 0, Pd(II) : log D=1.804 : E(%)=98.5% at pH 4~7, Au(III) : log D=3.755 : E(%)=99.9% at pH 2~10, and Pt(IV) : log D=0.165 : E(%)=57.2% at pH 8.0. And also mole ratio of metal ion to ligand in complexes were determined by mole ratio method : 1 : 1 for Ag(I) and 1 : 2 for Pd(II), Au(III) and Pt(IV). $Cl^-$ was included as a coordination species in complexes of Au(III) and Pt(IV). Besides, extraction mechanisms of compleses sere examined in the presence of chloride ion in an aquous solution, and extraction reactions and estraction constants could be proposed and calculated, respectively.

• Proceedings of the KWS Conference
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• 2006.10a
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• pp.169-171
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• 2006

Solderability and reaction properties were investigated for four Pb-free alloys as a function of Ag contents; Sn-4.0Ag-0.5Cu, Sn-3.0Ag-0.5Cu, Sn-2.5Ag-0.5Cu, and Sn-1.0Ag-0.5Cu. The alloy of the lowest Ag content, i.e., Sn-1.0Ag-0.5Cu, showed poor wetting properties as the reaction temperature decreased to 230oC. Variation of Ag concentration in the Sn-xAg-0.5Cu alloy shifted exothermic peaks indicating the undercooling temperature in DSC curve. For the aging process at 170oC, the thickness of IMCs at the board-side solder/Cu interface increased with the Ag concentration.

• The Journal of Engineering Research
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• v.3 no.1
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• pp.189-197
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• 1998

Hyeroxyapatite(HAp) which has good biocompatibility was made by Wet Chemical Process. The surface of Ti-6Al-4V, coated with HAp by lon Beam Assisted Deposition (IBAD), was treated with 5ppm, 10ppm, 20ppm, and 100ppm of $AgNO_3$ solution. In this Ag impregnation process, $Ca^{2+}$ of HAp was substituted with $Ag^+$ of $AgNO_3$. In this study, the antimicrobial effect and biocompatibility of Ti-6Al-4V alloy which was coated with Ag-HAp were examined. The antimicrobial test was carried out with two kinds of bacteria(P. Aeruginosa, S. Epidermidis), which are highly infectious in a transplanting operation of implant materials. As a result of the test, it was observed that Ti-6Al-4V alloy which was treated by 20ppm of $AgNO_3$ solution has good biocompatibility. In order to observe the antimicrobial mechanism of $Ag^+$, E. coli which is the most common bacterium was treated by Ag-HAp. Then cell morphology of E. coli was observed by the transmission electron microscope(TEM). The destruction of cell wall and cytoplasm of E. coil were observed. A black spot appeared in the cytoplasm was analyzed by energy dispersive analysis X-ray (EDAX) and it showed a small amount of $Ag^+$. Thus, it was proved that $Ag^+$ destroys bacteria effectively and Ti-6Al-4V alloy which was impregnate with Ag ion show antimicrobial effect on infection bacteria.