• Journal of the Korean Society for Heat Treatment
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• v.29 no.2
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• pp.56-61
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• 2016

Heating experiments using the Ti-3Al-2.5V tube materials in a vacuum furnace have been performed to investigate a pertinent range of working temperatures and holding times for the development of the successive or simultaneous operation of superplastic hydroforming and diffusion bonding. The specimens were heated at $820^{\circ}C$, $870^{\circ}C$ and $920^{\circ}C$ respectively. Holding times at each temperature were varied up to 4 hours. Holding times longer than 1 hour were selected to consider the diffusion bonding process after or during the hydroforming process in the superplastic state. Grain sizes were varied from $5.7{\mu}m$ of the as-received tube to $9.2{\mu}m$ after heating at $870^{\circ}C/4hours$. Homogeneus granular microstructures could be maintained up to $870^{\circ}C$, while microstructures at $920^{\circ}C$ showed no more granular type.

• Journal of the Korean Society for Heat Treatment
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• v.9 no.2
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• pp.130-138
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• 1996

It has been investigated that the ion nitriding effects of a STD61 steel in various time conditions of 3 to 9 hours, and the microstructure of compound and diffusion layers of the ion nitrided specimen for 6 hours and subsequently reheated for 1 hour at various temperatures of $400{\sim}800^{\circ}C$ As the nitriding time increased, the thickness of compound and diffusion layers was increased, but the hardness of surface was not considerably increased (Max Hv=1045 at 9hrs). Some of the nitrogen was denitrided out of the surfac and diffused into the core, and also the oxides ($Fe_3O_4$, $Fe_2O_3$) were formed on the surface of the specimen during reheating. The compound layer was partially decomposed at about $600^{\circ}C$ but the diffusion layer was increased up to $800^{\circ}C$. With increasing reheated temperture, the hardness of the surface was decreased, whereas the hardness depth of diffusion layer (0.25mm) was increased up to $600^{\circ}C$ more than that of ion nitrided (0.18mm). The blend-heat treated STD61 steel by ion nitriding is therefore expected to hold on the characteristics of ion nitriding up to $600^{\circ}C$.

• Journal of the Korean Society for Heat Treatment
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• v.6 no.1
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• pp.9-16
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• 1993

To investigate the properties of diffusion bonding of 7050 Al alloy, the diffusion bonding joints have been produced in self-made diffusion bonding hot-press which admits a defined application of the bonding pressure during the heating phase and also rapid cooling after the bonding process with various bonding condition. The strength of the bond increases with increasing the bonding time and temperature. Shear test at toom temperature showed that high strength up to 70% that of parent metal (320 MPa), 220 MPa for the specimen bonded 14 hr at $560^{\circ}C$, with 3 MPa. In this case, however, there is large deformation more than 20% reduction in thickness. The results were correlated with joint characteristics found by optical microstructure and by fractography by SEM. When the strengths of the bonds are more than 50% that of parent metal, a great deal of dimples stretched along the direction of shear stress are observed over the fractured surface of the bond. On the microstructure of the bond line, initial mophology of the bond line disapeared for the grain boundary migration with increasing the bonding time.

• Journal of the Korean Society for Heat Treatment
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• v.31 no.2
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• pp.49-55
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• 2018

A T-shape structure was manufactured by the superplastic forming and diffusion bonding process using two Ti-3Al-2.5V alloy tubes. A Ti-3Al-2.5V tube was prepared for the hydroforming in the superplastic condition until it reaches a surface area such as a roof welded in the hole of another Ti-3Al-2.5V tube. Afterward, the superplastic forming process and the diffusion bonding process were carried out simultaneously until the appropriate bonding along the interface area of two Ti-3Al-2.5V tubes was obtained. The bonding qualities were different at each location of the entire interface according to the applied process conditions such as strain, pressure, temperature, holding time, geometries, etc. The microstructures of bonding interface have been observed to understand the characteristics of the applied processes in this study.

• Journal of the Korean Society for Heat Treatment
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• v.19 no.1
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• pp.50-59
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• 2006

• Design & Manufacturing
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• v.14 no.2
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• pp.28-33
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• 2020

Recently, as the income level and quality of life have improved, the desire for a pleasant environment has increased, and a deodorization plan is required through thorough prevention and diffusion of odorous substances in waste treatment facilities recognized as hateful facilities, appropriate collection, and selection of the right prevention facilities. In this study, a waste disposal facility was modeled and computerized analysis for odor and ventilation analysis was conducted. Numerical analysis of the waste treatment facility was performed at the size of the actual plant. CATIA V5 R16 for numerical model generation and ANSYS FLUENT V.13 for general purpose flow analysis were used as analysis tools. The average air-age of the internal was 329 seconds, and the air-flow velocity was 0.384m/s. The odor diffusion analysis inside the underground pump room showed congestion-free air circulation through streamline distribution and air-age distribution. This satisfies the ASHRAE criteria. In addition, the results of diffusion analysis of odorous substances such as ammonia, hydrogen sulfide, methyl mercaptan and dimethyl sulfide were all expected to satisfy the regulatory standards. Particularly in the case of the waste loading area, the air-flow velocity was 0.297m/s, and the result of meeting the regulatory standards with 0.167ppm of ammonia, 0.00548ppm of hydrogen sulfide, 0.003ppm of methyl mercaptan, and 0.003ppm of dimethyl sulfide was found.

• Journal of Adhesion and Interface
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• v.4 no.2
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• pp.21-29
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• 2003

Hot AC anodising has been evaluated us pre-treatment for aluminium prior to structural adhesive bonding. Phosphoric and sulphuric acid hot AC anodising showed very promising adhesion promoter capabilities with durability comparable with the best standard DC anodising procedures. AC anodising does not required etching prior to anodising and offers u pre-treatment time down to 20 seconds. The interface/interphase between the aluminium substrate and the adhesive was investigated in order to get a better understanding of the involved adhesion mechanisms and to explain the long-tenn properties. The alkaline medium formed at the oxide layer/adhesive interface has been shown to induce a partial dissolution of the oxide layer leading to the formation of metallic ions which diffuse in the adhesive (EPMA measurements). The effect of diffusion of the Al ions on adhesion and joint durability is still uncertain but studies showed that pre-bond moisture affected the joints durability and to some extent the diffusion length. specially for DC anodised samples. So far no direct correlation could be established between the diffusion length d and the joints durability but new trials with better control over the elapsed time between bonding and adhesive curing are expected to help getting a better understanding of the involved mechanisms.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.2
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• pp.150-155
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• 2004

This study attempts to form a TiN barrier layer against Cu diffusion by the easier and more convenient method. In this new approach, Ti was sputter-deposited, and nitrided by heat-treating in the NH$_3$ambient. Sheet resistance of as-deposited Ti was 20 Ω/$\square$, but increased to 195 Ω/$\square$ after the heat-treatment at 30$0^{\circ}C$, and lowered to 120 Ω/$\square$ after the heat-treatment at 50$0^{\circ}C$, and $600^{\circ}C$. AES results for these thin films confirmed that the atomic ratio of Ti and N was close to 1:1 at or above 40$0^{\circ}C$ heat-treatment. However, it was also found that excessive oxygen was contained in the TiN layer. To examine the barrier property against Cu diffusion, 100nm Cu was deposited on the TiN layer and then annealed at 40$0^{\circ}C$ for 40 min.. Cu remained at the surface without diffusing into the Si layer.

• Journal of the Korean Society for Heat Treatment
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• v.25 no.2
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• pp.65-73
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• 2012

The Gas Diffusion Layer (GDL) of fuel cell, are required to provide both delivery of reactant gases to the catalyst layer and removal of water in either vapor or liquid form in typical PEMFCs. In this study, the fabrication of GDL containing Micro Porous Layer (MPL) made of the slurry of PVDF mixed with carbon black is investigated in detail. Physical properties of GDL containing MPL, such as electrical resistance, gas permeability and microstructure were examined, and the performance of the cell using developed GDL with MPL was evaluated. The results show that MPL with PVDF binder demonstrated uniformly distributed microstructure without large cracks and pores, which resulted in better electrical conductivity. The fuel cell performance test demonstrates that the developed GDL with MPL has a great potential due to enhanced mass transport property due to its porous structure and small pore size.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.08a
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• pp.59-62
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• 2003

Our Zn diffusion into n-type $GaAs_{0.60}P_{0.40}$ used ampoule-tube method to increase IV. N-type epitaxial wafers were preferred by $H_2SO_4$-based pre-treatment. $SiO_2$ thin film was deposited by PECVD for some wafers. Diffusion times and diffusion temperatures respectability are 1, 2, 3 hr and 775, $805^{\circ}C$. LED chips were fabricated by the diffused wafers at Fab. The peak wavelength of all chips showed about 625~650 nm and red color. The highest IV is about 270 mcd at the diffusion condition of $775^{\circ}C$, 3h for the wafers which didn't deposit $SiO_2$ thin films. Also, the longer diffusion time is the higher IV for the wafers which deposit $SiO_2$ thin films.