• 제목/요약/키워드: diffusion layer

검색결과 1,409건 처리시간 0.032초

Smagorinsky method와 2-level method를 이용한 난류 확산계수의 비교 연구 (Comparison study of turbulent diffusion coefficient using Smagorinsky method and 2-level method)

  • 이화운;오은주;정우식;최현정;임주연
    • 한국환경과학회지
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    • 제11권7호
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    • pp.679-686
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    • 2002
  • Turbulence greatly influence on atmospheric flow field. In the atmosphere, turbulence is represented as turbulent diffusion coefficients. To estimate turbulent diffusion coefficients in previous studies, it has been used constants or 2-level method which divides surface layer and Ekman layer. In this study, it was introduced Smagorinsky method which estimates turbulent diffusion coefficient not to divide the layer but to continue in vertical direction. We simulated 3-D flow model and TKE equation applied turbulent diffusion coefficients using two methods, respectively. Then we showed the values of TKE and the condition of each term to TKE. The results of Smagorinsky method were reasonable. But the results of 2-level method were not reasonable. Therefor, it had better use Smagorinsky method to estimate turbulent diffusion coefficients. We are expected that if it is developed better TKE equation and model with study of computational method in several turbulent diffusion coefficients for reasonably turbulent diffusion, we will able to predict precise wind field and movements of air pollutants.

PWA 1426 합금에서 Al-Si 코팅층의 미세조직 (Microstructure of Al-Si Coated Layer in PWA 1426 Alloy)

  • 안종천;이경구
    • 열처리공학회지
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    • 제12권1호
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    • pp.47-54
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    • 1999
  • Microstructure of Al-Si coated PWA 1426 alloy was studied. Diffusion coated specimens were heat treated for 4hr at $870{\sim}1087^{\circ}C$ and then were examined the changes of microstructure and interfacial compound by optical microscopy, SEM and EDS. According to the result of EDS, it is supposed that the coated layer was composed of $Ni_2Al_3$. When diffusion treatment was conducted at $1087^{\circ}C$, coated layer varied from $Ni_2Al_3$ to NiAl phase and composed of mixed, denuded and inter-diffusion layer.

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복합열처리(複合熱處理)한 연강(軟鋼)의 표면경화(表面硬化)에 관한 연구 (A Study on Surface Case Hardening of Blend Heat Treated Mild Steel)

  • 정인상;전해동;신석목
    • 열처리공학회지
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    • 제5권1호
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    • pp.23-31
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    • 1992
  • It is investigated that Fe-C-N compound layer, defusion layer, and induction hardened layer produced by nitrocarburizing blend heat treatment in austenitic temperature with high frequency induction heating of mild steel specimen sprayed sursulf salt-bath. As the temperature of blend-heat treatment got increased, the thickness and hardness of compound layer and diffusion layer were increased. Compound layer(max. $35{\mu}m$), diffusion layer (max. 2.5mm) and induction hardened layer were gained in the shortest time 10 sec and in the case of $1000^{\circ}C$ total hardness depth of those was about 3.5mm. When the blend-heat treated specimen was reheated, maximum hardness of compound layer was dropped more than that of the reheated compound layer after sursulf treated, whereas hardness of diffusion layer was increased.

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유동상로를 이용한 질화처리티타늄의 피로강도 특성 (Fatigue properties of nitrided titanium using fluidized bed furnace)

  • 김민건;지정근
    • 대한기계학회논문집A
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    • 제22권1호
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    • pp.142-147
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    • 1998
  • Rotary bending fatigue tests were carried out on the nitrided titanium in order to investigate the effect of nitriding layer on fatigue limit. Main results obtained are as follows. (1) The fatigue limit of nitrided pure titanium is remarkably reduced because of enlargement of grain size at high heat treating temperature and high stress field created from the elastic interaction in the compound layer. (2) Further test using specimen which was removed nitrified layer gradually, were also conducted and it was found that by removing the compound layer the fatigue limit recovered as the level of basic material and rather increased by coming of a diffusion layer. Therefore it is concluded that the surface compound layer generated by nitriding treatment reduced the fatigue limit but diffusion layer increased it.

Ba-페라이트/$SiO_2$ 자성박막에서 ${\alpha}-Al_2O_3$ buffer 층의 역할 (Role of ${\alpha}-Al_2O_3$ buffer layer in $Ba-ferrite/SiO$ magnetic thin films)

  • 조태식;정지욱;권호준
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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    • pp.267-270
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    • 2003
  • We have studied the interfacial diffusion phenomena and the role of ${\alpha}-Al_2O_3$ buffer layer as a diffusion barrier in the $Ba-ferrite/SiO_2$ magnetic thin films for high-density recording media. In the interface of amorphous Ba-ferrite ($1900-{\AA}-thick)/SiO_2$ thin film during annealing, the interfacial diffusion started to occur at ${\sim}700^{\circ}C$. As the annealing temperature increased up to $800^{\circ}C$, the interfacial diffusion abruptly proceeded resulting in the high interface roughness and the deterioration of the magnetic properties. In order to control the interfacial diffusion at the high temperature, we introduced ${\alpha}-Al_2O_3$ buffer layer ($110-{\AA}-thick$) in the interface of $Ba-ferrite/SiO_2$ thin film. During the annealing of $Ba-ferrite/{\alpha}-Al_2O_3/SiO_2$ thin film even at ${\sim}800^{\circ}C$, the interface was very smooth. The smooth interface of the film was also clearly shown by the cross-sectional FESEM. The magnetic properties, such as saturation magnetization 3nd intrinsic coercivity, were also enhanced, due to the inhibition of interfacial diffusion by the ${\alpha}-Al_2O_3$ buffer layer. Our study suggests that the ${\alpha}-Al_2O_3$ buffer layer act as a useful interfacial diffusion barrier in the $Ba-ferrite/SiO_2$ thin films.

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고분자 연료전지의 다공성층 내에서의 액상수분 이동에 관한 공극-네트워크 해석 연구 (Pore-network Study of Liquid Water Transport through Multiple Gas Diffusion Medium in PEMFCs)

  • 강정호;이상건;남진현;김찬중
    • 한국전산유체공학회:학술대회논문집
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    • 한국전산유체공학회 2011년 춘계학술대회논문집
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    • pp.46-53
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    • 2011
  • Water is continuously produced in polymer electrolyte membrane fuel cell (PEMFC), and is transported and exhausted through polymer electrolyte membrane (PEM), catalyst layer (CL), microporous layer (MPL), and gas diffusion layer (GDL). The low operation temperatures of PEMFC lead to the condensation of water, and the condensed water hinders the transport of reactants in porous layers (MPL and GDL). Thus, water flooding is currently one of hot issues that should be solved to achieve higher performance of PEMFC. This research aims to study liquid water transport in porous layers of PEMFC by using pore-network model, while the microscale pore structure and hydrophilic/hydrophobic surface properties of GDL and MPL were fully considered.

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반응혼합층의 층류확산화염 (Laminar Diffusion Flame in the Reacting Mixing Layer)

  • 신동신
    • 대한기계학회논문집B
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    • 제20권2호
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    • pp.605-615
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    • 1996
  • Laminar flows in which mixing and chemical reactions take place between parallel streams of reactive species are studied numerically. The governing equations for laminar flows are from two-dimensional compressible boundary-layer equations. The chemistry is a finite rate single step irreversible reaction with Arrhenius kinetics. Ignition, premixed flame, and diffusion flame regimes are found to exist in the laminar reacting mixing layer at high activation energy. At high Mach numbers, ignition occurs earlier due to the higher temperatures in the unburnt gas. In diffusion regimes, property variations affect the laminar profiles considerably and need to be included when there are large temperature differences. The maximum temperature of a laminar reacting mixing layer is almost linear with the adiabatic flame temperature at low heat release, but only weakly at high heat release.

Effect of Metal Barrier Layer for Flexible Solar Cell Devices on Tainless Steel Substrates

  • Kim, Kyoung-Bo
    • Applied Science and Convergence Technology
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    • 제26권1호
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    • pp.16-19
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    • 2017
  • A thin metal layer of molybdenum is placed between the conventional barrier layer and the stainless steel substrate for investigating the diffusion property of iron (Fe) atoms. In this study, the protection probability was confirmed by measuring the concentration of out-diffused Fe using a SIMS depth profile. The Fe concentration of chromium (Cr) barrier layer with 10 nm molybdenum (Mo) layer is 5 times lower than that of Cr barrier without the thin Mo layer. The insertion of a thin Mo metal layer between the barrier layer and the stainless steel substrate effectively protects the out-diffusion of Fe atoms.

A bilayer diffusion barrier of atomic layer deposited (ALD)-Ru/ALD-TaCN for direct plating of Cu

  • Kim, Soo-Hyun;Yim, Sung-Soo;Lee, Do-Joong;Kim, Ki-Su;Kim, Hyun-Mi;Kim, Ki-Bum;Sohn, Hyun-Chul
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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    • pp.239-240
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    • 2008
  • As semiconductor devices are scaled down for better performance and more functionality, the Cu-based interconnects suffer from the increase of the resistivity of the Cu wires. The resistivity increase, which is attributed to the electron scattering from grain boundaries and interfaces, needs to be addressed in order to further scale down semiconductor devices [1]. The increase in the resistivity of the interconnect can be alleviated by increasing the grain size of electroplating (EP)-Cu or by modifying the Cu surface [1]. Another possible solution is to maximize the portion of the EP-Cu volume in the vias or damascene structures with the conformal diffusion barrier and seed layer by optimizing their deposition processes during Cu interconnect fabrication, which are currently ionized physical vapor deposition (IPVD)-based Ta/TaN bilayer and IPVD-Cu, respectively. The use of in-situ etching, during IPVD of the barrier or the seed layer, has been effective in enlarging the trench volume where the Cu is filled, resulting in improved reliability and performance of the Cu-based interconnect. However, the application of IPVD technology is expected to be limited eventually because of poor sidewall step coverage and the narrow top part of the damascene structures. Recently, Ru has been suggested as a diffusion barrier that is compatible with the direct plating of Cu [2-3]. A single-layer diffusion barrier for the direct plating of Cu is desirable to optimize the resistance of the Cu interconnects because it eliminates the Cu-seed layer. However, previous studies have shown that the Ru by itself is not a suitable diffusion barrier for Cu metallization [4-6]. Thus, the diffusion barrier performance of the Ru film should be improved in order for it to be successfully incorporated as a seed layer/barrier layer for the direct plating of Cu. The improvement of its barrier performance, by modifying the Ru microstructure from columnar to amorphous (by incorporating the N into Ru during PVD), has been previously reported [7]. Another approach for improving the barrier performance of the Ru film is to use Ru as a just seed layer and combine it with superior materials to function as a diffusion barrier against the Cu. A RulTaN bilayer prepared by PVD has recently been suggested as a seed layer/diffusion barrier for Cu. This bilayer was stable between the Cu and Si after annealing at $700^{\circ}C$ for I min [8]. Although these reports dealt with the possible applications of Ru for Cu metallization, cases where the Ru film was prepared by atomic layer deposition (ALD) have not been identified. These are important because of ALD's excellent conformality. In this study, a bilayer diffusion barrier of Ru/TaCN prepared by ALD was investigated. As the addition of the third element into the transition metal nitride disrupts the crystal lattice and leads to the formation of a stable ternary amorphous material, as indicated by Nicolet [9], ALD-TaCN is expected to improve the diffusion barrier performance of the ALD-Ru against Cu. Ru was deposited by a sequential supply of bis(ethylcyclopentadienyl)ruthenium [Ru$(EtCp)_2$] and $NH_3$plasma and TaCN by a sequential supply of $(NEt_2)_3Ta=Nbu^t$ (tert-butylimido-trisdiethylamido-tantalum, TBTDET) and $H_2$ plasma. Sheet resistance measurements, X-ray diffractometry (XRD), and Auger electron spectroscopy (AES) analysis showed that the bilayer diffusion barriers of ALD-Ru (12 nm)/ALD-TaCN (2 nm) and ALD-Ru (4nm)/ALD-TaCN (2 nm) prevented the Cu diffusion up to annealing temperatures of 600 and $550^{\circ}C$ for 30 min, respectively. This is found to be due to the excellent diffusion barrier performance of the ALD-TaCN film against the Cu, due to it having an amorphous structure. A 5-nm-thick ALD-TaCN film was even stable up to annealing at $650^{\circ}C$ between Cu and Si. Transmission electron microscopy (TEM) investigation combined with energy dispersive spectroscopy (EDS) analysis revealed that the ALD-Ru/ALD-TaCN diffusion barrier failed by the Cu diffusion through the bilayer into the Si substrate. This is due to the ALD-TaCN interlayer preventing the interfacial reaction between the Ru and Si.

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대구상공에서의 대기 오염 물질 확산에 관한 연구 (A Study on the Diffusion of Atmospheric Pollutants over Taegu)

  • 윤일희;민경덕;박동재
    • 한국환경과학회지
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    • 제3권3호
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    • pp.241-252
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    • 1994
  • Meteorological parameters In the atmospheric boundary layer and the vertical and horizontal dispersion parameters were determined by analyzing the data obtained by the special upper-air observations of one clear day for each season from October 1991 to August 1992. The concentration of the aklospheric pollutants over Taegu was analyzed by using the application of the Gaussian diffusion model. In the diurnal variation of diffusion of atmospheric pollutants, vertical diffusion due to turbulence is active in daytime while horizontal diffusion due to wind is active in nighttime. The mean concentration of pollutants in the side of downwind is higher during the daytime than the nighttime. Thus, the height of the mixed-layer at the nighttime considered as the most important parameter of the mean concentration of pollutants. In the seasonal variation of diffusion of atmospheric pollutants, vertical diffusion due to strong solar radiation is active in summer case day, and horizontal diffusion due to strong wind is active in winter case day. In winter case day, the mean concentration of pollutants in the side of downwind is maximum in the daytime. However, in summer case day, that is maximum in the nighttime.

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