• Title/Summary/Keyword: diffuse film

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Thermal and Photochemistry of Methyl Iodide on Ice Film Grown on Cu(111)

  • Sohn, Young-Ku;White, John M.
    • Bulletin of the Korean Chemical Society
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    • v.30 no.7
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    • pp.1470-1474
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    • 2009
  • Thermal and photochemistry of methyl iodide ($CH_3I)\;adsorbed\;on\;D_2O$ ice film on Cu(111) at 100 K were studied using temperature-programmed desorption (TPD) time-of-flight mass spectrometry (TOF-MS), X-ray and ultraviolet photoelectron spectroscopies. On the basis of TPD, multilayer and monolayer $CH_3I$ molecules desorb from $D_2O$ ice layer at 120 and 130 K, respectively. Photo-irradiation at 100 K exhibits dramatic changes in the TPD and I $3d_{5/2}\;XPS\;of\;CH_3I$ on ice film, due to a dramatic dissociation of $CH_3I$. The dissociation is likely activated by solvated electrons transferred from the metal substrate during photo-irradiation. No other photo-initiated reaction products were found within our instrumental detection limit. During photo-irradiation, the $CH_3I$, $CH_3$ and I could be trapped (or solvated) in ice film by rearrangement (and self-diffusion) of water molecules. A newly appeared parent molecular desorption peak at 145 K is attributed to trapped $CH_3I$. In addition, the $CH_3$ and I may diffuse through ice and chemisorb on Cu(111), indicated by TPD and I $d_{5/2}$ XPS taken with photo-irradiation time, respectively. No molecular ejection was found during photo-irradiation at 100 K. The work functions for $CH_3I/Cu(111),\;D_2O/Cu(111)\;and\;CH_3I/D_2$O/Cu(111) were all measured to be about 3.9 eV, 1.0 eV downward shift from that of clean Cu(111).

Mechanochemically Synthesized Cu2Zn(Sn,Ge)S4 Nanocrystals and Their Application to Solar Cells (기계화학적 방법으로 합성한 Cu2Zn(Sn,Ge)S4 나노결정과 이를 이용하여 제조한 태양전지)

  • Park, Bo-In;Lee, Seung Yong;Lee, Doh-Kwon
    • Current Photovoltaic Research
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    • v.4 no.3
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    • pp.114-118
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    • 2016
  • $Cu_{1.8}Zn_{1.2}(Sn_{1-x}Ge_x)S_4$ (CZTGeS) nanocrystals were mechanochemically synthesized from elemental precursor powders without using any organic solvents and any additives. The composition of CZTGeS nanocrystals were systematically varied with different Ge mole fraction (x) from 0.1 to 0.9. The XRD, Raman spectroscopy, high-resolution TEM, and diffuse reflectance studies show that the as-synthesized CZTGeS nanocrystals exhibited consistent changes in various structural and optical properties as a function of x, such as lattice parameters, wave numbers for $A_1$ Raman vibration mode, interplanar distances (d-spacing), and optical bandgap energies. The bandgap energy of the synthesized CZTGeS nanocrystals gradually increases from 1.40 to 1.61 eV with increasing x from 0.1 to 0.9, demonstrating that Ge-doping is useful means to tune the bandgap of mechanochemically synthesized nanocrystals-based kesterite thin-film solar cells. The preliminary solar cell performance is presented with an efficiency of 3.66%.

A Study on the Chest Radiography for Reducing Exposure Dose (흉부X선촬영(胸部X線撮影)에 있어서 피폭선량(被曝線量)의 저감(低減)에 관(關)한 연구(硏究))

  • Lee, Man-Koo;Yoon, Han-Sik;Lee, Jong-Seok;Lee, Sun-Sook;Hayashi, Taro;Ishida, Yuji;Maeda, Mika;Sakurai, Tatsuya
    • Journal of radiological science and technology
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    • v.19 no.1
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    • pp.41-49
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    • 1996
  • We have been used super sensitive screen/film system which is thought to be the limit of sensitivity, however, we think this method is not satisfactory. As a general radiographic rule, reduction of exposure is inconsistent with improvement of image quality, but it is necessary to challenge this rule to get better method. We tried air gap method for minimal diffuse lung shadow which is difficult to find out by our routine method. As a result, air gap method with super sensitive screen/film system(SRO 1000/TMH) showed lower exposure dose, 50% of our routine system(SRO 750/SRH with grid), and better image quality for pulmonary pattern in the lower lung field.

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Synthesis of Few-layer Graphene Film on a Ni Substrate by Using Filtered Vacuum Arc Source Method

  • Kim, Chang-Su;Seo, Ji-Hun;Gang, Jae-Uk;Kim, Do-Geun;Kim, Jong-Guk;Lee, Hyeong-U
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.08a
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    • pp.157-157
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    • 2011
  • Graphene has generated significant interest in the recent years as a functional material for electronics, sensing, and energy applications due to its unique electrical, optical, and mechanical properties. Much of the considerable interest in graphene stems from results obtained for samples mechanically exfoliated from graphite. Practical applications, however, require reliable and well-controlled methods for fabrication of large area graphene films. Recently high quality graphene layers were fabricated using chemical vapor deposition (CVD) on nickel and copper with methane as the source of the carbon atoms. Here, we report a simple and efficient method to synthesize graphene layers using solid carbon source. Few-layer graphene films are grown using filtered vacuum arc source (FVAS) technique by evaporation of carbon atom on Ni catalytic metal and subsequent annealing of the samples at 800$^{\circ}$C. In our system, carbon atoms diffuse into the Ni metal layer at elevated temperatures followed by their segregation as graphene on the free surface during the cooling down step as the solubility of carbon in the metal decrease. For a given annealing condition and cooling rate, the number of graphene layers is easily controlled by changing the thickness of the initially evaporated amorphous carbon film. Based on the Raman analysis, the quality of graphene is comparable to other synthesis methods found in the literature, such as CVD and chemical methods.

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Effects of DC Biases and Post-CMP Cleaning Solution Concentrations on the Cu Film Corrosion

  • Lee, Yong-K.;Lee, Kang-Soo
    • Corrosion Science and Technology
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    • v.9 no.6
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    • pp.276-280
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    • 2010
  • Copper(Cu) as an interconnecting metal layer can replace aluminum (Al) in IC fabrication since Cu has low electrical resistivity, showing high immunity to electromigration compared to Al. However, it is very difficult for copper to be patterned by the dry etching processes. The chemical mechanical polishing (CMP) process has been introduced and widely used as the mainstream patterning technique for Cu in the fabrication of deep submicron integrated circuits in light of its capability to reduce surface roughness. But this process leaves a large amount of residues on the wafer surface, which must be removed by the post-CMP cleaning processes. Copper corrosion is one of the critical issues for the copper metallization process. Thus, in order to understand the copper corrosion problems in post-CMP cleaning solutions and study the effects of DC biases and post-CMP cleaning solution concentrations on the Cu film, a constant voltage was supplied at various concentrations, and then the output currents were measured and recorded with time. Most of the cases, the current was steadily decreased (i.e. resistance was increased by the oxidation). In the lowest concentration case only, the current was steadily increased with the scarce fluctuations. The higher the constant supplied DC voltage values, the higher the initial output current and the saturated current values. However the time to be taken for it to be saturated was almost the same for all the DC supplied voltage values. It was indicated that the oxide formation was not dependent on the supplied voltage values and 1 V was more than enough to form the oxide. With applied voltages lower than 3 V combined with any concentration, the perforation through the oxide film rarely took place due to the insufficient driving force (voltage) and the copper oxidation ceased. However, with the voltage higher than 3 V, the copper ions were started to diffuse out through the oxide film and thus made pores to be formed on the oxide surface, causing the current to increase and a part of the exposed copper film inside the pores gets back to be oxidized and the rest of it was remained without any further oxidation, causing the current back to decrease a little bit. With increasing the applied DC bias value, the shorter time to be taken for copper ions to be diffused out through the copper oxide film. From the discussions above, it could be concluded that the oxide film was formed and grown by the copper ion diffusion first and then the reaction with any oxidant in the post-CMP cleaning solution.

Dry thermal development of negative electron beam resist polystyrene

  • Con, Celal;Abbas, Arwa Saud;Yavuz, Mustafa;Cui, Bo
    • Advances in nano research
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    • v.1 no.2
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    • pp.105-109
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    • 2013
  • We report dry thermal development of negative resist polystyrene with low molecular weight. When developed on a hotplate at $350^{\circ}C$ for 30 min, polystyrene showed reasonable high contrast and resolution (30 nm half-pitch), but low sensitivity. Resist sensitivity was greatly improved at lower development temperatures, though at the cost of reduced contrast. In addition, we observed the thickness reduction due to thermal development was higher for larger remaining film thickness, implying the thermal development process is not just a surface process and the more volatile chains below the top surface may diffuse to the surface and get evaporated.

Characteristics of the aluminum thisn films for the prevention of copper oxidation (구리 금속선의 산화 방지를 위한 알루미늄 박막의 산화 방지 특성)

  • 이경일;민경익;주승기;라관구;김우식
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.31A no.10
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    • pp.108-113
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    • 1994
  • The characteristics of the oxidation prevention layers for the copper metallization were investigated. The thin films such as Cr, TiN and Al were used as the oxidation prevention layers for copper. Ultra thin aluminum films were found to prevent the oxidation of copper up to the highest oxidation annealing temperature among the barrier layers examined in this study. It was found that oxygen did not diffuse into copper through aluminum films because of the aluminum oxide layer formed on the aluminum surface and the ultra thin aluminum film could be a good oxidation barrier layer for the copper metallization.

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Diffusion-accompanied Phase Transformation of $TiSi_2$ Film Confined in Sub-micron Area

  • Kim, Yeong-Cheol
    • The Korean Journal of Ceramics
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    • v.7 no.2
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    • pp.70-73
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    • 2001
  • Phase transformation of TiSi$_2$ confined in sub-micron area of which the size is around or smaller than the grain size of C49 TiSi$_2$ phase is studied. It has been known that the C49 to C54 phase change is massive transformation that occurs abruptly starting from C54 nuclei located at triple point grain boundaries of C49 phase. When the C49 phase is confined in sub-micron area, however, the massive phase transformation is observed to be hindered due to the lack of the triple point grain boundaries of C49 phase. Heat treatment at higher temperatures starts to decompose the C49 phase, and the resulting decomposed Ti atoms diffuse to, and react with, the underneath Si material to form C54 phase that exhibits spherical interface with silicon. The newly formed C54 grains can also trigger the massive phase transformation to convert the remaining undecomposed C49 grains to C54 grains by serving as nuclei like conventional C54 nuclei located at triple point grain boundaries.

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Odontogenic myxoma: a case report with recent image modalities

  • Kim Jae-Duk;Kim Kwang-Won;Lim Sung-Hoon
    • Imaging Science in Dentistry
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    • v.34 no.4
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    • pp.199-202
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    • 2004
  • The odontogenic myxoma is an benign, slow growing neoplasm which is of ectomesenchymal origin. This neoplasm occurs almost exclusively in the jaw bones and comprises 0.2% to 17.7% of odontogenic tumors. The odontogenic myxoma may show a wide spectrum of radiographic appearances, unilocular, multilocular radiolucency and a distinct or diffuse border, making the differential diagnosis difficult. We present a case of the odontogenic myxoma in the maxilla with conventional and recent image modalities. Occlusal film revealed a medially extended multilocular lesion with intralesional fine and straight trabeculations from the scalloped margin and buccal expansion and thinning of cortical bone. Computed tomogram revealed lesion showed equivalent density to the muscles in the left maxillary sinus with partial cortical discontinuity of medial wall and the tennis-racket pattern with internal straight trabeculations. MRI revealed intermediate signal intensity on Tl weighted image and high signal intensity on T2 weighted image. In Gd enhanced MR image, the peripheral portions of the lesion were enhanced.

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The characteristics of joints with In-Ag alloy (Indium-silver alloy를 이용한 접합의 특성)

  • Kim, Jae-Wook;Kim, Je-Yoon;Kim, Sang-Sig;Sung, Man-Young
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.07a
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    • pp.256-258
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    • 2003
  • Two Si wafers are bonded with indium-silver alloy using diffusion bonding method. When silver and indium thin films are contacted, they diffuse into each other and form inter-metallic compounds like $AgIn_2$, $Ag_2In$, $Ag_3In$ etc. These compounds are determined by ratio of two metals. From phase diagram of Ag-In alloy, we can get the ratio of $Ag_2In$, that has high melting point about 700$^{\circ}C$, approximately 2:1. This ratio was made by controlling of film thickness. And bonding was executed by annealing and adding pressures at a time. The joint of these wafers had been observed by SEM. And we had also seen the EDS (Energy Dispersive Spectroscopy) data to analysis the component of samples.

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