• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2000.04a
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• pp.119-122
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• 2000

Dynamic deformation of metallic materials mostly accompanies substantial amounts of deformation heat. Since the flow stress of deformation is sensitive to temperature implication of heat due to plastic work is essential to the evaluation of constitutive relations. In this study a series of compression tests were conducted for SAF 2507 super duplex stainless steel and the accumulation of deformation heat was calculated through numerical integration method. Isothermal flow surfaces were deduced from subsequent logarithmic interpolation. Simple closed die forging process was analyzed and optimized with commercial FEM code applying both raw and calibrated material database.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.7 no.4
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• pp.62-67
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• 2008

In this research, we developed a pilot wire-drawing machine as well as wire end-pointing roller. Using these machines, we performed a pilot wire-drawing test at different coating material and lubricant when the reduction ratio is 10 %. To inversely compute the friction coefficient between the coating layer of wire and the surface of die for a specific lubricant, we carried out a series of three dimensional finite element analysis. Results show that the drawing force is varied with the coating material of wire at the same reduction ratio and lubricant. It is noted that the frictional coefficient in drawing is dependent on the coupled property of coating material and lubricant, indicating the best coating material for a given lubricant.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.8 no.6
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• pp.1313-1318
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• 2007

When the mold is cooled suddenly to reduce the time for forming work and improve the quality of jar50ml which is different highly at rib thickness by a series of various curvature radii, the poor quality of void, flow and deformation happens. The structure of spiral cooling circuit at cavity and core can control the temperature of inner and outer side sufficiently. And the system can control cooling and heating automatically. These things are applied to Jar mold. and so, the best quality and the effect of productivity improvement can be obtained.

• Design & Manufacturing
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• v.14 no.2
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• pp.56-61
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• 2020

Recently, research for machining next-generation micro semiconductor processes and micro patterns has been actively conducted. In particular, it is applied to various industrial fields depending on the machining method in the case of FIB (Focused ion beam) milling. In this study, intends to deal with FIB milling machining technology for ultra-precision diamond tool fabrication technology. Ultra-precision diamond tools require nano-scale precision, and FIB milling is a useful method for nano-scale precision machining. However, FIB milling has a problem of Gaussian characteristics that are differently formed according to the beam current due to the input of an ion beam source, and there are process conditions to be considered, such as a side clearance angle problem of a diamond tool that is differently formed according to the tilting angle. A series of process steps for fabrication a ultra-precision diamond tool were studied and analyzed for each process. It was confirmed that the effect on the fabrication process was large depending on the spot size of the beam and the current of the beam as a result of the experimental analysis.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.2
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• pp.263-267
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• 2013

The continuing demand for increasingly slimmer and brighter liquid crystal display (LCD) panels has led to an increased focus on the role of light guide panels (LGPs) or optical films that are used to obtain diffuse, uniform light from the backlight unit (BLU). The most basic process in the production of such BLU components is the micromachining of V-shaped grooves. Thus, given the current trend, micromachining of V-shaped grooves is expected to play increasingly important roles in today's manufacturing technology. LCD BLUs comprise various optical elements such as a LGP, diffuser sheet, prism sheet, and protector sheet with V-shaped grooves. High-aspect-ratio patterns are required to reduce the number of sheets and enhance light efficiency, but there is a limit to the aspect ratio achievable for a given material and cutting tool. Therefore, this study comprised a series of experimental evaluations conducted to determine the machining limit in microcutting V-shaped grooves on electroless nickel plated die materials when using single-crystal diamond tools with point angles of $20^{\circ}-80^{\circ}$. Cutting performance was evaluated at various cutting speeds and depths of cut using different machining methods and machine tools. The experimental results are that V-shaped patterns with angles of $80^{\circ}$ or up can be realized regardless of the machining conditions and equipment. Moreover, the feed rate has little effect on machinability, and it is thought that the fly-cut method is more efficient for shallow patterns.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.11 no.2
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• pp.189-194
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• 2018

Nowadays most integrated circuits are built using the bulk CMOS technology, but it has much difficulty in further reduction of the power consumption and die size. As a super low-power technology to solve such problems, the SOI technology attracts great attention recently. In this paper, the study results of the temperature dependency of the hot carrier effects in the n-channel MOSFETs fabricated on the thin SOI substrate were discussed. In spite that the devices employed the LDD structure, the hot carrier effects were more serious than expected due to the high series resistance between the channel region and the substrate contact to the ground, and were found to be less serious for the higher temperature with the more phonon scattering in the channel region, which resulted in reducing the hot electron generation.

• Journal of IKEEE
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• v.20 no.3
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• pp.279-284
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• 2016

This paper presents a two stage L-band power amplifier realized with a $0.32{\mu}m$ Silicon-On-Insulator (SOI) CMOS technology. To overcome a low breakdown voltage limit of MOSFET, stacked-FET structures are employed, where three transistors in the first stage amplifier and four transistors in the second stage amplifier are connected in series so that their output voltage swings are added in phase. The stacked-FET structures enable the proposed amplifier to achieve a 21.5 dB small-signal gain and 15.7 dBm output 1-dB compression power at 1.9 GHz with a 122 mA DC current from a 4 V supply. The amplifier delivers a 19.7 dBm. This paper presents a two stage L-band power amplifier realized with a $0.32{\mu}m$ Silicon-On-Insulator (SOI) CMOS technology. To overcome a low breakdown voltage limit of MOSFET, stacked-FET structures are employed, where three transistors in the first stage amplifier and four transistors in the second stage amplifier are connected in series so that their output voltage swings are added in phase. The stacked-FET structures enable the proposed amplifier to achieve a 21.5 dB small-signal gain and 15.7 dBm output 1-dB compression power at 1.9 GHz with a 122 mA DC current from a 4 V supply. The amplifier delivers a 19.7 dBm saturated output power with a 16 % maximum Power Added Efficiency (PAE). A bond wire fine tuning technology enables the amplifier a 23.67 dBm saturated output power with a 20.4 % maximum PAE. The die area is $1.9mm{\times}0.6mm$.

• Transactions of Materials Processing
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• v.23 no.2
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• pp.103-109
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• 2014

Flexibly-reconfigurable roll forming (FRRF), which is a sheet forming process for multi-curved sheet metal, may solve both the economic and technical problems incurred in using a conventional die forming process. In the FRRF process, the multi-curved sheet metal is formed by different strain distributions on the sheet metal, and the reconfigurable rollers are used as tools during the forming. Therefore, a thorough investigation focused on the reconfigurable rollers is required for the realization of the FRRF process prior to the fabrication of FRRF machine. In the current study, a series of finite element simulations were conducted to study the load distributions experienced by the reconfigurable roller. In order to verify the shape design variables, the effect of the metal thickness on the curvatures of sheet is also presented.

• JSTS:Journal of Semiconductor Technology and Science
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• v.15 no.1
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• pp.122-130
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• 2015

This paper presents a 6 Gb/s 4-channel arrayed transimpedance amplifiers (TIA) with the gain control for 4-channel passive optical network in $0.13{\mu}m$ complementary metal oxide semiconductor (CMOS) technology. A regulated cascode input stage and inductive-series peaking are proposed in order to increase the bandwidth. Also, a variable gain control is implemented to provide flexibility to the overall system. The TIA has a maximum $98.1dB{\Omega}$ gain and an input current noise level of about 37.8 pA/Hz. The die area of the fabricated TIA is $1.9mm{\times}2.2mm$ for 4-channel. The power dissipation is 47.64 mW/1ch.

• Transactions of Materials Processing
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• v.23 no.6
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• pp.376-379
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• 2014

During roll forming a sheet metal is continuously and progressively formed into a product of the required cross-section and longitudinal shape. An example product is a circular tube with a required diameter, wall-thickness and straightness. Roll forming occurs by passing the sheet through a series of forming rolls that are arranged in tandem. Each pair of forming rolls in the roll forming line plays a particular role in obtaining the required cross-section and longitudinal shape in the product. In recent years, that process is often applied to car body parts by automotive industries. In the current study, an optimal model design and proper roll-pass sequences as well as the number of forming rolls and bending angles were used to produce a sill side. The effects of the process parameters on the final shape formed by roll forming defects were evaluated.