• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.1
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• pp.13-19
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• 2012

In this study, ultrasonic vibration tool designed and made by using FEM analysis. And machining test was carried out in various machining conditions using ultrasonic vibration capable CNC machine. For work material, alumina ceramic ($Al_2O_3$) was used while for tool material diamond electroplated grinding wheel was used. To evaluate ultrasonic vibration effect, grinding test was performed with and without ultrasonic vibration in same machining condition. In ultrasonic mode, ultrasonic vibration of 20kHz was generated by HSK 63 ultrasonic actuator. The two grinding speeds, 1.67m/s and 3.35m/s, were applied. On the other hand, grinding forces were measured by KISTLER dynamometer.

• Journal of the korean Society of Automotive Engineers
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• v.12 no.2
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• pp.59-70
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• 1990

Crack of breaking toughness of most Ceramics material is 1-5MPa .root.m but that of Zirconia Ceramics is improved to be 6-8MPa .root.m and its development of machining difficult-to-machine material is on the rise as urgent subject. For general Zirconia Ceramics machining, diamond grinding wheel is generally used by selecting an appropriate one and establishing grinding condition but due to such limitations as economics, grinding efficiency and machining geometry, great interest in machining method being used for diamond tool is emphasized. But it is reported that diamond tool is oxidized by cutting heat in the air and is graphitized in vacuum, which causes bad effects on tool life. In this study, to restraint cutting heat the internal side of tool is cooled, and restraint low temperature cooling system and being experimented. Further, the machinability of diamond tool for Zirconia Ceramics machining is analyzed with respect to tool wear and stress.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2003.04a
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• pp.405-409
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• 2003

We explored a new rough grinding technique on optics materials such as Zerodur. The facility used is a NANOFORM-600 diamond turning machine with a custom grinding module and range of diamond resin bond wheel. The grinding parameters such as workpiece rotation speed depth of cut and feed rate were altered while grinding the workpiece surfaces of 20m in diameter. Surface roughness is measured by Form Talysurf series2. Our target is to define grinding conditions producing the surface roughness better than 0.02${\mu}{\textrm}{m}$ Ra and the form accuracy of around 0.2${\mu}{\textrm}{m}$ PV.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.4 no.1
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• pp.13-17
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• 2005

We explored a new rough grinding technique on optics materials such as Zerodur. The facility used is a NANOFORM-600 diamond turning machine with a custom grinding module and a range of diamond resin bond wheel. The grinding parameters such as workpiece rotation speed, depth of cut and feed rate were altered while grinding the workpiece surfaces of 20mm in diameter. Surface roughness was measured by Form Talysurf series2. Our target is to define grinding conditions producing the surface roughness smaller than $0.2{\mu}m$ Ra.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 1993.11a
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• pp.37-37
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• 1993

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 1994.04c
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• pp.38-38
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• 1994

• Journal of the Korean Society for Precision Engineering
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• v.17 no.4
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• pp.106-113
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• 2000

One of the recent changes in machining technology is rapid application of micro- and high precision grinding processes. A fine groove generation is necessary for the fabrication of optics, electronics and semiconductor parts. Slot grinding is very efficient for the generation of micro ordered groove with hard and brittle materials. In the process of slot grinding, chipping at the sharp edges and microcracks of the ground grooves are inevitable defects. Chipping should be reduced for the improvement of surface integrity. Mechanical contact with diamond grits causes microcracks at the grooves. This damage resides subsurface, and can be the cause of failure of the punch die. This paper deals with chipping generation at the sharp edges, surface integrity of side groove and fracture strength is related to the microcracks in the slot grinding.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.42-45
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• 2002

General wheel mark in mono-crystalline silicon wafer finding is able to be expected because it depends on radius ratio and angular velocity ratio of wafer and wheel. The pattern is predominantly determined by the contour of abrasive grits resulting from a relative motion. Although such a wheel mark is made uniform pattern if the process parameters are fixed, sub-surface defect is expected to be distributed non-uniformly because of characteristic of mono-crystalline silicon wafer that has diamond cubic crystal. Consequently it is considered that this phenomenon affects the following process. This paper focused on kinematic analysis of wafer grinding process and simulation program was developed to verify the effect of process variables on wheel mark. And finally, we were able to predict sub-surface defect distribution that considered characteristic of mono-crystalline silicon wafer

• Journal of the korean Society of Automotive Engineers
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• v.15 no.2
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• pp.130-143
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• 1993

Engineering ceramics have some excellent properties as the material for the mechanical components. It is, however, very difficult to grind ceramics with high efficiency because of their high strength, hardness and brittleness. In this paper, experiments are carried out to obtain the effect of "In-process dressing" to grind the Engineering ceramics with high efficiency. To save running time for dressing process and obtain restraint effect of diamond grain wear, "In-process dressing" system using WA stick type honing stone is proposed. Representative Engineering ceramics, such as AI$_{2}$O$_{3}$, Si$_{3}$N$_{4}$, are ground with diamond wheel. Also bending strength test is carried out to check upward tendancy of mecahnical properties as the result of machining defact restraint through the grinding machining method using "In-process dressing" process. Some results obtained in this study provide useful information to attain the high efficiency grinding and the high mechanical properties of Engineering ceramics.rties of Engineering ceramics.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.938-942
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• 2002

This paper has studied to obtain the grinding characteristics and optimal grinding renditions of ceramic materials in the grinding with diamond wheel by the experimental plan method. The load on wheel by varying the feed rate was related with the surface roughness due to the minute destruction phenomenon of grains for the Si$_3$${N^4} and Zr{O_2}$. The depth of cut is related with the surface roughness because the grinding is carried out by grain shedding process due to the brittle fracture phenomenon for the ${Al_2}{O_3}$. The major factors affecting the surface roughness and the optimum grinding conditions were obtained with minimum experiments using the experimental plan method.