• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2000년도 제15차 학술회의논문집
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• pp.222-222
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• 2000

The general dicing process cuts a semiconductor wafer to lengthwise and crosswise direction by using a rotating circular diamond blade. But inferior goods are made under the influence of several parameters in dicing such as blade, wafer, cutting water and cutting conditions. Moreover we can not applicable this dicing method to GaN wafer, because the GaN wafer is harder than the other wafer as GaAs. In older to overcome this problem, a new dicing process is necessary. This paper describes a new machine using scriber and precision servo mechanism in order to dice a semiconductor wafer.

• 한국기계가공학회지
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• 제19권3호
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• pp.8-13
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• 2020

Carbon fiber-reinforced plastics (CFRPs) are extremely strong and light fiber-reinforced plastics containing carbon fibers. CFRPs can be expensive to produce, but are commonly used wherever high strength-to-weight ratio and rigidity are required, such as in the aerospace, automotive, and ship superstructure industries. In CFRP drilling, the tool performance greatly varies depending on the tool shapes, cutting conditions, and diamond coating. This study developed a new type of tungsten carbide drill with multi-blade edges to evaluate the surface quality of CFRP materials according to the coating thickness of diamond-coated drills. Experiments on tool wear, surface roughness, and burr formation were conducted. The bore exit quality of a 12 mμ -coated drill was better than that of a 6 mμ -coated drill. The superior effects of the 12 mμ -coated drill and the good surface quality of CFRP were also demonstrated.

• 한국도로학회:학술대회논문집
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• 한국도로학회 2010년 추계학술대회 논문집
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• pp.447-454
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• 2010

• 한국재료학회:학술대회논문집
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• 한국재료학회 2005년도 춘계학술발표대회 및 제8회 신소재 심포지엄 논문개요집
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• pp.272-272
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• 2005

• 한국레이저가공학회:학술대회논문집
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• 한국레이저가공학회 2002년도 춘계학술발표대회 논문개요집
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• pp.65-70
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• 2002

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 춘계학술발표대회 개요집
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• pp.232-235
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• 2002

• 한국정밀공학회지
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• 제17권6호
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• pp.185-191
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• 2000

Recently, a slightest influence to the circuit can be a great damage because the size of semiconductor smaller. It must be controlled the chippingless dicing process and the precision dicing without any damage to tile circuit. In this study, the relationship between chipping effect and the force of dicing was analysed. The rate of chipping was decreased as the farce of dicing decreased. It was also examined that the farce of dicing decreased according to the lower feed rate and higher blade speed. The lower feed rate and the higher blade speed must be controlled to achieve the chippingless process.

• 한국정밀공학회지
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• 제17권5호
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• pp.70-75
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• 2000

After the patterning and probe process of wafer have been achieved, the dicing process is necessary to separate chips from a wafer. The dicing process cuts a wafer to lengthwise and crosswise direction to make many chips by using narrow circular rotating diamond blade. But inferior goods are made under the influence of complex dicing environment such as blade, wafer, cutting water and cutting conditions. This paper describes a monitoring algorithm using feature extraction in order to find out an instant of vibration signal change when bad dicing appears. The algorithm is composed of two steps: feature extraction and decision. In the feature extraction, two features processed from vibration signal which is acquired by accelerometer attached on blade head are proposed. In the decision. a threshold method is adopted to classify the dicing process into normal and abnormal dicing. Experiment have been performed for GaAs semiconductor wafer. Based upon observation of the experimental results, the proposed scheme shown a good accuracy of classification performance by which the inferior goods decreased from 35.2% to 12.8%.

• Journal of Welding and Joining
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• 제21권3호
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• pp.58-67
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• 2003

In this study, the formation mechanism of discontinuities in the laser fusion zone of diamond saw blade was investigated. $CO_2$ laser weldings were conducted along the butt between Fe base sintered tip and carbon steel shank with sets of variable welding parameters. The effect of heat input on irregular humps, outer cavity, inner cavity and bond strengh was evaluated. The optimum heat input to have a proper humps was in the range of 10.4~$17.6kJm_{-1}$. With increasing heat input, both outer and inner cavities were reduced. The outer cavity was caused by insufficient refill of keyhole, while inner cavity was caused by trapping of bubble in molten metal. The bubble came from sintered tip and intensive vaporization at bottom tip of the keyhole. A gas formation and low melting point element vaporization were not occurred during welding. We could not find any relationship between bond strength and amount of discontinuities. Because the fracture were occurred in not only sintered tip but also carbon steel shank due to hardness distributions.

• 한국재료학회지
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• 제14권6호
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• pp.425-431
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• 2004

A laser welding was applied between sintered tip of Fe-Co-W and low carbon steel shank for the diamond saw blade. The welding characteristics and formation of defects were investigated carefully for the weld fusion zone in different welding condition. Dendrite arm spacing in weld bead decreased with decrease of heat input. Co and W increased and Fe decreased in the weld fusion zone with increase of the heat input. The corresponding change of composition was observed with the change of beam position. The maximum and total length of crack decreased with increase of the heat input. The crack in weld bead was propagated along the dendrite boundary and was caused mainly by the segregation of constituent during the solidification.