• 제목/요약/키워드: development directions

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Exploring R&D Policy Directions for Semiconductor Advanced Packaging in Korea Based on Expert Interviews (국내 반도체 첨단패키징 R&D 정책방향: 산학연 전문가 조사를 중심으로)

  • S.J. Min;J.H. Park;S.S. Choi
    • Electronics and Telecommunications Trends
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    • v.39 no.3
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    • pp.1-12
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    • 2024
  • As the demand for high-performance semiconductors, such as chips for artificial intelligence and high-bandwidth memory devices, increases along with the limitations of ultrafine processing technology in the semiconductor in-line process, advanced packaging becomes an increasingly important breakthrough technology for further improving semiconductor performance. Major countries, including Korea, the United States, Taiwan, and China, and large companies are strengthening their technological industry capabilities through the development of advanced packaging technology and policy support. Nevertheless, Korea has a lower level of development of related technologies by approximately 66% compared with the most advanced countries. Therefore, we aim to discover the needs for an advanced packaging research and development (R&D) policy through written expert interviews and importance satisfaction analysis. As a result, various implications for R&D policy directions are suggested to strengthen the technological capabilities and R&D ecosystem of the Korean advanced packaging technology.

An Efficient Separable Weighting Method for Sonar Systems with Non-Separable Planar Arrays (소나시스템 비분리 평면센서배열의 효율적인 분리 가중치 기법)

  • Do, Dae-Won;Kim, Woo-Sik;Lee, Dong-Hun;Kim, Hyung-Moon;Choi, Sang-Moon
    • Journal of the Institute of Electronics and Information Engineers
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    • v.50 no.5
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    • pp.208-217
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    • 2013
  • When a beamforming can be processed separately in horizontal and vertical directions with the planar arrays used in sonar systems, there are several merits such as that practically reduce the required computations and volumes. However, the common planar arrays used in sonar systems are generally non-separable, so the beamforming with separable weighting results in the differences between the desired beam characteristics and the resultant beam characteristics. In this paper, we propose a new separable weighting method which can achieve the wanted beam characteristics by using the separable weights in horizontal and vertical directions for the non-separable planar arrays. In order to achieve the wanted beam characteristics, the proposed method minimizes the differences between the desired weights and the resultant weights based on the number of effective sensors in horizontal and vertical directions of the planar arrays.