• Journal of the Korean Ceramic Society
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• v.30 no.8
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• pp.678-684
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• 1993

Alumina composite membranes were prepared by chemical vapor deposition and evaporation-oxidation process. For CVD process, deposition was carried out using aluminum-tri-isopropoxide at 35$0^{\circ}C$, 2 torr by heterogeneous reaction, and for evaporation-oxidation process, alumina composite membranes were prepared by evaporation of aluminum and dry oxidation at 80$0^{\circ}C$. As deposition time increases, water flux and N2 gas permeability of the composite membranes prepared by both processes were reduced. Applying gas permeation model, permeability and cracking possibility of top layer were evaluated.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.648-650
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• 2009

We investigate nematic liquid crystal (NLC) alignment on ion-beam exposed ZnO films. ZnO is optically transparent material in the visible range. We optimized the deposition parameters such as deposition temperature and gas ratio for high transmittance and resistivity. Using ion-beam treated ZnO films, LC cells are fabricated and the conditions such as exposure energy and time for uniform alignment are found. The NLC molecules align parallel to the ion-beam exposure direction. The electro-optic and response characteristics show the possibility of application of this method in liquid crystal display.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.1483-1484
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• 2000

Dielectric thin films of PLT(Pb(La.Ti)O3) for the application of highly integrated memory devices have been deposited on Pt/Ti/SiO2/Si substrates in situ by pulsed laser deposition(PLD). We have systematically investigated the variation of grain sizes depending on the condition of post-annealing and the variation of deposition rate. Both in-situ annealing and ex-situ annealing have been compared depending on the annealing time. C-V measurement, ferroelectric properties, leakage current and SEM were performed to investigate the electrical properties and the microstructural properties of Pb(La,Ti)$O_3$ films.

• Bulletin of the Korean Chemical Society
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• v.34 no.2
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• pp.505-509
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• 2013

A low temperature ($65^{\circ}C$) thermal deposition process was developed for depositing a silver coating on thermally sensitive polymeric substrates. This low temperature deposition was achieved by chemical reduction of a silver alkylcarbamate complex with latent reducing agent. The effects of acetol as a latent reducing agent for the silver 2-ethylhexylcarbamate (Ag-EHCB) complex and their blend solutions were investigated in terms of reducing mechanism, and the size and shape of silver nanoparticles (Ag-NPs) as a function of reduced temperature and time, and PVP stabilizer concentration were determined. Low temperature deposition was achieved by combining chemical reduction with thermal heating at $65^{\circ}C$. A range of polymer film, sheet and molding product was coated with silver at thicknesses of 100 nm. The effect of process parameters and heat treatment on the properties of silver coatings was investigated.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.5
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• pp.340-346
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• 1998

In this study, we intended to investigate aging effect of polyimide prepared by VDPD(vapor deposition polymerized method). The prepared polymide was treated by the oxygen and argon gas plasma. And we evaluated the polyimide treated by plasma from contact angle, surface leakage current, FT-IR and SEM. We know that the structure of polyimide at surface are changed to amide structure by plasma treating. It seems that strong energy of plasma causes breaking the molecular chin of the polyimide. And surface roughness increases with plasma treating time increased and sequentially the wettability and leakage current increases.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.11a
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• pp.373-376
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• 1997

Diamond thin films were deposited on P-type(100) Si wafers using MPECVD. Prior to deposition, mechanical scretching was done to improve density of nucleation sites with diamond paste of 0.25${\mu}{\textrm}{m}$ size. Diamond films were deposited under the following conditions : methane concentration of 0.5~5%, oxygen concentration of 0~70%, process pressure of 70Torr, process temperature of 900~95$0^{\circ}C$, and deposition time 5hrs. The changes of the morphology and the growth rates of the deposits with the experimental conditions are expriend by Scanning Electron Microscopy. Raman Spectroscopy and X-ray Diffraction method.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.312-313
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• 2006

The primary aim pursued by the preparation of separation membrane is the preparation of the membrane thin as well as with no defect. The field-flow fractionation deposition is a new molding technology which can overcome the traditional disadvantages such as multi-preparation to the preparation of great area of separation membrane with no defect. Therefor the mainly ingredients which influence the appearance and performance of titanium membrane layer are investigated by scanning electricity mirror (SEM) as well as porous material testing instrument: powder performance prepared and confected; selection of supporting body; sintering system such as temperature and time. It is shown that the membrane thickness can be controlled at $50{\mu}m$ or so; the filtration precision mainly rests with powder performance and selection of supporting body and little sintering system

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.125-128
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• 1999

(Ba$_{0.6}$Sr$_{0.4}$)TiO$_3$(BST) thin films were fabricated with different deposition temperature by Pulsed Laser Deposition(PLD). This BST thin films showed a maximum dielectric constant value of $\varepsilon$$_{r}$=~684 and dielectric loss was ~0.01 when substrate temperature was 75$0^{\circ}C$. Charge storage density of BST thin film was 4.733 [$\mu$C/$\textrm{cm}^2$] and estimated charging time was 0.15 nsec. Leakage current density of BST thin film was below 10$^{-7}$ [A/$\textrm{cm}^2$] at 3V. 3V.V.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.461-461
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• 2010

For a low dielectric constant inter-metal dielectric application, the low-k SiCOH film with a dielectric constant of 2.8-3.2 has been deposited by plasma-enhanced chemical vapor deposition with decamethylcyclopentasiloxane, cyclohexane, and helium which is carrier gas. In this work, we investigated chemical deposition rate, dielectric constant, characterization of plasma polymer films according to temperature(25C-200C) of substrate and change of component concentration. We measured impedance by using V-I prove during process. From experimental result, deposition rate decrease with increasing temperature. Through real time impedance analysis of chamber, we find corelation between film thickness and impedance by assuming equivalent circuit.

• YAKHAK HOEJI
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• v.27 no.1
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• pp.1-10
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• 1983

Voltammetric deposition and differential pulse anodic stripping (DPASV) of Ge(IV)at a gold electrode was investigated. Germanium (IV) exhibits two stripping peaks by DPASV in sodium borate solution, the first peak at about -1.1v. vs SCE and the second one, in the range of -0.6 to -0.2v. vs SCE. Factors affecting the sensitivity and precision included the nature of working electrode, supporting electrolytes, deposition potential, deposition time, pH, pulse height, voltage scan rate. The relative standard deviation of the measurements of the peak currents, for 100ng/ml Ge(IV), was less than ${\pm}3%$. The detection limit of Ge(IV) was 0.01ng/ml. Percent recovery in the extraction procedure of Ge(IV) from matrices by benzene in c-HCl, followed by back extraction with saturated borax solution, ranged from 96 to 104%.