• Journal of the Korean institute of surface engineering
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• v.41 no.5
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• pp.226-231
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• 2008

Titanium and its alloy have been widely used in dental implant and orthopedic prostheses. Electrochemical characteristics of dental implant in the various simulated body fluids have been researched by using electrochemical methods. Ti-6Al-4V alloy implant was used for corrosion test in 0.9% NaCl, artificial saliva and simulated body fluids. The surface morphology was observed using scanning electron microscopy (SEM) and energy dispersive x-ray spectroscopy (EDX). The electrochemical stability was investigated using potentiosat (EG&G Co, 263A). The corrosion surface was observed using scanning electron microscopy (SEM). From the results of potentiodynamic test in various solution, the current density of implant tested in SBF and AS solution was lower than that of implant tested in 0.9% NaCl solution. From the results of passive film stability test, the variation of current density at constant 250 mV showed the consistent with time in the case of implant tested in SBF and AS solution, whereas, the current density at constant 250mV in the case of implant tested in 0.9% NaCl solution showed higher compared to SBF and AS solution as time increased. From the results of cyclic potentiodynamic test, the pitting potential and |$E_{pit}\;-\;E_{corr}$| of implant tested in SBF and AS solution were higher than those of implant tested in 0.9% NaCl solution.

• Journal of the Korean institute of surface engineering
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• v.41 no.6
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• pp.292-300
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• 2008

Dental implant system is composed of abutment, abutment screw and implant fixture connected with screw. The problems of loosening/tightening and stability of abutment screw depend on surface characteristics, like a surface roughness, coating materials and friction resistance and so on. For this reason, surface treatment of abutment screw has been remained research problem in prosthodontics. The purpose of this study was to investigate the stability of TiN and WC coated dental abutment screw, abutment screw was used, respectively, for experiment. For improving the surface characteristics, TiN and WC film coating was carried out on the abutment screw using EB-PVD and sputtering, respectively. In order to observe the coating surface of abutment screw, surfaces of specimens were characterized, using field emission scanning electron microscope(FE-SEM) and energy dispersive x-ray spectroscopy(EDS). The stability of TiN and WC coated abutment screw was evaluated by potentiodynamic, and cyclic potentiodynamic polarization method in 0.9% NaCl solution at $36.5{\pm}1^{\circ}C$. The corrosion potential of TiN coated specimen was higher than those of WC coated and non-coated abutment screw. Whereas, corrosion current density of TiN coated screws was lower than those of WC coated and non-coated abutment screw. The stability of screw decreased as following order; TiN coating, WC coating and non-coated screw. The pitting potentials of TiN and WC coated specimens were higher than that of non-coated abutment screw, but repassivation potential of WC coated specimen was lower than those of TiN coated and non-coated abutment screws due to breakdown of coated film. The degree of local ion dissolution on the surface increased in the order of TiN coated, non-coated and WC coated screws.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of the Korean Electrochemical Society
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• v.3 no.2
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• pp.90-95
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• 2000

Cycle life test was carried out to evaluate the failure modes of the gel type nth batteries at $C_5$ currents and $100\%$ DOD. When the batteries were charged at constant voltage of 2.40 V and 2.50 Vi respectively, cycle lift was over 1,000 cycles. The batteries lost 426.4 g and 391.2 g of electrolyte far each case after the weight measurement. The battery charged at 2.50 V was shown to have a better cyclic performance than charged at 2.40 V, and the amounts of electrolyte loss was proportional to charge factor. After cycle test, the micro-structure of positive active material was completely changed and the corrosion layer of positive grid was about $50{\mu}m$. Failure mode of the positive plate of the gel type battery was a shedding of the positive active material, and the cause of discharge capacity decrease was found to be a electrolyte loss.

• Korean Journal of Materials Research
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• v.26 no.8
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• pp.401-405
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• 2016

The cobalt silicides were investigated for employment as a catalytic layer for a DSSC. Using an E-gun evaporation process, we prepared a sample of 100 nm-thick cobalt on a p-type Si (100) wafer. To form cobalt silicides, the samples were annealed at temperatures of $300^{\circ}C$, $500^{\circ}C$, and $700^{\circ}C$ for 30 minutes in a vacuum. Four-point probe, XRD, FE-SEM, and CV analyses were used to determine the sheet resistance, phase, microstructure, and catalytic activity of the cobalt silicides. To confirm the corrosion stability, we also checked the microstructure change of the cobalt silicides after dipping into iodide electrolyte. Through the sheet resistance and XRD results, we determined that $Co_2Si$, CoSi, and $CoSi_2$ were formed successfully by annealing at $300^{\circ}C$, $500^{\circ}C$, and $700^{\circ}C$, respectively. The microstructure analysis results showed that all the cobalt silicides were formed uniformly, and CoSi and $CoSi_2$ layers were very stable even after dipping in the iodide electrolyte. The CV result showed that CoSi and $CoSi_2$ exhibit catalytic activities 67 % and 54 % that of Pt. Our results for $Co_2Si$, CoSi, and $CoSi_2$ revealed that CoSi and $CoSi_2$ could be employed as catalyst for a DSSC.

• Applied Chemistry for Engineering
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• v.10 no.4
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• pp.620-627
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• 1999

Electrochemical properties of the Al current collector being used in lithium ion batteries have been studied in the 4 different aprotic electrolytes(1 M $LiBF_4$ EC : DMC, 1 M $LiBF_4$ EC : EMC. 1 M $LiPF_6$ EC : DMC. 1 M $LiPF_6$ EC : EMC) employing cyclic voltammetry and impedance measurement. Al electrode showed a wide range of the electrochemical window(0.5~4.1 V vs. $Li/Li^{+}$). However, solid interfacial materials has been formed on the Al surface due to reduction of impurities($H_2O$, $O_2$, etc), lithium salts, and electrolytes at low applied potentials, and aluminum oxides in the highly oxidizing potential as well. Especially, Al current collector was susceptible to localized in consequence of impurities in electrolytes.

• Journal of the Korean Ceramic Society
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• v.41 no.1
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• pp.69-75
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• 2004

The degree of the indentation damage and strength degradation for 3Y-TZP ceramics and (Y,Nb)-TZP/$Al_2O_3$ dental implant composites was investigated under the Hertzian cyclic fatigue. Fatigue tests were conducted at contact loads of 500 to 3000 N and up to $10^6$ cycles in exact in vitro environments. At 500 N, no strength degradation and crack generation was observed up to $5{\times}10^5$ contact cycles. Fatigue properties of 3Y-TZP ceramics was superior to (Y,Nb)-TZP/ㅍ composites due to stress relief caused by the phase transformation from tettagonal to monoclinic phase. As contact load increased, the drastic reduction in strength was found when the damage transition from ring to radial crack occurred. The extent of strength degradation was more pronounced in vitro environments probably due to chemical corrosion of artificial saliva through cracks introduced during large numbers of contacts.

• Proceedings of the Korea Concrete Institute Conference
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• 2008.04a
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• pp.333-336
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• 2008

CFRP tendons have been attempted in concrete structures as a substitute for steel tendons considering their many advantages such as the corrosion-resistance, light weight etc. However, the elastic behavior up to failure is likely to result in ductility problems. To overcome such problems, prestress concrete beams with partially bonded tendons have been developed and suggested. In this new system, the un-bonded part near the mid-span contributes to the improvement of ductility. And the bonded parts at both ends play a role as a safe anchorage. According to the previous research on the static behavior, the suggested method has demonstrated enough ductility and strength. However it is essential to verify the long-term safety for repetitive fatigue loads under service states. For this purpose, flexural fatigue loading tests were carried out in this research. This paper includes an experimental investigation on the static load-carrying capacities of the beams with or without fatigue tests. The results showed that the beams prestressed with partially bonded CFRP tendons possessed good fatigue capacity under the constant cyclic loads.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.40 no.12
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• pp.1027-1035
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• 2016

In this study, a strain-controlled fatigue test of widely-used 316L stainless steel with excellent corrosion resistance and mechanical properties was conducted, in order to assess its fatigue life. Low cycle fatigue behaviors were analyzed at room temperature, as a function of the strain amplitude and strain ratio. The material was hardened during the initial few cycles, and then was softened during the long post period, until failure occurred. The fatigue life decreased with increasing strain amplitude. Masing behavior in the hysteresis loop was shown under the low strain amplitude, whereas the high strain amplitude caused non-Masing behavior and reduced the mean stress. Low cycle fatigue life prediction based on the cyclic plastic energy dissipation theory, considering Masing and non-Masing effects, showed a good correlation with the experimental results.