• Journal of the Korean Society of Industry Convergence
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• v.2 no.1
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• pp.69-75
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• 1999

Intending to develop a new rubber curing process using only microwave, the both the characteristics of cure and the mechanical properties of rubbers for the tire tread, for which a green styrene-butadiene compounds had been cured with 2.45 GHz microwave, have been compared with those of the custom thermal cured rubber. The unintentional hot spot formation in the compound during the microwave curing has not found where the compound has a microwave absorbing ceramic powders in 4.18 weight percents and the supplying voltage has been adjusted to 90 volts. The new microwave process accomplished preheating to 418K in a quarter of the thermal cure time. The average tensile strength of the microwave-cured rubber indicating $190kg/cm^3$ was compatible to that of the thermal cure. In conclusion, the new microwave cure had approved to be applicable in a commercial plant.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2001.05a
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• pp.219-223
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• 2001

The on-line cure monitoring during the cure process of composite materials is important for better quality and productivity. The dielectric sensor for cure monitoring consists of base film and electrodes. Because the characteristic of dielectric sensor for the on-line cure monitoring is dependent on the base material, width and number of electrode, etc, the dielectric sensor should be standardized. And the selection of base film material of sensor is very important. In order to prevent the measuring errors generated from the increase of environmental temperature, the base film material should have stable dielectric constant with respect to environmental temperature. In this study, the newly developed dielectric sensor for cure monitoring was designed and the dissipation factor which is function of degree of cure was measured using the sensor. The relationship between the dissipation factor and degree of cure with respect to environmental temperature was investigated.

• Proceedings of the KSME Conference
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• 2001.11a
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• pp.797-803
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• 2001

The on-line cure monitoring of fiber reinforced thermosetting resin matrix composite material was performed for the better quality and productivity during manufacturing. Since the dissipation factor measured by dielectrometry method is dependent on the degree of cure and temperature of resin, in this study, a new method to obtain the degree of cure during on-line cure monitoring for glass/polyester composites was developed by employing a combination function of the temperature and the dissipation factor. Two sensor signals from a K-type thermocouple and an interdigitated dielectric sensor were processed during curing process under various cure cycles. The DSC (Differential Scanning Calorimetry) data was also used for the reference of degree of cure.

• Composites Research
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• v.33 no.2
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• pp.44-49
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• 2020

The cure kinetics of carbon fiber-reinforced prepreg for Vacuum Bag Only(VBO) process was studied by differential scanning calorimetry (DSC). The total heat of reaction (ΔH_total = 537.1 J/g) was defined by the dynamic scanning test using prepregs and isothermal scanning tests were performed at 130℃~180℃. The test results of isothermal scanning were observed that the heat of reaction was increased as the temperature elevated. The Kratz model was applied to analyze the cure kinetics of resin based on the test results. To verify the simulation model, the degree of cure from panels using different cure cycles were compared with the measurement. The simulation model showed that the error against the experimental value was less than 3.4%.

• Transactions of the Korean Society of Mechanical Engineers
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• v.19 no.2
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• pp.527-536
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• 1995

Analysis of pultrusion process for the thermosetting composites containing volatiles was performed. Degree of cure, amount of volatile evolved and pulling force were calculated for the processing variables such as die temperature and pulling speed. Cure kinetics was modeled from the data obtained by DSC(Differential Scanning Calorimeter). The volatile evolution kinetics was modeled from the data by DSC as well as TGA(Thermo Gravimetric Analyzer). The cure kinetics and volatile evolution kinetics models were incorporated into the energy equation. The resulting governing equation was solved using finite element method. Pulling force was calculated through the analysis of pressure developed inside the pultrusion die. Experiments were performed and the data were compared with the calculated results. Good agreements were observed.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.10a
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• pp.323-327
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• 2009

Silicone is recently used for LED chip encapsulment due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for both curing and cooling process during silicone molding. For analysis of curing process, a cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the curing as well as the cooling process should be designed carefully so as to reduce the residual stress although the cooling process plays the bigger role than curing process in determining the final residual stress state.

• Design & Manufacturing
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• v.17 no.1
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• pp.1-5
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• 2023

In multi-material injection molding, since two or more materials with different process conditions are used, it is essential to maximize process efficiency by operating the cooling or heating system to a minimum. In this study, Liquid silicone rubber (LSR) that can be cured at a low temperature suitable for the multi-material injection molding was selected and the cure behavior according to the process conditions was analyzed through differential scanning calorimetry (DSC). Dynamic measurement results of DSC with different heating rate were obtained, and through this, the total heat of reaction when the LSR was completely cured was calculated. Isothermal measurement results of DSC were derived for 60 minutes at each temperature from 80 ℃ to 110 ℃ at 10 ℃ intervals, and the final degree of cure at each temperature was calculated based on the total heat of reaction identified from the Dynamic DSC measurement results. As the result, it was found that when the temperature is lowered, the curing start time and the time required for the curing reaction increase, but at a temperature of 90 ℃ or higher, LSR can secure a degree of cure of 80% or more. However, at 80 ℃., it was found that not only had a relatively low degree of curing of about 60%, but also significantly increased the curing start time. In addition, in the case of 110 ℃, the parameters were derived from experimental result using the Kamal kinetic model.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2001.10a
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• pp.43-48
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• 2001

To overcome the disadvantages of conventional excavation technology, various trenchless (or excavation free, or no-dig) repair-reinforcement technologies have been developed and tried. But trenchless technologies so fat developed have some brawbacks such as high cost and inconvenience of operation. In this study, a repairing-reinforcing process for underground pipes with glass fiber fabric polymer composites using VARTM(Vacuum Assisted Resin Transfer Molding) has been developed. The developed process requires shorter operation time and lower cost with smaller and simpler operating equipments than those of the conventional trenchless technologies. For the reliable operation of the developed method, a simple method to apply pressure and vacuum to the reinforcement was devised and flexible mold technology was tried. Also, resin filling and cure status during RTM process were monitored with a commercial dielectrometry cure monitoring system, LACOMCURE. From the investigation, it has been found that the developed repairing-reinforcing technology with appropriate process variables and on-line cure monitoring has many advantages over conventional methods.

• Transactions of Materials Processing
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• v.24 no.2
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• pp.101-106
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• 2015

Recently, silicone is being used for LED chip lens due to its good thermal stability and optical transmittance. In order to predict residual stresses, which cause optical birefringence and mechanical warpage of silicone, a finite element analysis was conducted for the curing of silicone during molding. For the analysis of the curing process, a dynamic cure kinetics model was derived based on the results of a differential scanning calorimetry (DSC) testing and applied to the material properties for finite element analysis. Finite element simulation results showed that a step cure cycle reduced abrupt reaction heat and showed a decrease in the residual stresses.

• Journal of the Korean Society for Nondestructive Testing
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• v.23 no.5
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• pp.409-417
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• 2003

Cure monitoring can be used to improve the quality and productivity of thermosetting resin matrix composite products during their manufacturing process. In this work, the sensitivity of dielectrometry was improved by adequate separation the efforts of sensor and externals on the measured signal. A new algorithm to obtain the degree of cure during dielectric cure monitoring of glass/polyester and glass/epoxy composites was developed by employing a function of both temperature and dissipation factor, in which five cure monitoring parameters were used to calculate the degree of cure. The decreasing pattern of dissipation factor was compared with the relationships between the degree of cure and the resin viscosity. The developed algorithm might be employed for the in situ cure monitoring of thermosetting resin composites.