• Korean Journal of Materials Research
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• v.11 no.9
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• pp.727-732
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• 2001

The cure kinetics of diglycidyl ether of bisphenol A (DGEBA)/4,4'- methylene dianiline (MDA) system with synthesized phenyl glycidyl ether-dimethylurea (PGE-DMU) was studied by Kissinger and Ozawa equations with DSC analysis in the temperature range of $20~300^{\circ}C$ To investigate the reaction mechanism between epoxy group of PGE and urea group of DMU, FT-lR spectroscopy analysis was used. The epoxide group of PGE reacted with the urea group of DMU and formed a hydroxyl group which acted as a catalyst on the cure reaction of other epoxide and amine groups. The activation energy of DGEBA/MDA system without PGE-DMU was 46.5 kJ/mol and those of the system with 5 and 10 phr of PGE- DMU were 43.4 and 37.0 kJ/mol, respectively. Ozawa method also showed the same tendency.

• Korean Journal of Materials Research
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• v.5 no.6
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• pp.667-672
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• 1995

Cure kinetics of DGEBA(diglycidyl ether of bisphenol A)/MDA(4, 4'-methylene dianiline)/SN(succinonitrile) system and DGEBA/MDA/SN/HQ(hydroquinone) system was studied by Kissinger equation and Fractional life method through DSC in the temperature range of 85∼150$^{\circ}C$. As cure temperature was increased, reaction rate increased and reaction order was almost constant. The reaction rate of the system with HQ as a catalyst was more higher and activation energy of that was lower about 20% than those of the system without HQ. Starting temperature of cure reaction for DGEBA/MDA/SN/HQ system decreased about 30$^{\circ}C$ than that of DGEBA/MDA/SN system.

• The Korean Journal of Rheology
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• v.11 no.2
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• pp.135-142
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• 1999

The effects of 1 wt.% N-benzylpyrazinium hexafluoroantimonate (BPH) as a thermal latent initiator and blend compositions composed of 0, 5, 10, 20 and 40 wt.% of phenol-novolac resin to epoxy resin were investigated in terms of cure kinetics, thermal stabilities and rheological properties. Thermal latent properties of BPH were measured from the conversion as a function of reaction temperature on a dynamic DSC. This cationic BPH system turned out to be an effective thermal latent initiator in the epoxy-phenol curing system. And the increase of phenol-novolac resin concentration led to the decrease in the latent temperature and to the increase of cure activation energy ($E_a$) of the blend system. The thermal stability and activation energy ($E_t$) for decomposition, gel-time and activation energy ($E_c$) for cross-linking from rheometer increased within the composition range of 20~40 wt.% of phenol-novolac resin. This implies that the three-dimensional cross-linking may take place among hydroxyl group within phenol resin, epoxide ring within epoxy resin and BPH.

• Polymer(Korea)
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• v.25 no.2
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• pp.177-185
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• 2001

In this work, the cure kinetics and rheological properties of difunctional epoxy(diglycidylether of bisphenol A, DGEBA)/polysulfone (PSF) blends were investigated using differential scanning calorimeter and rheometer. From the DSC results of the blends, the temperature of the exothermic peak and cure activation energy (E) using a half-width method were increased with increasing the PSF content to neat epoxy resin up to 30 wt%. However, a marginal decrease in the blend system was shown in E. The conversion ($\alpha$) and conversion rate (d$\alpha$/dt) were decreased as the content of PSF increases. Rheological properties of the blend system were investigated under isothermal condition using a rheometer. Cross-linking activation energy (E$_{c}$) was determined from the Arrhenius equation based on gel time and curing temperature. As a result, the E$_{c}$ showed a similar behavior with E which could be resulted from high viscosity of PSF and the phase separation between DGEBA and PSF.PSF.f PSF and the phase separation between DGEBA and PSF.PSF.

• Elastomers and Composites
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• v.48 no.2
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• pp.161-166
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• 2013

Thermal degradation behavior of chlorine cure-site ACM and carboxylic cure-site ACM rubbers was studied by non-isothermal TGA thermal analysis. Carboxylic cure-site ACM rubber exhibited comparatively more thermally stable than chlorine cure-site ACM, showing higher peak temperature, at which maximum reaction rate occurred. Activation energies from Kissinger method were calculated as 118.6 kJ/mol for the chlorine cure-site ACM and 105.5 kJ/mol for the carboxylic cure-site ACM, showing similar values from Flynn-Wall-Ozawa analysis over the conversion range of 0.1~0.2. From the analysis of the reaction order change, both samples seemed thermally decomposed through the multiple reaction mechanism as is the common rubber materials.

• Proceedings of the Korean Fiber Society Conference
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• 1999.10a
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• pp.9-12
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• 1999

• Proceedings of the Materials Research Society of Korea Conference
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• 2001.05a
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• pp.161-161
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• 2001

• Proceedings of the Materials Research Society of Korea Conference
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• 1999.05a
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• pp.141-141
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• 1999

• Macromolecular Research
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• v.17 no.8
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• pp.585-590
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• 2009

The cure behaviors, dielectric characteristics and fracture toughness of diglycidylether of bisphenol-A (DGEBA)/poly(ethylene terephthalate) (PET) blend system were investigated. The degree of conversion for the DGEBA/PET blend system was measured using Fourier transform infrared (FTIR) spectroscopy. The cure kinetics were investigated by measuring the cure activation energies ($E_a$) with dynamic differential scanning calorimetry (DSC). The dielectric characteristic was examined by dielectric analysis (DEA). The mechanical properties were investigated by measuring the critical stress intensity factor ($K_{IC}$), critical strain energy release rate ($G_{IC}$), and impact strength test. As a result, DGEBAIPET was successfully blended. The Ea of the blend system was increased with increasing PET content to a maximum at 10 phr PET. The dielectric constant was decreased with increasing PET content. The mechanical properties of the blend system were also superior to those of the neat DGEBA. These results were attributed to the increased cross-linking density of the blend system, resulting from the interaction between the epoxy group of DGEBA and the carboxyl group of PET.

• Journal of the Korean Society for Precision Engineering
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• v.28 no.2
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• pp.219-225
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• 2011

Silicone resin is recently used as encapsulant for high-power LED module due to its excellent thermal and optical properties. In the present investigation, finite element analysis of cure process was attempted to examine residual stress evolution behavior during silicone resin cure process which is composed of chemical curing and post-cooling. To model chemical curing of silicone, a cure kinetics equation was evaluated based on the measurement by differential scanning calorimeter. The evolutions of elastic modulus and chemical shrinkage during cure process were assumed as a function of the degree of cure to examine their effect on residual stress evolution. Finite element predictions showed how residual stress in cured silicone resin can be affected by elastic modulus and chemical shrinkage behavior. Finite element analysis is supposed to be utilized to select appropriate silicone resin or to design optimum cure process which brings about a minimum residual stress in encapsulant silicone resin.