• 한국표면공학회지
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• 제28권4호
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• pp.243-254
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• 1995

The fabrication process of Cu-base anode for replacing Ni-base anode of molten carbonate fuel cell was investigated. Electrochemical performance and thermal stability of Cu-base anode were also investigated. Green sheet was prepared by mixing Cu and Ni powder with 1.5wt% methylcellulose and 100wt% water. The pore-size distribution of the Cu-base anode sintered at $800^{\circ}C$ for 30min showed almost uniform pore-size ranging from 4 to 20$\mu\textrm{m}$ and it was considered suitable for MCFC anode. Cu-Ni anode containing between 35 to 50wt% Ni exhibited current density of 111mA/$\textrm{cm}^2$ at 100mV overpotential and it was almost the some value for pure Ni anode. The sintering resistance of Cu-Ni increased with an increase of Ni addition. It was considered that the increase of sintering resistance was due to the decrease of diffusion rate of Cu and Ni with increasing the addition of Ni in Cu-Ni alloy.

• 공업화학
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• 제9권5호
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• pp.719-725
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• 1998

Salicylaldehyde와 2-hydroxy-1-naphthaldehyde를 2-aminophenol과 2-amino-p-cresol에 반응시켜 세자리 Schiff base 리간드들을 합성하였다. 이들 리간드를 Cu(II)이온과 반응시켜 세자리 Schiff base Cu(II) 착물들을 합성하였다. 리간드와 그 착물들의 구조와 특성을 원소분석, $^1H$-NMR, IR, UV-vis 분광법과 열 무게 분석법으로 알아보았다. Schiff base 리간드와 Cu(II)의 몰비는 1:1로 결합하며 Cu(II)착물들은 1 분자의 수화물이 배위된 4배위의 평면 사각형 구조임을 알았다. 지지전해질로서 0.1M TBAP를 포함한 DMSO 용액에서 순환 전압전류법과 미분 펄스 전압전류법으로 세자리 Schiff base 리간드와 이들의 Cu(II) 착물들의 전기 화학적인 산화 환원 과정을 알아보았다. 세자리 Schiff base 리간드들의 전기 화학적 환원은 확산 지배적이고 비가역적으로 진행되었다. Cu(II) 착물들의 전기화학적 환원과정은 1단계 1전자 반응으로 모두 확산 지배적이고 준가역적으로 진행되었다. Cu(II)착물들의 환원전위는 [Cu(II)(HNIPC)($H_2O$)]>[Cu(II)(HNIP)($H_2O$)]>[Cu(II)(SIP)($H_2O$)]>[Cu(II)(SIPC)($H_2O$)] 순으로 양전위 방향으로 이동하였다.

• 분석과학
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• 제9권4호
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• pp.345-354
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• 1996

산소-질소를 포함하는 여러 자리 시프염기 리간드인 비스-살리실알데히드-에틸렌디이민(SED), 비스-살리실알데히드-프로필렌디이민(SPD), 비스-살리실알데히드-디에틸렌트리이민(SDT), 비스-살리실알데히드-트리에틸렌테트라이민(STT) 및 비스-살리실알데히드-테트라에틸 렌펜타이민(STP) 등을 합성하고 이들 리간드들을 에탄올과 70% 디옥산 수용액에서 전위차법으로 넷, 다섯 및 여섯 단계의 양성자 해리상수값을 구하였다. 구리(II)-시프염기 착물의 안정도상 수값의 크기는 Cu(II)-SPD${\leq}$Cu(II)-SED~STT${\leq}$Cu(II)-STP 순서로 음전위쪽으로 이동하였다. Cu(II)-시프염기 착물의 산화-환원 과정은 일전자 반응이었다.

• 대한화학회지
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• 제18권3호
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• pp.189-193
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• 1974

세자리 schiff base 리간드로서 salicylidene imino-o-thiobenzene은 salicylaldehyde와 o-aminothiolbenzene을 Duff reaction 시킴으로써 합성하였으며 이 리간드와 Cu(II), Ni(II), 및 Zn(II) 이온들과의 반응으로서 새로운 착물 Cu(II)$[C_{13}H_9ONS]{\cdot}3H_2O$, 및 Ni(II)$[C_{13}H_9ONS]{\cdot}3H_2O,\;Zn(II)[C_{13}H_9ONS]{\cdot}3H_2O$들을 합성하였다. 이 착물들은 가시부 자외선스펙트럼, 적외선스펙트럼, TGA, DTA 및 원소분석측정에 의하여 리간드와 금속은 1:1 몰비로 착물을 이루며 Cu(II) 착물은 1수화물 4배위 결합착물이고 Ni(II), 및 Zn(II) 착물은 3수화물, 6배위 결합의 착물임을 알아보았다.

• Bulletin of the Korean Chemical Society
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• 제17권8호
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• pp.688-693
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• 1996

Tetradentate Schiff base ligands derived from 2-hydroxy-1-naphthaldehyde and aliphatic diamine have been synthesized. Cu(Ⅱ) complexes of Schiff base ligands have been synthesized from the free ligands and copper acetate. The mole ratio of ligand to copper was identified to be 1:1 by the result of elemental analysis and Cu(Ⅱ) complexes were in a four-coordinated configuration. The electrochemical redox process of Cu(Ⅱ) complexes in a DMF solution has been investigated by cyclic voltammetry, chronoamperometry, differential pulse voltammetry, and controlled potential coulometry. The redox process of Cu(Ⅱ) complexes is one electron transfer process in quasi-reversible and diffusion-controlled reaction. The electrochemical redox potentials and the kinetic parameters of Cu(Ⅱ) complexes are affected by the chelate ring of Schiff base ligands.

• 한국표면공학회지
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• 제40권1호
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• pp.11-15
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• 2007

Stable metallic Cu/Zn nanoparticles were prepared in the base oil phase by hydrothermal method. The physical properties, such as crystal structure, crystallite size and crystallinity according to synthesis conditions have been investigated by XRD, FT-IR and TEM. In addition, 4-ball test has been performed in order to investigate the frictional wear properties of prepared nanosized Cu/Zn particles. The peaks of the X-ray diffraction pattern indicate that the particle size was very small and crystallinity of Cu/Zn particles was good. The micrographs of TEM showed that nanosized Cu/Zn particles possessed a spherical morphology with a narrow size distribution. The crystallite size of the Cu/Zn particles synthesized in base oils was 23-30 nm. It was found that the antiwear capacity increases with increasing Cu/Zn concentration. When the concentration of Cu/Zn was 5.0 wt%, the wear scar diameters was 0.38 mm.

• Bulletin of the Korean Chemical Society
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• 제34권11호
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• pp.3233-3238
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• 2013

Two new Cu(II) complexes, $[Cu_2(acpy-mdtc)_2(HBA)(ClO_4)]{\cdot}H_2O$ (1) (acpy-mdtc- = 2-acetylpyridine S-methyldithiocarbamate and $HBA^-$ = benzilic acid anion) and $[Cu_2(acpy-phtsc)_2(HBA)]{\cdot}ClO_4$ (2) (acpy-$phtsc^-$ = 2-acetylpyridine 4-phenyl-3-thiosemicarbazate) have been synthesized and characterized by elemental analysis, infrared spectroscopy, thermogravimetric analysis, and single crystal X-ray diffraction. The X-ray analysis reveals that the structures of 1 and 2 are dinuclear copper(II) complexes bridged by two thiolate sulfur atoms of Schiff base ligand and bidentate bridging $HBA^-$ anion. For 1, each of the two copper atoms has different coordination environments. Cu1 adopts a five-coordinate square-pyramidal with a $N_2OS_2$ donor, while Cu2 exhibits a distorted octahedral geometry in a $N_2O_2S_2$ manner. For 2, two Cu(II) ions all have a five-coordinate square-pyramidal with a $N_2OS_2$ donor. In each complex, the Schiff base ligand is coordinated to copper ions as a tridentate thiol mode.

• 대한화학회지
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• 제18권3호
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• pp.194-201
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• 1974

네자리 schiff리간드는 salicylaldehyde와 m-phenylenediamine을 Duff-반응 시킴으로써 N,N-bis(salicylaldehyde)-m-phenylenediimine을 합성하고 이 리간드와 Cu(II), Ni(II), Co(II) 및 Zn(II) 이온들과의 새로운 착물 Cu(II)$[C_{20}H_{14}O_2N_2]{\cdot}2H_2O, Co(II)[C_{20}H_{14}O_2N_2]{\cdot}2H_2O$ 및 Zn(II)$[C_{20}H_{14}O_2N_2]{\cdot}4H_2O$들을 합성하였다. 이들 착물에 대하여 가시부 흡수스펙트럼, 적외선스펙트럼, TGA, X-ray 회절 및 원소분석 결과에 의하여 Cu(II), Ni(II) 및 Co(II) 착물들은 리간드와 금속이 1:1 몰비 및 2수화물의 6배위 착물로 주어지며 Zn(II) 착물은 1:2 몰비 4배위 착물로 주어짐을 알았다

• 대한화학회지
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• 제31권6호
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• pp.509-519
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• 1987

네자리 Schiff base 리간드인 3,4-bis(salicylidene diimine) toluene [o-BSDT $H_2$]를 salicylaldehyde에 3,4-diaminotoluene를 Duff 반응시킴으로써 합성하였으며 이들 리간드와 Ni(II), Co(II) 및 Cu(II)이온들과의 새로운 착물 [Ni(o-BSDT)${\cdot}(H_2O)_2$], [Co(o-BSDT)${\cdot}(H_2O)_2$] 및 [Cu(o-BSDT)]를 합성하였다. 이들 착물에 대한 원소분석, 전자흡수스펙트럼, 적외선 스펙트럼 및 T.G.A. 측정결과에 의하여 Ni(II)와 Co(II) 착물은 리간드대 금속이 1 : 1 몰비의 4배위 착물임을 알았다. 0.1M TEAP-DMSO 용액에서의 폴라로그래피와 순환전압-전류법을 조사한 결과 [Ni(o-BSDT)${\cdot}(H_2O)_2$]는 비가역적인 electron transfer 다음에 빠른 화학적 반응을 하는 EC반응기구를 보이며 [Co(o-BSDT)${\cdot}(H_2O)_2$]는 Co(II) - Co(I)로의 환원과 Co(II) - Co(III)로의 산화가 일어나며, [Cu(o-BSDT)]착물은 Cu(II) - Cu(I)로의 환원이 일어남이 밝혀졌다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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• pp.75-87
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• 2001

Three different kinds of substrate used in this study : bare Cu substrate, Ni-P/Cu substrate with a Ni-P layer thickness of $5\mu\textrm{m},$ and Au/Ni-P/Cu substrate with the Ni-P and Au layers of $0.15\mu\textrm{m}$ and $5\mu\textrm{m}$ thickness respectively. The wettability of various Sn-base solders was affected by the substrate metal finish used, i.e., nickel, gold and copper. On the Au/Ni-F/Cu substrate, Sn-base solders wet better than any of the other substrate metal finishes tested. The interfacial reaction between various substrate and Sn-base solder was investigated at $70^{\circ}C,$ $100^{\circ}C,$ $120^{\circ}C,$ $150^{\circ}C,$ $170^{\circ}C$ and $200^{\circ}C$ for reaction times ranging from 0 day to 60 day. Intermetallic phases was formed along a Sn-base solder/ various substrate interface during solid-state aging. The apparent activation energy for growth of Sn-Ag/Cu, Sn-Ag-Bi/Cu, and Sn-Bi/Cu couples were 65.4, 88.6, and 127.9 Kj/mol, respectively. After isothermal aging, the fracture surface shoved various characteristics depending on aging temperature and time, and the types of BGA pad.