• 한국도로학회논문집
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• 제10권4호
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• pp.41-52
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• 2008

본 연구는 박리방지 첨가제를 혼입한 아스팔트 혼합물의 수분민감성에 대한 특성 평가 방안을 제시하고자, 기존의 수침 시험을 개선한 3가지 종류($H_c$, $V_s$, F-T)의 수침 방법을 통하여 생석회, 소석회, 1종의 액상 박리방지 첨가제를 혼입한 각 아스팔트 혼합물에 대한 수분민감성의 거동 특성을 분석하였다. 실험방법은 AASHTO TP-9에 규정된 간접인장시험(Indirect Tensile Test, IDT)을 통한 크리프시험 (Creep Test), 회복탄성계수시험(Resilient Modulus Test) 및 강도시험(Strength Test)을 수행하였다. 분석방법으로는 미국 플로리다 대학의 Roque에 의해 제안된 에너지비(Energy Ratio, ER) 개념을 사용하여 박리방지제의 사용에 따른 효과 및 수분민감도 특성을 평가하였다(Roque, 2004). 시험결과, 수분처리 방법 에 따른 아스팔트 흔합물의 물성 변화뿐만 아니라 박리 방지 첨가제에 따른 물성 변화가 현저하게 나타났다. 또한 누적 수분 손상에 의해 발생되는 균열에 대한 저항성이 각 첨가제 및 수분처리 방법에 따라 변화됨을 나타내었다. 이를 토대로 Energy Ratio를 분석한 결과 약 $10{\sim}30%$ 정도의 균열 저항성 변화가 나타났다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국세라믹학회지
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• 제45권9호
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• pp.549-555
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• 2008

The thermal barrier coating must withstand erosion when subjected to flowing gas and should also maintain good stability and mechanical properties while it must also protect the turbine component from high temperature, hot corrosion, creep, and oxidation during operation. In this study we investigated the influence of subsurface layer, $Al_2O_3$ or NiCrCoAIY bond coat layer, on the indentation damage behavior of YSZ thermal barrier coating layers deposited by electron beam physical vapor deposition (EB-PVD). The bond coat is deposited using different process such as air plasma spray (APS) or spray of high velocity oxygen fuel (HVOF) and the thickness is varied. Hertzian indentation technique is used to induce micro damages on the coated layer. The stress-strain behaviors are characterized by results of the indentation tests.

• 대한기계학회논문집A
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• 제26권7호
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• pp.1241-1249
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• 2002

The extent of materials deterioration can be evaluated accurately by mechanical test such as impact test or creep test. But it is almost impossible to extract a large test specimen from in-service components. Thus material degradation evaluation by non-destructive method is earnestly required. In this paper, the material degradation for virgin and several aged materials of a Cr-Mo-V steel, which is an candidated as structural material of the turbine casing components for electric power plant, is nondestructively evaluated by reactivation polarization testing method. And, the results obtained from the test are compared with those in small punch(SP) tests recommended as a semi-nondestructive testing method using miniaturized specimen. In contrast to the aged materials up to 1,000hrs which exhibit the degradation behaviors with increased ${\Delta}[DBTT]_{SP}$, the improvement of mechanical property can be observed on the 2,000hrs and 3,000hrs aged materials. This is because of the softening of material due to the carbide precipitation, the increase of ferritic structures and the recovery of dislocation microstructure by long-time heat treatment. The reactivation rates($I_R/I_{Crit},\;Q_R/Q_{Crit}$) calculated by reactivation current densityt ($I_R$) and charge($Q_R$) in the polarization curves exhibit a good correlation with ${\Delta}[DBTT]_{SP}$ behaviors.

• 동력기계공학회지
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• 제8권3호
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• pp.18-22
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• 2004

Boiler is one of the most important utilities providing steam to turbine in order to supply mechanical energy in thermal power plant. It is composed of thousands of tubes for high efficient heat transfer. The material for boiler tubes is used in such high temperature and pressure condition as $540^{\circ}C$, 22MPa. The boiler tube material is required to resist creep damage, fatigue cracking, and corrosion damages. 2.25%Cr-1Mo steel is used for conventional boiler tubes, and austenitenite stainless steel is used for higher temperature boiler tubes. But the temperature and pressure of steam in power plant became higher for high plant efficiency. So, the property of boiler tube material must be upgaded to fit the plant property. Several boiler tube material was developed to fit such conditions. X20CrMoV12.1 steel is also developed in 1980's and used for superheater and reheater tubes in supercritical boilers. The material has martensite microstructures which is difficult to evaluate the degradation. In this thesis, degrade the X20CrMoV12.1 steel at high temperatures in electric furnace, and evaluate hardness with Vickers hardness tester and strengths with Indentation tester.

• 대한기계학회논문집A
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• 제22권3호
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• pp.595-602
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• 1998

Specimens of 304 stainless steel were tested to failure at elevated temperatures under multiaxial stress states, uniaxial tension using smooth bar specimens, biaxial shearing using double shear bar specimens, and triaxial tension using notched bar specimens. Rupture times are compared for uniaxial, biaxial, and triaxial stress states with respect to the maximum principal stress, the von Mises effective stress, and the principal facet stress. The results indicate that the principal facet stress gives the best correlation for the material investigated, and this parameter can predict creep life data under multiaxial stress states with rupture data obtained with specimens under uniaxial stresses. The results also suggest that grain boundary cavitation, coupled with localized deformation processes such as grain boudary sliding, controls the lifetimes of the specimens.

• 대한기계학회논문집A
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• 제33권10호
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• pp.1177-1186
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• 2009

High temperature steam pipes of thermal power plant are subject to a severe thermal range and usually operates well into the creep range. Cyclic operation of the plant subjects the piping system to mechanical and thermal fatigue damages. Also, poor or malfunctional supports can impose massive loads or stress onto the piping system. In order to prevent the serious damage and failure of the critical piping system, various inspection methods such as visual inspection, computational analysis and on-line piping displacement monitoring were developed. 3-dimensional piping displacement monitoring system was developed with using the aluminum alloy rod and rotary encoder sensors, this system was installed and operated on the high temperature steam piping of "Y" thermal power plant successfully. It is expected that this study will contribute to the safety of piping system, which could minimize stress and extend the actual life of critical piping.

• 대한한의학원전학회지
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• 제25권4호
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• pp.23-38
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• 2012

Objective : Generally speaking Reverting yin disease pattern(厥陰病) is the last step in cold damage(傷寒). Therefore recognized Yin cold disease(陰寒病) is increasing, and resist action One Yang qi(一陽) began to creep into body. But Ke Qin(柯琴) have a different way of thinking that Reverting yin disease pattern connected with the loss of Liver's function. Liver qi depression(肝鬱) make a ministerial fire(相火), and it make a nutrient and blood insufficiency(營血不足). Method : I will try to describe the Sanghanlun's Reverting yin disease pattern through the Ke-qin's JueyinbingJie(厥陰病解), and I would like to point out that the exact meaning of Reverting yin(厥陰) is connected with Liver's ministerial fire. Result : Ke Qin's JueyinbingJie explained the Reverting yin disease pattern was connected with Liver(肝), and according to Six qi theory(六氣學說) connected with ministerial fire, and according to meridian and Collateral theory(經絡學說) connected with closing referring to inward actions(闔) among the Opening closing and pivot(關闔樞). Conclusion : Ke Qin was recognized that Reverting yin disease pattern have relevance to the loss of Liver's function. In other world, It is connect with soothe the liver and purge fire(疏肝瀉火) and nutrient and blood insufficiency(營血不足).

• Journal of Mechanical Science and Technology
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• 제15권7호
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• pp.1013-1021
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• 2001

A series of rabbit common extensor tendon specimens of the humeral epicondyle were subjected to tensile tests under two displacement rates (100mm/min and 10mm/min) and different elbow flexion positions 45°, 90°and 135°. Biomechanical properties of ultimate tensile strength, failure strain, energy absorption and stiffness of the bone-tendon specimen were determined. Statistically significant differences were found in ultimate tensile strength, failure strain, energy absorption and stiffness of bone-tendon specimens as a consequence of different elbow flexion angles and displacement rates. The results indicated that the bone-tendon specimens at the 45°elbow flexion had the lowest ultimate tensile strength; this flexion angle also had the highest failure strain and the lowest stiffness compared to other elbow flexion positions. In comparing the data from two displacement rates, bone-tendon specimens had lower ultimate tensile strength at all flexion angles when tested at the 10mm/min displacement rate. These results indicate that creep damage occurred during the slow displacement rate. The major failure mode of bone-tendon specimens during tensile testing changed from 100% of midsubstance failure at the 90°and 135°elbow flexion to 40% of bone-tendon origin failure at 45°. We conclude that failure mechanics of the bone-tendon unit of the lateral epicondyle are substantially affected by loading direction and displacement rate.