• 제목/요약/키워드: crack cleaning

검색결과 19건 처리시간 0.027초

Analytic Hierarchical Procedure and Economic Analysis of Pneumatic Pavement Crack Preparation Devices

  • Park, JeeWoong;Cho, Yong K.;Wang, Chao
    • Journal of Construction Engineering and Project Management
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    • 제5권2호
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    • pp.44-52
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    • 2015
  • Various approaches have been used in crack preparations and each of the approaches has advantages and disadvantages. Although the routing method has been widely used and seems to be the best approach among the approaches, it is not a complete solution for crack preparation. This paper compares and evaluates a pneumatic crack cleaning device (CCD) developed by Robotics and Intelligent Construction Automation group at Georgia Tech, over existing devices. Surveys were conducted to discover factors that affect the performance of crack/joint preparation work. Then, data for such information were collected via field tests for devices such as router, heat lancer, air blower and CCD. Performed field test results and follow-up interviews demonstrated that the utilization of CCD has potential to offer improvements in productivity, safety, and maintenance cost. An analytic hierarchical procedure (AHP) and economic analyses were conducted. The AHP analysis considered three factors including safety, quality and productivity while the economic analyses examined the alternatives in various ways. The results indicated that the CCD was ranked first and second for the AHP analysis and economic analysis, respectively. In conclusion, the field tests and results revealed that the utilization of CCD achieved satisfactorily in performance, quality, safety and control, and showed that it has high potential in crack cleaning practice.

Development and Control of a Roadway Seam Tracking Mobile Robot

  • Cho, Hyun-Taek;Jeon, Poong-Woo;Jung, Seul
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 2003년도 ICCAS
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    • pp.2502-2507
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    • 2003
  • In this paper, a crack sealing robot is developed. The crack sealing robot is built to detect, track, and seal the crack on the pavement. The sealing robot is required to brush all dirt in the crack out for preparing a better sealing job. Camera calibration has been done to get accurate crack position. In order to perform a cleaning job, the explicit force control method is used to regulate a specified desired force in order to maintain constant contact with the ground. Experimental studies of force tracking control are conducted under unknown environment stiffness and location. Crack tracking control is performed. Force tracking results are excellent and the robot finds and tracks the crack very well.

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힘제어 기반의 틈새 추종 로봇의 제작 및 제어에 관한 연구 : Part Ⅱ. 힘제어 (Implementation and Control of Crack Tracking Robot Using Force Control : Part Ⅱ. Force Control)

  • 전풍우;정슬
    • 제어로봇시스템학회논문지
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    • 제11권4호
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    • pp.337-343
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    • 2005
  • In this paper, experimental studies of force control of the crack tracking robot are presented. The crack tracking robot should maintain constant contact with the road to perform cleaning process of the crack effectively. Regulating desired force on the road requires a sophisticated force control algorithm. Here, two main force control algorithms such as the impedance force control and the explicit force control are used. Performances of two force control algorithms are compared.

Laser TSV 공정에 있어서 Via 세정에 관한 연구 (Via Cleaning Process for Laser TSV process)

  • 서원;박재현;이지영;조민교;김구성
    • 마이크로전자및패키징학회지
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    • 제16권1호
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    • pp.45-50
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    • 2009
  • 레이저를 이용 실리콘 관통형 접속기술인 TSV(Through-Silicon-Via)를 형성할 경우 Debris(파편물) 및 Particle이 발생되므로 이를 제거하기 위한 세정공정을 연구하였다. 계면활성제를 이용한 화학적 세정과 Brush를 이용한 물리적 세정을 검토하기 위하여 세정기를 제작하고 8인치 CMOS Image Sensor wafer에 직경 $30{\mu}m$, 깊이 $100{\mu}m$를 갖는 Via를 제작하여 두 가지의 세정방법을 연구하였다. 세정액은 DI Water와 계면활성제의 혼합비 2:1에서 Debris 범위가 $73{\mu}m^2$로 희석비가 낮을수록 세정력이 우수하였다. 레이저의 주파수와 속도변위에 따른 가공 조건 변화에는 Debris 분포차가 5% 미만으로 세정력에는 영향이 없었다. Brush를 이용하여 Debris를 제거하는 실험에서 Strip $1000{\sim}3000rpm$, Rinse $50{\sim}3000rpm$, Brush $200{\sim}300rpm$ 으로 증가시켜 세정하였을 때 Crack이나 손상 없이 Debris의 분포가 감소하였다. 따라서 화학적 세정과 물리적 세정으로 Debris를 제거할 수 있다.

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A Study on the Chemical Cleaning Process and Its Qualification Test by Eddy Current Testing

  • Shin, Ki Seok;Cheon, Keun Young;Nam, Min Woo;Min, Kyong Mahn
    • 비파괴검사학회지
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    • 제33권6호
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    • pp.511-518
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    • 2013
  • Steam Generator (SG) tube, as a barrier isolating the primary coolant system from the secondary side of nuclear power plants (NPP), must maintain the structural integrity for the public safety and their efficient power generation. So, SG tubes are subject to the periodic examination and the repairs if needed so that any defective tubes are not in service. Recently, corrosion related degradations were detected in the tubes of the domestic OPR-1000 NPP, as a form of axially oriented outer diameter stress corrosion cracking (ODSCC). According to the studies on the factors causing the heat fouling as well as developing corrosion cracking, densely scaled deposits on the secondary side of the SG tubes are mainly known to be problematic causing the adverse impacts against the soundness of the SG tubes [1]. Therefore, the processes of various cleaning methods efficiently to dissolve and remove the deposits have been applied as well as it is imperative to maintain the structural integrity of the tubes after exposing to the cleaning agent. So qualification test (QT) should be carried out to assess the perfection of the chemical cleaning and QT is to apply the processes and to do ECT. In this paper, the chemical cleaning processes to dissolve and remove the scaled deposits are introduced and results of ECT on the artificial crack specimens to determine the effectiveness of those processes are represented.

치과 보철용 크라운에 잔존하는 임시 시멘트의 용해액의 개발 (Preparation of Chemical Solution for the Provisional Cement Remnant Cleaning in Dental Crown)

  • 이용현;김병진;이광래
    • 산업기술연구
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    • 제37권1호
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    • pp.12-15
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    • 2017
  • It is important in dentistry that the provisional cement should be cleaned thoroughly from the crown before definitive cementation. The provisional cement has been removed by physical means such as curette, scaler, pumice, or sand-blasting with alumina particles, which is time-consuming, irritating, tedious, even causing crack. To avoid such troubles occurring through such physical cleaning means, the chemical solutions for dissolving the provisional cement remaining in dental crown were prepared, and solubilizing power of the solutions was measured and compared. The solution composed of MEA, NaOH, chloride chemicals ($CHCl_3$, $CCl_4$, $CH_2Cl_2$), surfactants (Igepal, Tween20), chelating agent (EDTA), and Ethyl cellosolve was most effective for dissolving the provisional cement.

DETECTION OF ODSCC IN SG TUBES DEPENDING ON THE SIZE OF THE CRACK AND ON THE PRESENCE OF SLUDGE DEPOSITS

  • Chung, Hansub;Kim, Hong-Deok;Kang, Yong-Seok;Lee, Jae-Gon;Nam, Minwoo
    • Nuclear Engineering and Technology
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    • 제46권6호
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    • pp.869-874
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    • 2014
  • It was discovered in a Korean PWR that an extensive number of very short and shallow cracks in the SG tubes were undetectable by eddy current in-service-inspection because of the masking effect of sludge deposits. Axial stress corrosion cracks at the outside diameter of the steam generator tubes near the line contacts with the tube support plates are the major concern among the six identical Korean nuclear power plants having CE-type steam generators with Alloy 600 high temperature mill annealed tubes, HU3&4 and HB3~6. The tubes in HB3&4 have a less susceptible microstructure so that the onset of ODSCC was substantially delayed compared to HU3&4 whose tubes are most susceptible to ODSCC among the six units. The numbers of cracks detected by the eddy current inspection jumped drastically after the steam generators of HB4 were chemically cleaned. The purpose of the chemical cleaning was to mitigate stress corrosion cracking by removing the heavy sludge deposit, since a corrosive environment is formed in the occluded region under the sludge deposit. SGCC also enhances the detection capability of the eddy current inspection at the same time. Measurement of the size of each crack using the motorized rotating pancake coil probe indicated that the cracks in HB4 were shorter and substantially shallower than the cracks in HU3&4. It is believed that the cracks were shorter and shallower because the microstructure of the tubes in HB4 is less susceptible to ODSCC. It was readily understood from the size distribution of the cracks and the quantitative information available on the probability of detection that most cracks in HB4 had been undetected until the steam generators were chemically cleaned.

수소 플라즈마 처리에 의한 실리콘 직접접합 특성에 관한 연구 (A Study on the Characteristics of Silicon Direct Bonding by Hydrogen Plasma Treatment)

  • 최우범;주철민;김동남;성만영
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제49권7호
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    • pp.424-432
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    • 2000
  • The plasma surface treatment, using hydrogen gas, of the silicon wafer was investigated as a pretreatment for the application to silicon-on-insulator (SOI) wafers using the silicon direct bonding technique. The chemical reactions of hydrogen plasma with surfaces were used for both the surface activation and the removal of surface contaminants. As a result of exposure of silicon wafer to the plasma, an active oxide layer was formed on the surface, which was rendered hydrophilic. The surface roughness and morphology were estimated as functions of plasma exposing time as well as of power. The surface became smoother with decreased incident hydrogen ion flux by reducing plasma exposing time and power. This process was very effective to reduce the carbon contaminants on the silicon surface, which was responsible for a high initial surface energy. The initial surface energy measured by the crack propagation method was 506 mJ/m2, which was up to about three times higher than that of a conventional RCA cleaning method.

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수소 플라즈마에 의해 표면 활성화된 실리콘 기판을 이용한 SOI 기판 제작에 관한 연구 (A study on the fabrication of SOI wafer using silicon surfaces activated by hydro)

  • 최우범;주철민;이종석;성민영
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1999년도 하계학술대회 논문집 G
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    • pp.3279-3281
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    • 1999
  • This paper describes a method of direct wafer bonding using surfaces activated by a radio-frequency hydrogen plasma. The hydrogen plasma cleaning of silicon in the RIE mode was investigated as a pretreatment for silicon direct bonding. The cleaned silicon surface was successfully terminated by hydrogen, The hydrogen-terminated surfaces were rendered hydrophilic, which could be wetted by Dl water rinse. Two wafers of silicon and silicon dioxide were contacted to each other at room temperature and postannealed at $300{\sim}1100^{\circ}C$ in an $N_2$ atmosphere for 2 h. From the AFM results, it was revealed that the surface became rougher with the increased plasma exposure time and power. The effect of the plasma treatment on the surface chemistry was investigated by the AES analysis. It was shown that the carbon contamination at the surface could be reduced below 5 at %. The interfacial energy measured by the crack propagation method was 122 $mJ/m^2$ and 384 $mJ/m^2$ for RCA cleaning and hydrogen plasm, respectively.

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The Effect of Hydrogen Plasma on Surface Roughness and Activation in SOI Wafer Fabrication

  • Park, Woo-Beom;Kang, Ho-Cheol;Sung, Man-Young
    • Transactions on Electrical and Electronic Materials
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    • 제1권1호
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    • pp.6-11
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    • 2000
  • The hydrogen plasma treatment of silicon wafers in the reactive ion-etching mode was studied for the application to silicon-on-insulator wafers which were prepared using the wafer bonding technique. The chemical reactions of hydrogen plasma with surface were used for both surface activation and removal of surface contaminants. As a result of exposure of silicon wafers to the plasma, an active oxide layer was found on the surface. This layer was rendered hydrophilic. The surface roughness and morphology were examined as functions of the plasma exposing time and power. In addition, the surface became smoother with the shorter plasma exposing time and power. The value of initial surface energy estimated by the crack propagation method was 506 mJ/㎡, which was up to about three times higher as compared to the case of conventional direct using the wet RCA cleaning method.

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