Studies on Molding Conditions and Physical Properties of EMC(Epoxy Molding Compounds) fiiled with Crystalline SiO2 for Microelectronic Encapsulation (결정성 SiO2 충진 EMC(Epoxy Molding Compounds)봉지재의 성형조건 및 물성에 관한 연구)
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- Applied Chemistry for Engineering
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- v.8 no.3
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- pp.533-542
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- 1997