• 제목/요약/키워드: core layer of board

검색결과 34건 처리시간 0.023초

Study on the Mechanical Properties of Tropical Hybrid Cross Laminated Timber Using Bamboo Laminated Board as Core Layer

  • GALIH, Nurdiansyah Muhammad;YANG, Seung Min;YU, Seung Min;KANG, Seog Goo
    • Journal of the Korean Wood Science and Technology
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    • 제48권2호
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    • pp.245-252
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    • 2020
  • This study was performed to analyze the mechanical properties of tropical hybrid cross-laminated timber (CLT) with bamboo laminated board as the core layer in order to evaluate the possibility of its use as a CLT material. Bamboo board was used as the core layer and the tropical species Acacia mangium willd., from Indonesia, was used as the lamination in the outer layer. The modulus of elasticity (MOE), modulus of rupture (MOR), and shear strength of the hybrid CLT were measured according to APA PRG 320-2018 Standard for Performance-Rated Cross-Laminated Timber. The results show that the bending MOE of the hybrid CLT was found to be 2.76 times higher than SPF (Spruce Pine Fir) CLT. The reason why the high MOE value was shown in bamboo board and hybrid CLT applied bamboo board is because of high elasticity of bamboo fiber. However, the shear strength of the hybrid CLT was 0.8 times lower than shear strength of SPF CLT.

에노다이징 절연층과 반시컵 구조를 보유한 COB타입 LED BLU 광원구현 (Implementation of LED BLU Using Metal core PCB with Anodizing Oxide Layer)

  • 홍대운;조재현
    • 한국조명전기설비학회:학술대회논문집
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    • 한국조명전기설비학회 2009년도 춘계학술대회 논문집
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    • pp.157-159
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    • 2009
  • LED BLU(Back Light Unit), based on MCPCB(Metal Core Printed Circuit Board) with anodizing oxide dielectric layer and improved thermal dissipation property, are presented. Reflecting cups were also formed on the surface of the MCPCB such that optical coupling between neighboring chips were minimized for improving the photon extraction efficiency. LED chips were directly attached on the MCPCB by using the COB (Chip On Board) scheme.

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에노다이징 절연층과 반사컵 구조를 보유한 COB타입 LED BLU 광원구현 (Implementation of LED BLU Using Metal core PCB with Anodizing Oxide Layer and Reflection Cup Structure)

  • 조재현;이민수
    • 조명전기설비학회논문지
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    • 제23권8호
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    • pp.8-13
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    • 2009
  • LED 광원 기술의 발전과 더불어 응용분야도 다양하게 넓어지고 있다. 이중 본 논문에서는 액정 후면 배광 장치와 같이 고성능의 광원이 요구되는 응용제품에 적합한 광원을 제작하였다. 논문에서 제안한 광원은 금속산화물 절연층을 이용하여 LED chip에서 발생한 열을 효율적으로 외부로 전달하는 구조를 적용하였으며 패키지 구조가 아닌 chip과의 접촉면에 반사컵 구조를 적용하여 배광 분포 제어와 광자 재흡수 특성을 개선하였다.

폐목재파티클을 이용한 재생보드의 제조특성 (Manufacturing Characteristics of Boards Recycling Waste Wood Particle)

  • 김외정;서진석;한태형;박종영
    • 한국건설순환자원학회논문집
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    • 제2권1호
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    • pp.120-127
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    • 2006
  • 폐목질원료로서, 제재, 합판, PB, MDF와 폐침목 등의 해머밀에 의한 파쇄특성과 재생파티클 종류와 혼합비율에 따른 재생보드의 물성을 구명함으로써, 보드원료로서 재자원화 하는 방안을 모색해 보고자 하였다. 그 결과, 재생보드의 휨성질은 목질원료의 입자형태 및 입도분포에 크게 영향을 받으며, 파티클, 섬유와 같은 element가 압축고화된 상태의 판넬(PB, MDF)로부터 재생한 파티클은 물성저하를 초래하였다. 그러나, 재생파티클에 이미 도포 경화된 수지에 의해 재생보드의 치수안정성이 향상되는 효과가 있다. 따라서, 보드원료로서의 적합한 요건은 건전폐목재(제재, 합판)와 저급폐목재(PB, MDF)의 적정한 혼용에 있다고 할 수 있다. 본 연구에서는 건전폐목재 재생파티클과 재생 PB파티클의 혼용시험에서 제재파티클이 휨성질(MOR, MOE)과 박리강도에 기여하고, 합판파티클은 치수안정성에 더욱 기여하는 경향을 나타냈다. 또한 보드의 중층용 원료로 재생PB파티클의 혼합비율을 증가함에 따라서 보드의 휨성능이 감소되는 경향을 나타냈지만 혼합률 40%까지는 유의차가 없이 보드 15형(MOR : $153kgf/cm^2$, MOE : $27.5tonf/cm^2$) 수준의 성능이 구비되었다. 향후 생활폐목재(폐가구 등)와 같은 저급폐목재의 활용방안이 강구된다면 보드원료의 수급에 한층 기여할 수 있을 것이다.

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목질.시멘트보드의 물리.기계적 성질, 열전도성 및 내화성 (Physical and Mechanical Properties, Thermal Conductivity and Fire-Proof Performance of Wood-Cement Board)

  • 서진석;박종영
    • 한국가구학회지
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    • 제14권2호
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    • pp.31-38
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    • 2003
  • This study was carried out to investigate characteristics of wood-based panels and wood-cement board for the possible uses as flooring and wall materials. The optimum cement/wood ratio(C/W ratio) of wood~cement board manufactured by clamp-pressing was from 2.7 to 3.2. The dimesional stability was superior in the C/W ratio of 3.2. Particularly, the dimensional stability of cement board using fine particle for particleboard face layer was favorable through three levels of C/W ratio. According to types of wooden material, bending strength of cement board using coarse particle for particleboard core layer or old newspaper(ONP) fiber was relatively higher than others. Thermal conductivities of wood-cement boards were no lower than that of gypsum board, and higher than those of plywood and boards. In case of wood-cement board of the C/W ratio of 2.7, the fire-proof performances of cement composite boards were greater than that of gypsum board, and weight loss reached to about a half of gypsum board. Then, wood-cement boards showed superior fire-proof performance compared to wood-based panels.

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3X-Board를 적용한 멤브레인형 LNGC의 Slim화 설계 (Slim Design for Membrane Type LNGC using 3X-Board)

  • 류성현;조진래;하문근;이중남
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2003년도 추계학술대회
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    • pp.1280-1285
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    • 2003
  • In the developement of LNG cargo, the current concern focuses on the slim design of insulation layer to increase the LNG carrying capacity. Not only thermal stability with BOR(Boil-Off Rate) but structual stability against the LNG weight and the sloshing phenomenon must be also considered. In this paper, we applied the stitched sandwitch composite called the 3X-Board which is stitched through the core thickness direction using glass fiber to the LNG cargo. We evaluated the thermal and structural characteristics of 3X-Board by changing the core thickness and the material, in order to explore a validity for the slim design through the finite element analysis.

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인쇄회로 기판에 내장된 마이크로 플럭스게이트 센서 (A MICRO FLUXGATE SENSOR IN PRINTED CIRCUIT BOARD (PCB))

  • 최원열;황준식;나경원;강명삼;최상언
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2002년도 하계학술대회 논문집
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    • pp.151-155
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    • 2002
  • This paper presents a micro fluxgate magnetic sensor in printed circuit board (PCB). The fluxgate sensor consists of five PCB stack layers including one layer magnetic core and four layers of excitation and pick-up coils. The center layer as a magnetic core is made of a micro patterned amorphous magnetic ribbon with extremely high DC permeability of ∼100,000 and the core has a rectangular-ring shape. The amorphous magnetic core is easily saturated due to the low coercive field and closed magnetic path for the excitation field. Four outer layers as an excitation and pick-up coils have a planar solenoid structure. The chip size of the fabricated sensing element is 7.3${\times}$5.7m㎡. Excellent linear response over the range of -100${\mu}$T to +100${\mu}$T is obtained with 540V/T sensitivity at excitation square wave of 3V$\_$P-P/ and 360kHz. The very low power consumption of ∼8mW was measured. This magnetic sensing element which measures the lower fields than 50${\mu}$T, is very useful for various applications such as: portable navigation systems, military research, medical research, and space research.

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PCB 기판에 내장된 마이크로 플럭스게이트 센서 (Embedded Micro Fluxgate Sensor in Printed Circuit Board (PCB))

  • 최원열;황준식;강명삼;최상언
    • 한국전기전자재료학회논문지
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    • 제15권8호
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    • pp.702-707
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    • 2002
  • This paper presents a micro fluxgate sensor in printed circuit board (PCB). The fluxgate sensor consists of five PCB stack layers including one layer magnetic core and four layers of excitation and pick-up coils. The center layer as a magnetic core is made of a micro patterned amorphous magnetic ribbon and the core has a rectangular-ring shape. The amorphous magnetic core is easily saturated due to the low coercive field and closed magnetic path for the excitation field. Four outer layers as an excitation and pick-up coils have a planar solenoid structure. The chip size of the fabricated sensing element is 7.3$\times$5.7$\textrm{mm}^2$. Excellent linear response over the range of -100$\mu$T to +100$\mu$T is obtained with 540V/T sensitivity at excitation square wave of 3 $V_{p-p}$ and 360kHz. The very low power consumption of ~8mW was measured. This magnetic sensing element, which measures the lower fields than 50$\mu$T, is very useful for various applications such as: portable navigation systems, military research, medical research, and space research.h.

Effect of Rice Straw Steaming Time and Mixing Ratio between Acacia mangium Willd Wood and Steamed Rice Straw on the Properties of the Mixed Particleboard

  • Tran, Van Chu;Le, Xuan Phuong
    • Journal of Forest and Environmental Science
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    • 제31권2호
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    • pp.119-125
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    • 2015
  • This study examined the effects of rice straw steaming time and mixing ratio between rice straw and wood particle on the properties of mixed particle board from Acacia mangium Willd wood and rice straw. Rice straw and Acacia mangium Willd wood were collected in Hanoi, Vietnam. The particle board was three-layer particle board with the structural ratio of 1:3:1. The thickness, density and board size of the particle board were 18 mm, $0.7g/cm^3$, and $800{\times}800{\times}18$ (mm, including trimming), respectively. A resin mixture between commercial Urea-formaldehyde (U-F) adhesive and methylene diphenyl isocyanate (MDI) adhesive was used with a dosage of 12% for the core layer and 14% for the surface layer. In this experimental design, the steaming time for rice straw was 15, 30, 45, 60, and 75 minutes at $100^{\circ}C$. The rice straw-wood mixing ratio was 10, 20, 30, 40, and 50%. The results showed that both mixing ratio and steaming time affect the properties of the particleboard, but the mixing ratio has a stronger impact. A higher mixing ratio and a longer steaming time resulted in a better quality of particleboard. The optimal steaming time for rice straw was 46.12 minutes with the straw-wood mixing ratio of 29.85% with the following characteristics of the particle board: the modulus of rupture (MOR) of 14.64 MPa, internal bond strength (IB) of 0.382 MPa, thickness swelling (TS) of 8.83%, and board density of $0.7-0.7g/cm^3$.

합판 정재단 부산물을 중층 Core로 이용한 복합보드의 물리·기계적 성질에 관한 고찰 (The Study on Physical and Mechanical Properties of Composite Board, Using Byproduct of Plywood for Core Layer)

  • 최송규;피덕원;강석구
    • Journal of the Korean Wood Science and Technology
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    • 제41권6호
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    • pp.490-496
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    • 2013
  • 폐목재의 재활용으로 인한 보드의 물리 기계적 특성이 하락하는 경향이 있다. 그 원인으로는 가공되어 있던 재료를 재활용함에 있어 그 형상이 불균질하고 기존의 접착제 성분과 이물질로 인한 보드 품질의 불균일과 저하를 초래한다. 또한 접착제에 포함되어 있는 포름알데히드로 인해 높은 방산량을 가지게 된다. 이러한 제품의 질적 하락이 수입되는 파티클보드와의 가격 및 품질 경쟁력 약화로 이어져 국내 보드 산업의 문제점으로 대두되고 있다. 따라서 본 연구에서는 최근 파티클보드의 원재료로 사용되고 있는 합판 정재단 부산물을 이용한 보드를 제조하고 각각의 제조 조건별 물리 기계적 특성을 평가하였다. 그 평가결과로 베니어 적층 복합보드를 EMDI 수지를 이용하여 4~16 mesh의 일반적인 chip 크기로 중층을 제작했을 때 휨강도가 57.7 $N/mm^2$로 OSB 측정결과 26.8 $N/mm^2$에 비해 215% 높은 휨강도를 나타냈으며 7.1~17.3%의 두께팽창률은 내수성을 지닌 보드로서 적합함을 보였다. 또한 0.7 ppm의 포름알데히드 방산량은 E1등급의 평균값 1.5 ppm과 E0 등급 최대값 0.7 ppm의 조건에 충족하며 이러한 결과는 바닥 깔개용 OSB를 대체 가능할 것으로 사료된다.