Fabrication of a Ultrathin Ag Film on a Thin Cu Film by Low-Temperature Immersion Plating in an Grycol-Based Solution (글리콜 용매 기반 저온 치환 은도금법으로 형성시킨 동박막 상 극박 두께 Ag 도금층)
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- Journal of the Microelectronics and Packaging Society
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- v.21 no.2
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- pp.79-84
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- 2014