• KIEE International Transactions on Electrophysics and Applications
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• v.5C no.6
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• pp.233-241
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• 2005

The present model of a SF6 arc accounts for the copper vapour contamination from the electrodes inside a Laval nozzle of a circuit breaker. Steady state simulations have been done for the arc with electrode gap of 60mm and DC electric current of 500A, 1000A and 1500A for both cases with and without copper contamination. The effects of electrode polarity are considered for the arc current of 1000A. It was found out that evaporation of copper from the anode results in a cooling of the arc in a region close to the electrodes. The electrical potential across the electrodes is not sensitive to the presence of copper vapour, typically less than $4\%$ difference. Transient analysis has been done in order to obtain the arc properties at current zero. The arc current is increased linearly from -1000 to 0A when the upstream electrode is cathode with constant dI/dt of $27.0A/{\mu}s$ (or decreased linearly from 1000 to 0A when upstream electrode is anode). It has been predicted that the presence of copper vapour reduces the interruption capability of the breaker.

• Biomedical Science Letters
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• v.28 no.3
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• pp.195-199
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• 2022

The use of copper antibacterial films as an effective infection prevention method is increasing owing to its ability to reduce the risk of pathogen transmission. In this study, we evaluated the bacterial contamination of the antibacterial copper membrane attached to a door handle at a university over time. Six mounting locations with high floating population were selected. In three sites, the door handles with the antibacterial film were exposed, while the remaining three were not attached with the antibacterial films. On days 7 and 14, isolated bacterial strains were inoculated in BHI broth and agar, respectively. Colony-forming units (CFU) were determined after incubation. Strain identification was performed using bacterial 16s rRNA PCR and sequencing. Results showed that the bacterial population on day 14 significantly increased from 6 × 10⁹ CFU/mL (day 7) to 2 × 10¹⁰ CFU/mL. Furthermore, strain distribution was not different between the on and off the copper antibacterial film groups. In conclusion, although copper has an antibacterial activity, microbial contamination may occur with prolonged use.

• Journal of Environmental Health Sciences
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• v.8 no.1
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• pp.31-43
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• 1982

Seventy-seven Mugil cephalus of spinal deformation, living in Hanam, Nogsan, and Myeongji area, the downstreams of the Nagdong River, were collected in order to determine their forms and the levels of heavy metal contamination between March and October, 1981. The specimens were examined by X-ray and content of cadmium, lead, copper, and zinc by atomic absorption spectrophotometer. The results were summarized as follows: 1. The rate of appearance of deformational fish to the total Mugil cephflus were 4.3% (13 fish), 5.7% (17 fish), relatively high in May and June (dry season). Meanwhile during March and October they were low by 1.0% (3 fish), 2.0% (6 fish). As far as the research areas are concerned, they appeared in larger numbers in downstreams than in upper streams Myeongji (39), Nogsan (25), and Hanam (13). 2. Concerning with fractured parts of vertebraes,86 percent (66 out of 77) had their caudal regions fractured and 72 percent (55) their first to seventh caudal regions fractured. 3. The average levels of cadmium, lead, copper, zinc detected from flesh were 0.26ppm, 2.06ppm, 6.35ppm, 0.85ppm on the other hand, they were 0.22ppm, 1.84ppm, 5.03ppm, 0.93ppm in normal fish. 4. The average levels of cadmium, lead, copper, zinc measured in the bones were 0.39ppm, 2.55ppm, 8.97ppm, 2.73ppm. Meanwhile, from normal fish they were 0.33ppm, 2.25ppm, 7.24ppm, 2.42ppm. 5. Compared with regional heavy metal contamination such as cadium, lead, zinc, Myeongji area had higher contamination content than Nogsan area Nogsan area than Hanam area. 6. Compared with heavy metal contamination level in their tissues, cadmium was highly found in bones Lead and copper were highly detected in viscera. Particularly in skeleton cadmium was 560 times, zinc 160 times in proportion to those in the downstreams of the Nagdong River.

• Korean Journal of Soil Science and Fertilizer
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• v.40 no.4
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• pp.298-310
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• 2007

This study compared the correlation between the accumulated copper content in earthworms and the copper concentration rate of soil measured using several methods to extract heavy metals from soil. For the experiment, a microcosm soil test was carried out using copper contaminated soil from the vicinity of copper-roofed buildings and earthworms (Eisenia fetida). Soils from the study area were used to produce 6 treatments; control, 1C (contamination level with the lowest treated copper concentration rate), 2C, 4C, 8C, and 16C (contamination level with the highest treated copper concentration rate). Microcosm soil test using the 6 treatments proved that as the copper content in soil and the experiment time increased, the growth rate of and the accumulated copper concentration rate in earthworms increased as well. The degree of the increase corresponded to the order of the treated copper concentration levels in microcosm soils. Standard method of the ministry of environment and EPA method 3051 were used to obtain the copper concentration in soil and the total copper content in soil, respectively. The correlation coefficient (r) of 0.9875~0.9993 between the copper content extracted by the standard method and the total copper content shows high positive correlation. The correlation coefficient of the copper content in soil extracted by the standard method and the accumulated copper content in earthworms, and the correlation coefficient of the total copper content in soil and the accumulated copper content in earthworms were ranged from 0.9193 to 0.9728 and from 0.9282 to 0.9844, respectively, showing highly significant positive correlation. Due to the high correlation between the copper concentration in soil and the accumulated copper content in earthworms, it is concluded that earthworms are suitable to be used as biological indicator species or for bio-monitoring against copper contamination of soil.

• Journal of the Korean Wood Science and Technology
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• v.43 no.4
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• pp.504-510
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• 2015

This research was performed to evaluate soil contamination caused by copper depleted from ACQ-treated wood. Three years after the exposure of ACQ-treated wood in the field test sites, soil samples around the treated wood were collected and analyzed for the copper amount and distribution through soil. Soils around the deck posts installed in five different neighborhood parks located in Chonnam and Gyeongnam were investigated for copper contents. The results of the field test showed that the amount of copper leached from the end surface of treated wood buried under soil was more than 1.5 times the copper amount leached from the lateral surfaces, and the mobility of copper was very restricted in soil. The copper contents of soil within 10 cm from the treated deck posts installed in the parks showed to be less than 500 mg/kg, which are the limit values of the 2nd region set up by enforcement regulation of soil environment conservation act. The distribution ranges of copper in soil from the treated wood set up in the field test sites seemed to be much wider than those from deck posts, which may explained by the fact that the retentions of the treated samples used in the field test sites were much higher than those of the deck posts.

• Journal of the Korean Applied Science and Technology
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• v.32 no.3
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• pp.512-521
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• 2015

In this research, environmental friendly organic acid containing microetching system to improve adhesion strength between photoresist resin and Copper Clad Laminate(CCL) was developed without using strong oxidant $H_2O_2$. Etching rate and surface contamination on CCL were examined with various etching conditions with different etchants, organic acids and additives. to develope an optimum microetching condition. Etching solution with 0.04 M acetic acid showed the highest etching rate $0.4{\mu}m/min$. Etching solution with the higher concentration of APS showed the higher etching rate but surface contamination on CCL is very serious. In addition, stabilizer solution also played an important role to control the surface contamination. As a result of research, the etching solution containing 0.04 M of acetic acid, 0.1 M of APS with 4 g/L of stabilizer solution(ST-1) was best to improve adhesion between CCL and photoresist resin as well as showed the most clean and rough surface with the etching rate of $0.37{\mu}m/min$.

• Journal of the Korean Wood Science and Technology
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• v.47 no.6
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• pp.667-673
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• 2019

The performance of a wooden deck made of refractory materials that have difficulties in achieving target penetrations as stipulated in the specification and quality standards for treated wood in Korea, was assessed via a case study in this research. A wooden deck built in Jinju in 2009 was selected for this study because of its fabrication method using pressure and treated refractory materials. The penetration and retention analysis did not satisfy the domestic standard for treated wood. Inspection of the deck in 2019 revealed that the deck had been attacked by decay fungi. Cap rails showed much deeper and wider checking on their surface compared with the top and base rails, resulting in a severe fungal attack. The decking boards exhibited severe fungal decay primarily in the end parts. However, the rails and balusters without checks and posts were virtually free of fungal attack irrespective of the preservative penetration measures. Copper content in the soil 5 cm away from the deck was less than 150 mg/kg, implying that copper movement in the soil was very limited. These results suggest that the inhibition of surface propagation and the protection of end surfaces are essential factors in increasing the longevity of treated wooden decks; further, the results also showed that the deck was within an acceptable range from the point of copper contamination.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.4
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• pp.23-29
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• 2000

We demonstrate the fabrication method of high-density and high-quality solder bump solving a copper (Cu) cross-contamination in Si-LSI laboratory. The Cu cross-contamination is solved by separating solder-bump process by two steps. Former is via-formation process excluding Cu/Ti under ball metallurgy (UBM) layer sputtering in Si-LSI laboratory. Latter is electroplating process including Ti-adhesion and Cu-seed layers sputtering out of Si-LSI laboratory. Thick photoresist (PR) is achieved by a multiple coating method. After TiW/Al-electrode sputtering for electroplating and via formation in Si-LSI laboratory, Cu/Ti UBM layer is sputtered on sample. The Cu-seed layer on the PR is etched during Cu-electroplating with low-electroplating rate due to a difference in resistance of UBM layer between via bottom and PR. Therefore Cu-buffer layer can be electroplated selectively at the via bottom. After etching the Ti-adhesion layer on the PR, Sn/Pb solder layer with a composition of 60/40 is electroplated using a tin-lead electroplating bath with a metal stoichiometry of 60/40 (weight percent ratio). Scanning electron microscope image shows that the fabricated solder bump is high-uniformity and high-quality as well as symmetric mushroom shape. The solder bumps with even 40/60 $\mu\textrm{m}$ in diameter/pitch do not touch during electroplating and reflow procedures. The solder-bump process of high-uniformity and high-density with the Cu cross-contamination free in Si-LSI laboratory will be effective for electronic microwave application.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.3
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• pp.1-6
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• 2002

A low temperature process technology of copper thin films has been developed by a chemical vapor deposition technology for multi-level metallzations in ULSI fabrication. The copper films were deposited on TiN/Si substrates in helium atmosphere with the substrate temperature between $130^{\circ}C$ and $250^{\circ}C$. In order to get more reliable metallizations, effects on the post-annealing treatment to the electrical properties of the copper films have been investigated. The Cu films were annealed at the $5 \times10^{-6}$ Torr vacuum condition and the electrical resistivity and the nano-structures were measured for the Cu films. The electrical resistivity of Cu films shown to be reduced by the post-annealing. The electrical resistivity of 2.0 $\mu \Omega \cdot \textrm{cm}$ was obtained for the sample deposited at the substrate temperature of $180^{\circ}C$ after vacuum annealed at $300^{\circ}C$. The resistivity variations of the films was not exactly matched with the size of the nano-structures of the copper grains, but more depended on the contamination of the copper films.

• Proceedings of the Korean Society of Soil and Groundwater Environment Conference
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• 2003.04a
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• pp.115-119
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• 2003

Pollutants from industry, mining, agriculture, and other sources have contaminated sediments in many surface water bodies. Sediment contamination poses a severe threat to human health and environment because many toxic contaminants that are barely detectable in the water body can accumulate in sediment at much higher levels, the purpose of this study was to make convenient sampling method and optimal treatment of sediment for water quality improvement in reservoir or stream based on an evaluation of degree of contamination. Results for analysis of S-reservoir sediments were observed that copper concentration of almost areas were higher than the regulation of soil pollution (50 mg/1) for the riverbed. S-stream sediments were observed that copper, arsenic and TPH concentration of almost areas were exceeded soil pollution concerning levels for factorial areas. We used Remscreen(version. 1.0) program which is contaminated soil recovery program to select optimal treatment method of contaminant sediments. The result was shown in the order of Thermal Calcination > Excavation, Retrieval and Off-site Disposal(comparative less then contaminant) > Low Temperature Thermal Desorption + Solidification/Stabilization.