• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2001.11a
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• pp.7-7
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• 2001

The increasing interest in light weight materials coupled to the need for cost -effective processing have combined to create a significant opportunity for aluminum P/M. particularly in the automotive industry in order to reduce fuel emissions and improve fuel economy at affordable prices. Additional potential markets for Al PIM parts include hand tools. Where moving parts against gravity represents a challenge; and office machinery, where reciprocating forces are important. Aluminum PIM adds light weight, high compressibility. low sintering temperatures. easy machinability and good corrosion resistance to all advantages of conventional iron bm;ed P/rv1. Current commercial alloys are pre-mixed of either the AI-Si-Mg or AL-Cu-Mg-Si type and contain 1.5% ethylene bis-stearamide as an internal lubricant. The powder is compacted in closed dies at pressure of 200-500Mpa and sintered in nitrogen at temperatures between $580~630^{\circ}C$ in continuous muffle furnace. For some applications no further processing is required. although most applications require one or more secondary operations such as sizing and finishing. These sccondary operations improve the dimension. properties or appearance of the finished part. Aluminum is often considered difficult to sinter because of the presence of a stable surface oxide film. Removal of the oxide in iron and copper based is usually achieved through the use of reducing atmospheres. such as hydrogen or dissociated ammonia. In aluminum. this occurs in the solid st,lte through the partial reduction of the aluminum by magncsium to form spinel. This exposcs the underlying metal and facilitates sintering. It has recently been shown that < 0.2% Mg is all that is required. It is noteworthy that most aluminum pre-mixes contain at least 0.5% Mg. The sintering of aluminum alloys can be further enhanced by selective microalloying. Just 100ppm pf tin chnnges the liquid phase sintering kinetics of the 2xxx alloys to produce a tensile strength of 375Mpa. an increilse of nearly 20% over the unmodified alloy. The ductility is unnffected. A similar but different effect occurs by the addition of 100 ppm of Pb to 7xxx alloys. The lend changes the wetting characteristics of the sintering liquid which serves to increase the tensile strength to 440 Mpa. a 40% increase over unmodified aIloys. Current research is predominantly aimed at the development of metal matrix composites. which have a high specific modulus. good wear resistance and a tailorable coefficient of thermal expnnsion. By controlling particle clustering and by engineering the ceramic/matrix interface in order to enhance sintering. very attractive properties can be achicved in the ns-sintered state. I\t an ils-sintered density ilpproaching 99%. these new experimental alloys hnve a modulus of 130 Gpa and an ultimate tensile strength of 212 Mpa in the T4 temper. In contest. unreinforcecl aluminum has a modulus of just 70 Gpa.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.24 no.5
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• pp.224-228
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• 2014

Recently, the demands for separation/recovery of valuable metals such as nickel or tin from copper based alloys has been attracting much attention from the viewpoints of environmental protection and resource utilization. In this report, experimental results on concentration increasement of nickel and tin compared to the previous report are investigated. Ni is successfully separated by a organic solvent and reduced to the metal powder whose concentration is over 98 %. Sn is separated by a selective solution method and its concentration is increased to 97.5 % by three consecutive solution and reduction process. Crystal structure, surface morphology and microstructure of the separated samples are studied.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.47-52
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• 2013

Gold wire has long been used as a proven method of connecting a silicon die to a substrate in wide variety of package types, delivering high yield and productivity. However, with the high price of gold, the semiconductor packaging industry has been implementing an alternate wire material. These materials may include silver (Ag) or copper (Cu) alloys as an alternative to save material cost and maintain electrical performance. This paper will analyze and compare the electrical characteristics of several wire types. For the study, typical 0.6 mil, 0.8 mil and 1.0 mil diameter wires were selected from various alloy types (2N gold, Palladium (Pd) coated/doped copper, 88% and 96% silver) as well as respective pure metallic wires for comparison. Each wire model was validated by comparing it to electromagnetic simulation results and measurement data. Measurements from the implemented test boards were done using a vector network analyzer (VNA) and probe station setup. The test board layout consisted of three parts: 1. Analysis of the diameter, length and material characteristic of each wire; 2. Comparison between a microstrip line and the wire to microstrip line transition; and 3. Analysis of the wire's cross-talk. These areas will be discussed in detail along with all the extracted results from each type the wire.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.31 no.7
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• pp.112-117
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• 2003

The brazing of copper alloys and duplex stainless steels is an indispensable manufacturing technology for thrust chambers with regenerative cooling. For setting up the optimized brazing conditions, C18200 copper alloy plate with machined cooling channels and S31803 stainless steel plate are brazed with AMS4764 filler metals of which thickness is 50${\mu}m$ and 80${\mu}m$ They are tested by X-ray radiography, strength/leakage and fracture tests, and fracture surface inspection. The results obtained by the suggested conditions are that the specimen brazed with filler metal thickness of 50${\mu}m$ has good strength properties and brazed zone. However, the specimen with filler metal thickness of 80${\mu}m$ has the brazed zone with cooling channel obstruction and enlargement.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2000.06a
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• pp.54-61
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• 2000

A method and results of classification of 4 types metallic wear debris were presented by using their color features. The color image of wear debris was used (or the initial data, and the color properties of the debris were specified by HSI color model. Particle was characterized by a set of statistical features derived from the distribution of HSI color model components. The initial feature set was optimized by a principal component analysis, and multidimensional scaling procedure was used for the definition of classification plane. It was found that five features, which include mean values of H and S, median S, skewness of distribution of S and I, allow to distinguish copper based alloys, red and dark iron oxides and steel particles. In this work, a method of probabilistic decision-making of class label assignment was proposed, which was based on the analysis of debris-coordinates distribution in the classification plane. The obtained results demonstrated a good availability for the automated wear particle analysis.

• The Journal of Korean Academy of Prosthodontics
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• v.8 no.1
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• pp.42-47
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• 1968

The purpose of this study was to determine the gingival response to the various restorations for 3 weeks, 5 weeks and 8 weeks respectively after they had been inserted in 36 tooth of 3 dogs. The histopathological observation was also performed to evaluate the effect of the various restorations on gingival tissue. They included gold, copper and nickel-chrome alloy. The following findings were obtained. 1. The gingivae adjacent to the well adapted and polished restorations and their margins with a level of gingival crest were grossly and histopathologically found no specific changes. 2. The gingive adjacent to the ill fitting and unpolished restorations and their margins with subgingival extension of 1 to 1.5mm were not grossly found any changes. 3. There were no obvious difference in gingival response among the various alloys in histopathological observation.

• Journal of the Korean Society for Heat Treatment
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• v.33 no.5
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• pp.226-231
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• 2020

The Cu-Co-Si alloy shows high strength by forming precipitates by aging precipitation heat treatment of supersaturated solid solution treated with solution treatment such as Cu-Ni-Si alloy, and the Co₂Si precipitated phase is dispersed in the copper matrix. The effect of aging treatment on the microstructure, mechanical and electrical properties of Cu-Co-Si alloys for electronic devices was investigated. As a results of SEM/EDS analysis, it was found that Co₂Si precipitates of 30~300 nm size were distributed in grains. By performing the double aging treatment, it was possible to improve the strength and electrical conductivity by dispersing the fine precipitate evenly.

• Smart Structures and Systems
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• v.14 no.5
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• pp.883-900
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• 2014

Shape memory alloys (SMA) can dissipate energy through hysteresis cycles without significant residual deformation. This paper describes the fabrication and testing of copper-based SMA hourglass-shaped plates for use in energy dissipation devices and the development of a numerical model to reproduce the experiments. The plates were tested under cyclic flexural deformations, showing stable hysteresis cycles without strength degradation. A detailed nonlinear numerical model was developed and validated with the experimental data, using as input the constitutive relationship for the material determined from cyclic tests of material coupons under tension loading. The model adequately reproduces the experimental results. The study is focused on the exploitation of SMA in the martensite phase.

• Journal of the Korean Electrochemical Society
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• v.10 no.3
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• pp.175-178
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• 2007

Pure iron, Fe-0.4, and 1.2 wt.%Cu alloys were examined by conducting the electrochemical techniques in the weakly alkaline solution, pH9, controlled by $Ca(OH)_2$, solution added with 0.02M NaCl. The $R_P$ measured from ac impedance, selected 10 kHz and 10mHz, in weakly alkaline solutions containing chloride ions indicated that the addition of copper up to 1.2wt.% into the pure iron significantly improved the pitting resistance of iron. In contrast to alloy, the pure iron showed the rapid pitting occurrences in drying period. During the drying period, the corrosion potential of pure iron was shifted to less noble value, pitting initiation.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.352.2-352.2
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• 2014

In this present work, we report a Cu-Mn alloy as a materials for the self-forming barrier process. And we investigated diffusion barrier properties of self-formed layer on low-k dielectrics with or without UV curing treatment. Cu alloy films were directly deposited onto low-k dielectrics by co-sputtering, followed by annealing at various temperatures. X-ray diffraction revealed Cu (111), Cu (200) and Cu (220) peaks for both of Cu alloys. The self-formed layers were investigated by transmission electron microscopy. In order to compare barrier properties between Mn-based interlayer interlayer, thermal stability was measured with various low-k dielectrics. X-ray photoelectron spectroscopy analysis showed that chemical compositions of self-formed layer. The compositions of the Mn based self-formed barriers after annealing were determined by the C concentration in the dielectric layers.