• 한국전기전자재료학회논문지
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• 제32권4호
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• pp.267-271
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• 2019

A shingled PV module is manufactured by dividing and bonding. In this method, the solar cell is divided by lasers and bonded using electrically conductive adhesives (ECAs). Consequently, the manufacturing cost increases because a process step is added. Therefore, we aim to reduce the production cost by reducing the amount of Ag paste used in the solar cell front. Various electrode structures were designed and simulated. The number of fingers was optimized by designing thinner fingers, and the number of fingers with the maximum power conversion efficiency was confirmed. The simulation confirmed the maximum efficiency in the 4-divided electrode pattern. The amount of Ag paste used for each electrode pattern was calculated and analyzed. The number of fingers was optimized by decreasing the width of the finger; this will not only reduce the amount of Ag paste required but also the increase the efficiency.

• 열처리공학회지
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• 제19권4호
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• pp.219-224
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• 2006

Silver paste with low sintered temperature has been developed in order to apply electronic parts, such as bus electrode, address electrode in PDP (Plasma Display Panel) with large screen area. In this study, nano-sized silver particles with 10-30 nm were synthesized from silver nitrate ($AgNO_3$) solution by chemical reduction method and silver paste with low sintered temperature was prepared by mixing silver nanoparticles, conventional silver powder with the particle size 1.6 um and Pb-free frit. Conductive thick film from silver paste was fabricated by screen printing on alumina substrate. After firing at $540^{\circ}C$, the cross section and surface morphology of the thick films were analyzed by FE-SEM. Also, the sheet resistivity of the fired thick films was measured using the four-point technique.

• 동력기계공학회지
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• 제22권1호
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• pp.64-71
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• 2018

Currently, functional patterns are formed by screen printing on stretchable films, and they are applied to wearable and stretchable devices. In this study, three types of silver paste were prepared using three polyester binders with different Tg and molecular weights in order to impart elasticity to the conductive pattern itself. Rheological properties and DSC measurements were performed for each silver paste. Then, each silver paste was screen printing and cured by an IR dryer to evaluate adhesive strength, pencil hardness, resistance and surface shape change according to strain. As a result, it was found that the silver paste using a binder with a low Tg and a high molecular weight has the smallest resistance change depending on the strain. Namely, it was found that it is most preferable to use a binder with a low Tg and a high molecular weight as the stretchable electrode.

• 한국세라믹학회:학술대회논문집
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• 한국세라믹학회 2003년도 추계총회 및 연구발표회 초록집
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• pp.92.2-92
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• 2003

• 한국인쇄학회:학술대회논문집
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• 한국인쇄학회 2007년도 추계 학술논문 발표회
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• pp.59-64
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• 2007

We have manufactured low-curable silver pastes for gravure printing out of roll to roll printing process. When printing, the pastes be used different silver powder shape because of the printing characteristics. The pastes were prepared with silver powder by silver powder shape, polyester resin, solvent and homogenized on a standard three-roller mill. And the pastes exhibited a shear-thinning flow at viscosity profile. Moreover the adhesive strength and resistivity of silver film had good characteristics. With the manufactured paste in this study, RFID antenna circuit had flexible is manufactured and it had $10^{-4}{\sim}10^{-5}{\Omega}{\cdot}cm$.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.593-594
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• 2006

A novel thermal transfer method was developed to form the phosphor screen for VPT(Video Phone Tube). This method have advantages of simple process, clean environment, saving raw material and running-cost comparison of electrodeposition, spin coating of conventional methods. But now applying phosphor screen for thermal transfer method has been formed three layers (phosphor layer, ITO layer and thermal adhesive layer) on the PET film as substrate. This is complex process, run to waste of raw-material and require of high cost. Also ITO paste at present has been imported from Japan. To improve these problems, we have manufactured phosphor screen formed by two layers (phosphor layer and ITO layer). We have developed ITO paste that had both conductive and excellent thermal transfer abilities, made it of domestic raw-material.

• 전자공학회논문지A
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• 제28A권10호
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• pp.840-846
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• 1991

In case of the rapid thermal process by halogen lamps, an optical pyrometer is generally used to measure the temperature. It is, however, necessary to measure the temperature by the thermocouple when the process temperature is lower than 700$^{\circ}C$ and the correction of the temperature is required. Contact by the PdAg paste is commonly used out but in this case it is impossible to see the effect of surface states of the substrate, which is critical in the rapid thermal process. In this study, real temperature ramping speed of silicon substrates coveredwith various thin films such as SiO$_2$2, Si$_{3}N_{4}$, dopants, and conductive layers (Ti or Co) was investigated by a mechanical contact of the thermocouple. And the results were compared with the case in which the contact was made by the PdAg paste. Effect of process ambient was also studied. It was found that depending on the surface state, overshoot more than 100$^{\circ}C$ could occur. It was also found that in case of the substrate covered with conductive layers, mechanical contact might render the correct temperature.

• 공업화학
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• 제32권1호
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• pp.28-34
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• 2021

SiO2/Ag 코어-쉘 나노입자를 수정된 Stöber 공정법과 물/dodecylbenzenesulfonic acid (DDBA)/cyclohexane의 역 미셀에서 acetoxime을 환원제로 사용하는 역 미셀 방법을 상호 조합하여 합성하였다. SiO2/Ag 코어-쉘은 UV-visible spectroscopy, XRD, SEM 및 TEM을 사용하여 구조, 형태 및 크기를 조사하였다. SiO2/Ag 코어-쉘의 나노입자 크기는 [물]/[DDBA]의 몰비(WR)의 값을 조절하여 제어할 수 있었다. SiO2/Ag 코어-쉘의 크기와 다분산성은 WR 값이 증가함에 따라 증가하였다. 비정질 SiO2 나노입자 위에 생성된 Ag 나노입자는 430 nm에서 강한 표면 플라즈몬 공명 (SPR) 피크를 나타내었다. SPR 피크는 나노입자 크기의 증가에 따라 장파장으로의 적색 이동을 나타내었다. 합성된 SiO2/Ag 코어-쉘을 분산시켜 70 wt% 조성의 전도성 페이스트를 제조하고, 스크린 인쇄법으로 PET 필름에 코팅하여 전도성을 조사하였다. SiO2/Ag 코어-쉘 페이스트로 코팅된 필름은 상용 Ag 페이스트에 비하여 높은 460~750 µΩ/sq 영역의 표면저항을 나타내었다.

• 공업화학
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• 제34권1호
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• pp.36-44
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• 2023

코어-쉘 TiO₂/Ag 나노입자를 수정된 졸-겔 공정과 함께 acetoxime을 환원제로 사용한 물/dodecylbenzenesulfonic acid (DDBA)/cyclohexane의 역 미셀 방법으로 합성하였다. 합성된 TiO₂/Ag 나노입자의 구조, 형태 및 크기를 XRD, UV-visible spectroscopy, SEM, TEM 및 TGA를 이용하여 조사하였다. TiO₂/Ag 나노입자의 크기는 [물]/[DDBA]의 몰비를 조절하여 제어할 수 있었다. TiO₂/Ag 나노입자의 크기와 다분산성은 [물]/[DDBA]의 몰비가 증가함에 따라 증가하였다. 아나타제 결정상의 TiO₂ 나노입자 위에 생성된 Ag 나노입자는 430 nm 주변에서 강한 표면 플라즈몬 공명(SPR) 흡수 특성을 나타내었다. SPR 피크는 나노입자 크기의 증가에 따라 장파장으로의 적색 이동이 나타났다. 70 wt% 조성으로 TiO₂/Ag 나노입자를 분산시켜 전도성 페이스트를 제조하고, 스크린 인쇄법으로 PET 필름에 코팅하여 전도성을 조사하였다. TiO₂/Ag 나노입자 페이스트로 코팅된 필름은 상용 Ag 페이스트의 경우보다 높은 405~630 μΩ/sq 영역의 표면저항을 나타내었다.

• 마이크로전자및패키징학회지
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• 제14권4호
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• pp.9-14
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• 2007

본 연구에서는 가속화 조건에서의 비전도성 접착제가 사용된 플립칩 패키지의 열적 신뢰성에 관하여 평가하였다. 실리콘 칩에 $17{\mu}m$두께의 Au 범프를 형성하고 무전해 Ni/Au 도금과 Cu 패드의 두께가 각각 $5{\mu}m$와 $25{\mu}m$로 형성된 연성 기판을 사용하여 플립칩 패키지를 형성하였다. 유리전이온도가 $72^{\circ}C$인 비전도성 접착제를 사용하여 플립칩을 접합시킨 후 열충격 시험과 항온항습 시험을 실시하였다. 열충격 싸이클과 항온항습 유지 시간이 증가할수록 플립칩 패키지의 전기 저항이 증가하는 것을 확인할 수 있었다. 이는 Au 범프와 Au 범프 사이의 균열, 칩과 비전도성 접착제 또는 기판과 비전도성 접착제 사이의 층간 분리에 의한 것으로 사료된다. 또한 항온항습 하에서의 전기 저항의 변화가 열충격하에서 보다 큰 것을 확인할 수 있었다. 따라서 비전도성 접착제가 사용된 플립칩 패키지는 온도보다 습기에 더욱 민감하다는 것을 알 수 있었다.