• Korean Journal of Materials Research
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• v.25 no.3
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• pp.132-137
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• 2015

The effects of the mixing of an active material and a conductive additive on the electrochemical performance of an electric double layer capacitor (EDLC) electrode were investigated. Coin-type EDLC cells with an organic electrolyte were fabricated using the electrode samples with different ball-milling times for the mixing of an active material and a conductive additive. The ball-milling time had a strong influence on the electrochemical performance of the EDLC electrode. The homogeneous mixing of the active material and the conductive additive by ball-milling was very important to obtain an efficient EDLC electrode. However, an EDLC electrode with an excessive ball-milling time displayed low electrical conductivity due to the characteristic change of a conductive additive, leading to poor electrochemical performance. The mixing of an active material and a conductive additive played a crucial role in determining the electrochemical performance of EDLC electrode. The optimal ball-milling time contributed to a homogeneous mixing of an active material and a conductive additive, leading to good electrochemical performance of the EDLC electrode.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.224-224
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• 2015

Gel have enormous applicable region due to inherently high stretchability and bio-compatibility. Here, we fabricated highly stretchable electronic conductive organogels which have long-term stability in environment. By introducing a dialysis step which can incorporate conducting polymer, PEDOT, on the procedure of gel synthesis, residual ions inside the gel were removed. In addition, we replaced the water with organic solvent, EG, inside the gels which is high stability in air. Unlike conventional hydrogels, there are no ionic conduction occurred and electrochemically driven current was prevented during electrical voltage was applied. The fabricated organogels are hardly dried during air exposure, and only electrically conductive without any electrochemical reaction at even high voltage. In order to utilize as stretchable conductor, we demonstrated a LED array circuit using the conductive organogels as electrical interconnects. It was successfully operative even stretched up to 300% strain.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.417-417
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• 2009

Although a transparent conductive film (TCF) belongs to essential supporting materials for many device applications such as touch screens, flat panel displays, and sensors, a conventional transparent conductive material, indium-tin oxide (ITO), suffers from considerable drawback because the price of indium has soared since 2001. Despite a recent falloff, a demand of ITO is expected to increase sharply in the future due to the trend of flat panel display technologies toward flexible, paper-like features. There have been recently extensive studies to replace ITO with new materials, in particular, carbon nanotubes (CNTs) since CNTs possess excellent properties such as flexibility, electrical conductivity, optical transparency, mechanical strength, etc., which are prerequisite to TCFs. This study fabricated TCFs with single-walled carbon nanotubes (SWCNTs) produced by arc discharge. The SWCNTs were dispersed in water with a surfactant of sodium dodecyl benzene sulfonate (NaDDBS) under sonication. Carbon black and fullerene nanoparticles were added to the SWCNT-dispersed solution to enhance contact resistance between CNTs. TCFs were manufactured by a filtration and transfer method. TCFs added with carbon black and fullerene nanoparticles were characterized by scanning electron microscopy (SEM), UV-vis spectroscopy (optical transmittance), and four-point probe measurement (sheet resistance).

• The Korean Journal of Ceramics
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• v.6 no.3
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• pp.201-205
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• 2000

Fiber reinforced plastic (FRP) composites and ceramic matrix composites (CMC) which contain electrically conductive phases have been designed and fabricated to introduce the detection capability of damage/fracture detection into these materials. The composites were made electrically conductive by adding carbon and TiN particles into FRP and CMC, respectively. The resistance of the conductive FRP containing carbon particles showed almost linear response to strain and high sensitivity over a wide range of strains. After each load-unload cycle the FRP retained a residual resistance, which increased with applied maximum stress or strain. The FRP with carbon particles embedded in cement (mortar) specimens enabled micro-crack formation and propagation in the mortar to be detected in situ. The CMC materials exhibited not only sensitive response to the applied strain but also an increase in resistance with increasing number of load-unload cycles during cyclic load testing. These results show that it is possible to use these composites to detect and/or fracture in structural materials, which are required to monitor the healthiness or safety in industrial applications and public constructions.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.238.1-238.1
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• 2011

본 연구에서는 non-contact deposition method의 일환인 ESD (electroctatic deposition)의 박막공정을 이용하여 Conductive layer 위에 Gold nanoparticles 및 Silver nanoparticles 등 organic/inorganic nano particle conductive ink system의 단분산 2D 박막을 제조를 연구하였다. ESD head를 통해 여러가지 organic / inorganic nano particle conductive ink system을 Deposition하였으며 분산도가 높고 균일한 단분산의 2차원 박막 구조를 얻을 수 있었으며, 전도성 PEDOT과의 Hybridization을 통해 균일상의 표면 Morphology를 갖는 고 전도성 투명 필름을 제작하였다. ESD technique를 이용하는 박막공정 기술은 나노입자 및 나노구조물의 박막화 패턴화를 포함하는 새로운 Deposition 기술로써 이를 응용하여 금속 나노입자의 2차원의 패턴화된 박막 구현을 통해 유기반도체 및 전자소자에의 응용성을 증거할 수 있었다.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2004.04a
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• pp.147-150
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• 2004

Graphite reinforced conductive polymer composites were fabricated by the compression molding technique. Graphite powder (conductive filler) was mixed with an epoxy resin to impart electrical property in composites. The ratio of graphite powder was varied to investigate electrical property of cured conductive composites. In this study, graphite filled conductive polymer composites with high filler loadings$(>60wt.\%)$ were manufactured to accomplish high electrical conductivity(> 100S/cm). Graphite powder increase electrical conductivity of composites by direct physical contact between particles. While high filler loadings are needed to attain good electrical property, the composites becomes brittle. So the ratio of filler to epoxy was varied to optimize of cured composites. The optimum molding pressure according to filler was proposed experimentally.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.241.2-241.2
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• 2014

We present highly transparent liquid crystal displays (LCDs) using hybrid films based on carbon nanomaterials, metal grid, and indium-tin-oxide (ITO) grid. Carbon based nanomaterials are used as transparent electrodes because of high transmittance. Despite of their high transmittance they have relatively high sheet resistance. To solve this problem, we applied grid and made hybrid conductive films based on carbon nanomaterials. Conventional photolithography processes were used to make a grid pattern of metal and ITO. To fabricate transparent conductive films, carbon nanotube (CNT) ink was spin coated on the grid pattern. The transparency of the conductive film was controlled by shape and size of the grid pattern and the thickness of CNT films. The optical transmittance of CNT-based hybrid films is 92.2% and sheet resistance is also reduced to $168{\Omega}/square$. These substrates were used for the fabrication of typical twisted nematic (TN) LCD cells. From the characteristics of LCD devices such as transmittance, operating voltage, voltage holding ratio our devices were comparable to those of pristine ITO substrates. The result shows that the hybrid conductive films based on carbon nanomaterials could be alternative of ITO for the highly transparent LCDs.

• ETRI Journal
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• v.41 no.6
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• pp.820-828
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• 2019

A highly reliable conductive adhesive obtained by transient liquid-phase sintering (TLPS) technologies is studied for use in high-power device packaging. TLPS involves the low-temperature reaction of a low-melting metal or alloy with a high-melting metal or alloy to form a reacted metal matrix. For a TLPS material (consisting of Ag-coated Cu, a Sn96.5-Ag3.0-Cu0.5 solder, and a volatile fluxing resin) used herein, the melting temperature of the metal matrix exceeds the bonding temperature. After bonding of the TLPS material, a unique melting peak of TLPS is observed at 356 ℃, consistent with the transient behavior of Ag₃Sn + Cu₆Sn₅ → liquid + Cu₃Sn reported by the National Institute of Standards and Technology. The TLPS material shows superior thermal conductivity as compared with other commercially available Ag pastes under the same specimen preparation conditions. In conclusion, the TLPS material can be a promising candidate for a highly reliable conductive adhesive in power device packaging because remelting of the SAC305 solder, which is widely used in conventional power modules, is not observed.

• ETRI Journal
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• v.33 no.6
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• pp.864-870
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• 2011

As an isotropic conductive adhesive, that is, a hybrid Cu paste composed of Cu powder, solder powder, and a fluxing resin system, has been quantitatively characterized. The mechanism of an electrical connection based on a novel concept of electrical conduction is experimentally characterized using an analysis of a differential scanning calorimeter and scanning electron microscope energy-dispersive X-ray spectroscopy. The oxide on the metal surface is sufficiently removed with an increase in temperature, and intermetallic compounds between the Cu and melted solder are simultaneously generated, leading to an electrical connection. The reliability of the hybrid Cu paste is experimentally identified and compared with existing Ag paste. As an example of a practical application, the hybrid Cu paste is used for LED packaging, and its electrical and thermal performances are compared with the commercialized Ag paste. In the present research, it is proved that, except the optical function, the electrical and thermal performances are similar to pre-existing Ag paste. The hybrid Cu paste could be used as an isotropic conductive adhesive due to its low production cost.

• Korean Journal of Metals and Materials
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• v.50 no.10
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• pp.785-792
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• 2012

A new flip chip structure consisting of interlocking joints locally surrounded by non-conductive adhesive was investigated in order to improve the contact resistance characteristics and prevent the parasitic capacitance increase. The average contact resistance of the interlocking joints was substantially reduced from $135m{\Omega}$ to $79m{\Omega}$ by increasing the flip chip bonding pressure from 85 MPa to 185 MPa. Improvement of the contact resistance characteristics at higher bonding pressure was attributed not only to the increased contact area between Cu chip bumps and Sn pads, but also to the severe plastic deformation of Sn pads caused during formation of the interlocking-joint structure. The parasitic capacitance increase due to the non-conductive adhesive locally surrounding the flip chip joints was estimated to be as small as 12.5%.