• 한국인쇄학회지
• /
• 제30권3호
• /
• pp.45-56
• /
• 2012

Printing technology is accepted by appropriate technology that smart phones, tablet PC, display(LCD, OLED, etc.) precision recently in the electronics industry, the market grows, this process in the ongoing efforts to improve competitiveness through the development of innovative technologies. So printed electronics appeared by new concept. This technology development is applied on electronic components and circuits for the simplification of the production process and reduce processing costs. Low-temperature process making possible for widening, slimmer, lighter, and more flexible, plastic substrates, such as(flexible) easily by forming a thin film on a substrate has been studied. In the past, the formation of the electrode used a screen printing method. But the screen printing method is formation of fine patterns, high-speed printing, mass production is difficult. The roll-to-roll printing method as an alternative to screen printing to produce electronic devices by printing techniques that were used traditionally in the latest technology and processing techniques applied to precision control are very economical to implement fine-line printing equipment has been evaluated as. In order to function as electronic devices, especially the dozens of existing micro-level of non-dot print fine line printing is required, the line should not break at all, because according to the specifications required to fit the ink transfer conditions should be established. In this study of roll-to-roll printing conductive paste suitable for gravure offset printing by developing Ag paste for forming fine patterns to study the basic physical properties with the aim of this study were to.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
• /
• pp.913-918
• /
• 2005

It is expected that the inkjet technology offers prospect for reliable and low cost manufacturing of FPD (Flat Panel Display). This inkjet technology also offers a more simplified manufacturing process for various part of the FPD than conventional process. For example, recently the novel manufacturing processes of color filter (C/F) in LCD, or RGB patterning in OLED by inkjet printing method have been developed. This elaborates will be considered as the precious point of manufacturing process for the mass production of enlarged-display panel with a low price. On this point of view, we would like to review the status of inkjet technology in FPD, with some results on forming micro line by inkjet patterning of suspension type silver nano ink as below. We have studied the inkjet patterning of synthesized aqueous silver nano-sol on interface-controlled ITO glass substrate. Furthermore, we designed the conductive ink for direct inkjet patterning on bare ITO glass substrate. The first, the highly concentrated polymeric dispersant-assisted silver nano sol was prepared. The high concentration of batch-synthesized silver nano sol was possible to 40 wt%. At the same time the particle size of silver nanoparticles was below $10{\sim}20nm$. The second, the synthesized silver nano sol was inkjet - patterned on ITO glass substrate. The connectivity and width of fine line depended largely on the wettability of silver nano sol on ITO glass substrate, which was controlled by surfactant. The relationship was understood by wetting angle. The line of silver electrode as fine as $50{\sim}100\;{\mu}m$ was successfully formed on ITO glass substrate. The last, the direct inkjet-patternable silver nano sol on bare ITO glass substrate was designed also.

• 지구물리와물리탐사
• /
• 제10권1호
• /
• pp.50-59
• /
• 2007

물위나 육지에서 끄는 방식의 전기비저항 배열법의 등장은 그 자료량의 규모를 항공전자탐사의 규모에 가깝게 만들었으며, 이렇게 얻어진 자료들의 대부분은 해석을 위한 1 차원 역산이 시도되었다. 이 자료들의 믿을만한 해석과 자료처리를 실행 가능화시키기 위해서는 강력하고 완벽한 자동화 공정은 필수 불가결한 요소이다. 하상이나 염수 대수층의 상부와 같은 뾰족한 경계를 찾아내야 하므로 평활화제한법의 이용은 최소화 시켜야 한다. 적절한 역산 방식이라면 신호를 감쇠시키는 전도성 기반암의 경우에는 해석의 오류를 피하기 위해 낮은 신호대 잡음비를 현명하게 다룰 수 있어야 한다. 이를 위해 각각의 전극 배열법에 대해 하나의 탄력적 두께를 갖는 층을 운용하는 잡음 인지 역산 방법이 코딩되었다. 잡음 인지 역산법은 만약 전도성 기반암이 선호를 감쇠시켜 잡음 수준보다 작게 만들면 이를 감지하여 적당한 위치에 전도성 기반암을 갖는 모형을 구성해 준다. 초기모형의 층들은 4 극으로 구성된 각 전기 배열법의 유효깊이가 미치는 범위 내에서 제 위치를 찾아가게 된다. 이 알고리듬은 4 극의 유효깊이가 대략 지수함수적인 배열을 이루어 자료가 얻어졌을 때 가장 최상의 결과를 나타낸다. 접지저항을 줄이기 위한 선전극이나 용량선 안테나(capacitive-antenna)에 의한 자료의 역산도 가능하다. 이 논문은 이론자료와 오스트레일리아의 Murray 강의 염분차단 계획의 예를 들어 개발된 알고리듬의 유용성을 보여주었다.

• 마이크로전자및패키징학회지
• /
• 제8권4호
• /
• pp.11-15
• /
• 2001

본 연구에서는 RF-MEMS소자의 웨이퍼레벨 패키징에 적용하기 위한 밀봉 실장 방법에 대하여 연구를 하였다. 비전도성 B-stage에폭시를 사용하여 밀봉 실장하는 방법은 플립칩 접합 방법과 함께 MEMS 소자 패키징에 많은 장점을 줄 것이다. 특히 소자의 동작뿐만 아니라 기생성분의 양을 줄여야 하는 RF-MEMS 소자에는 더욱더 많은 장전을 보여준다. 비전도성 B-stage 에폭시는 2차 경화가 가능한 것으로 우수한 밀봉 실장 특성을 보였다. 패키징시 상부기관으로 사용되는 유리기판 위에 500 $\mu\textrm{m}$의 밀봉선을 스크린 프린팅 방식으로 패턴닝을 한 후에 $90^{\circ}C$와 $170^{\circ}C$에서 열처리를 하였다. 2차 경화 후 패턴닝된 모양이 패키징 공정이 끝날 때까지 계속 유지가 되었다. 패턴닝 후 에폭시 놀이가 4인치 웨이퍼에서 $\pm$0.6$\mu\textrm{m}$의 균일성을 얻었으며, 접합강토는 20 MPa을 얻었다. 또한 밀봉실장 특성을 나타내는 leak rate는 $10^{-7}$ cc/sec를 얻었다.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2009년도 하계학술대회 논문집
• /
• pp.210-211
• /
• 2009

In this study, we propose characteristics improvement methods according to via hole plating method for FBAR Duplexer with US PCS($T_x$:1850MHz~1910MHz, $R_x$:1930MHz~1990MHz) bandwidth which is used for wireless systems. Also, we designed and fabricated 3.8*3.8*1.8mm size microminiature FBAR Duplexer based on this proposal. First of all, in this study, we fabricated pentagon shape resonators by different size to make filter combination, and their quality factor(Q) are 687 with 6.6% of $k_{eff}^2$. Using this resonators, designed 3*2Type $T_x$ filter and 3*4Type $R_x$ filter. The transmission line, which works as phase shifter, is designed with $210{\mu}m$ in width and 18mm in length Stripline type. Inductor, which is used for matching component, is designed with width of $75{\mu}m$, a technically achievable minimum width. And adopted plating method of filling via hole with conductive epoxy for improved grounding and thermal conductivity. Using these configuration with all of the matching component values, we found Duplexer characteristics of -1.57dB ~ -1.73dB in insertion loss, -56dB in attenuation at 1850MHz~1910MHz of $T_x$ band. Also, found -2.71 dB ~ -3.23dB in insertion loss, -58dB in attenuation at 1930MHz~1990MHz of $R_x$ band.

• Journal of Electrical Engineering and Technology
• /
• 제10권5호
• /
• pp.2070-2076
• /
• 2015

Nano composite materials were multi-constituent combinations of nano dimensional phases with distinct differences in structure, chemistry and properties. Nano particles were less likely to create large stress concentrations and thereby can avoid the compromise of the material ductility while improve other mechanical properties. Corona discharge was an electrical discharge. The ionization of a fluid surrounding a conductor was electrically energized. This discharge would occur when the strength of the electric field around the conductor was high enough to form a conductive region, but not high enough to cause electrical breakdown or arcing to nearby objects. This paper shows all the studies done on the preparation of nano fillers. Special attention has given to the ACSR transmission line conductor, TiO₂ nano fillers and also to the evaluation of corona resistance on dielectric materials discussed in detail. The measurement of the dielectric properties of the nano fillers and the parameters influencing them were also discussed in the paper. Corona discharge test reveals that in 0%N ACSR sample corona loss was directly proportional to the applied line voltage. No significant change in corona loss between 0%N and 1%N. When TiO₂ nano filler concentration was increased up to 10%N fine decrement in corona loss was found when compared to base ACSR conductor, corona loss was decreased by 40.67% in 10%N ACSR sample. It was also found from the surface conditions test that inorganic TiO₂ nano filler increases the key parameters like tensile strength and erosion depth.

• 한국전기전자재료학회논문지
• /
• 제23권5호
• /
• pp.388-396
• /
• 2010

In this study, we propose characteristics improvement methods according to via hole plating method for FBAR Duplexer with bandwidth($T_x4: 1850 MHz ~ 1910 MHz, $R_x$:1930 MHz ~ 1990 MHz) which is used for wireless systems. Also, we designed and fabricated $3.8{\times}3.8{\times}1.8mm$ size microminiature FBAR Duplexer based on this proposal. First of all, in this study, we fabricated pentagon shape resonators by different size to make filter combination, and their quality factor(Q) are 687 with 6.6% of ${k_{eff}}^2$. Using this resonators, we designed $3{\times}2$ Type $T_x$ filter and $3{\times}4$ Type $R_x$ filter. The transmission line, which works as phase shifter, is designed with 210 ${\mu}m$ in width and 18 mm in length Stripline type. Inductor, which is used for matching component, is designed with width of 75 ${\mu}m$, a technically achievable minimum width. And adopted plating method of filling via hole with conductive epoxy for improved grounding and thermal conductivity. Using these configuration with all of the matching component values, we found Duplexer characteristics of -1.57 dB ~ -1.73 dB in insertion loss, -56 dB in attenuation at 1850 MHz ~ 1910 MHz of $T_x$ band. Also, found -2.71 dB ~ -3.23 dB in insertion loss, -58 dB in attenuation at 1930 MHz ~ 1990 MHz of $R_x$ band.

• ETRI Journal
• /
• 제25권2호
• /
• pp.65-72
• /
• 2003

To achieve cost and size reductions, we developed a low cost manufacturing technology for RF substrates and a high performance passive process technology for RF integrated passive devices (IPDs). The fabricated substrate is a conventional 6" Si wafer with a 25${\mu}m$ thick $SiO_2$ surface. This substrate showed a very good insertion loss of 0.03 dB/mm at 4 GHz, including the conductive metal loss, with a 50 ${\Omega}$ coplanar transmission line (W=50${\mu}m$, G=20${\mu}m$). Using benzo cyclo butene (BCB) interlayers and a 10 ${\mu}m$ Cu plating process, we made high Q rectangular and circular spiral inductors on Si that had record maximum quality factors of more than 100. The fabricated inductor library showed a maximum quality factor range of 30-120, depending on geometrical parameters and inductance values of 0.35-35 nH. We also fabricated small RF IPDs on a thick oxide Si substrate for use in handheld phone applications, such as antenna switch modules or front end modules, and high-speed wireless LAN applications. The chip sizes of the wafer-level-packaged RF IPDs and wire-bondable RF IPDs were 1.0-1.5$mm^2$ and 0.8-1.0$mm^2$, respectively. They showed very good insertion loss and RF performances. These substrate and passive process technologies will be widely utilized in hand-held RF modules and systems requiring low cost solutions and strict volumetric efficiencies.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2001년도 춘계학술대회논문집D
• /
• pp.181-188
• /
• 2001

The present research is an experimental study of subcooled flow boiling behavior using flat, microporousenhanced square heater surfaces in pure FC-72. Two $1-cm^{2}$ copper surfaces, one highly polished (plain) and one microporous coated, were flush-mounted into a 12.7 mm square, horizontal flow channel. Testing was performed for fluid velocities ranging from 0.5 to 4 m/s (Reynolds numbers from 18,700 to 174,500) and pure subcooling levels from 4 to 20 K. Results showed both surfaces' nucleate flow boiling curves collapsed to one line showing insensitivity to fluid velocity and subcooling. The log-log slope of the microporous surface nucleate boiling curves was lower than the plain surface due to the conductive thermal resistance of the microporous coating layer. Both, increased fluid velocity and subcooling, increase the CHF values for both surfaces, however, the already enhanced boiling characteristics of the microporous coating appear dominant and require higher fluid velocities to provide additional enhancement of CHF to the microporous surface.

• 한국콘크리트학회:학술대회논문집
• /
• 한국콘크리트학회 2004년도 춘계 학술발표회 제16권1호
• /
• pp.608-611
• /
• 2004

As the use of various electronic equipments has been increased recently according to industrialization and information network establishment, concern about electromagnetic wave exposed environment has also been increased. Therefore, this study aims to verify electromagnetic wave absorbing effects of inorganic paint that is made of carbon, electro-conductive materials with regard to its physical characteristics, its electromagnetic wave absorbing rate through a mock-up test for proving its effects in the indoor condition. The results are as follows: The results of running tests on electromagnetic wave absorbing inorganic paints for checking their requirements as painting material such as adherence degree, resistance to fine crack, resistance to washing, alkali-resistance, discoloration-resistance, etc. show that inorganic paints have the physical characteristics meeting the requirements for painting materials. In addition, it shows that the electromagnetic wave absorbing effect, in line with the number of paintings and the thickness of paintings, secures $75\~89\%$ of efficiency. And the mock-up test shows that the electromagnetic wave absorbing effect inside building is directly proportional to the distance from the source of electromagnetic wave such as electronic equipments.