• Transactions of the Korean hydrogen and new energy society
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• v.26 no.3
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• pp.234-240
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• 2015

In the face of the world's growing energy storage needs, liquid hydrogen offers a high energy density solution for the storage and transport of energy throughout society. A 5 L liquid hydrogen storage tank has been designed, fabricated and tested to investigate boil-off rate of liquid hydrogen. As the insulation plays a key role on the cryogenic vessels, various insulation methods have been employed. To reduce heat conduction loss, the epoxy resin-based insulation supports G-10 were used. To minimize radiation heat loss, vapor cooled radiation shield, multi-layer insulation, and high vacuum were adopted. Mass flow meter was used to measure boil-off rate of the 5 L cryogenic vessel. A series of performance tests were done for liquid nitrogen and liquid hydrogen to compare with design parameters, resulting in the boil-off rate of 1.7%/day for liquid nitrogen and 16.8%/day for liquid hydrogen at maximum.

• ETRI Journal
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• v.24 no.5
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• pp.349-359
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• 2002

With Ni/Au and Pd/Au metal schemes and low temperature processing, we formed low resistance stable Ohmic contacts to p-type GaN. Our investigation was preceded by conventional cleaning, followed by treatment in boiling $HNO_3$:HCl (1:3). Metallization was by thermally evaporating 30 nm Ni/15 nm Au or 25 nm Pd/15 nm Au. After heat treatment in $O_2$ + $N_2$ at various temperatures, the contacts were subsequently cooled in liquid nitrogen. Cryogenic cooling following heat treatment at $600^{\circ}C$ decreased the specific contact resistance from $9.84{\times}10^{-4}$ ${\Omega}cm^2$ to $2.65{\times}10^{-4}$ ${\Omega}cm^2$ for the Ni/Au contacts, while this increased it from $1.80{\times}10^{-4}$ ${\Omega}cm^2$ to $3.34{\times}10^{-4}$ ${\Omega}cm^2$ for the Pd/Au contacts. The Ni/Au contacts showed slightly higher specific contact resistance than the Pd/Au contacts, although they were more stable than the Pd contacts. X-ray photoelectron spectroscopy depth profiling showed the Ni contacts to be NiO followed by Au at the interface for the Ni/Au contacts, whereas the Pd/Au contacts exhibited a Pd:Au solid solution. The contacts quenched in liquid nitrogen following sintering were much more uniform under atomic force microscopy examination and gave a 3 times lower contact resistance with the Ni/Au design. Current-voltage-temperature analysis revealed that conduction was predominantly by thermionic field emission.