• 한국지구과학회지
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• 제31권4호
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• pp.301-312
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• 2010

지화학 자료는 환경 관리를 위한 중요한 환경 변수중 하나로 인식되어 왔다. 지화학 자료는 보통 공간적으로 산재되어 수집되기 때문에, 샘플링 되지 않은 지점에서의 속성값 예측과 더불어 부가적인 분석을 위해 예측에 수반되는 불확실성을 추정할 필요가 있다. 이 논문은 지시자 지구통계학이 지화학 자료의 공간적인 분포값의 제시뿐만 아니라 의사결정을 보조할 수 있는 정보를 제공하기 위해 유용하게 사용될 수 있는지를 예시하고자 한다. 카드뮴 자료의 추정사례 연구를 통해 확률론적 불확실성 모델링, 위험성 분석 등 지구통계학적 분석의 틀을 제시하였다. 지시자 크리깅을 통해 조건부 누적 분포 함수를 모델링한 후에, 기대값 추정치와 조건부 분산을 카드뮴의 추정값과 정량적 불확실성 추정을 위해 각각 계산하였다. 그리고 확률 임계치와 속성 임계치의 적용을 통해 오염/비오염 지역을 구분하였다. 또한 조건부 분산과 속성값과 임계치값의 차이를 모두 설명할 수 있는 변동 계수를 통해 추가적인 샘플링 지점을 추출하였다. 이 연구에서 적용한 지시자 지구통계학적 분석 틀은 불확실성을 고려한 의사 결정과 관련하여 지화학 자료를 포함한 환경 변수의 분석에 유용하게 사용될 수 있을 것으로 기대된다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.239-240
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• 2012

With advancements in semiconductor device technologies, manufacturing processes are getting more complex and it became more difficult to maintain tighter process control. As the number of processing step increased for fabricating complex chip structure, potential fault inducing factors are prevail and their allowable margins are continuously reduced. Therefore, one of the key to success in semiconductor manufacturing is highly accurate and fast fault detection and classification at each stage to reduce any undesired variation and identify the cause of the fault. Sensors in the equipment are used to monitor the state of the process. The idea is that whenever there is a fault in the process, it appears as some variation in the output from any of the sensors monitoring the process. These sensors may refer to information about pressure, RF power or gas flow and etc. in the equipment. By relating the data from these sensors to the process condition, any abnormality in the process can be identified, but it still holds some degree of certainty. Our hypothesis in this research is to capture the features of equipment condition data from healthy process library. We can use the health data as a reference for upcoming processes and this is made possible by mathematically modeling of the acquired data. In this work we demonstrate the use of recurrent neural network (RNN) has been used. RNN is a dynamic neural network that makes the output as a function of previous inputs. In our case we have etch equipment tool set data, consisting of 22 parameters and 9 runs. This data was first synchronized using the Dynamic Time Warping (DTW) algorithm. The synchronized data from the sensors in the form of time series is then provided to RNN which trains and restructures itself according to the input and then predicts a value, one step ahead in time, which depends on the past values of data. Eight runs of process data were used to train the network, while in order to check the performance of the network, one run was used as a test input. Next, a mean squared error based probability generating function was used to assign probability of fault in each parameter by comparing the predicted and actual values of the data. In the future we will make use of the Bayesian Networks to classify the detected faults. Bayesian Networks use directed acyclic graphs that relate different parameters through their conditional dependencies in order to find inference among them. The relationships between parameters from the data will be used to generate the structure of Bayesian Network and then posterior probability of different faults will be calculated using inference algorithms.