• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.7
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• pp.273-279
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• 2016

This paper deals with a control system with a concentration sensor for Ni-W alloy plating solutions. The printed circuit board market has increased with the development of the electronics industry. Gold consumption has also increased dramatically. Various studies of composite plating solutions have been conducted because of the expense of gold. In comparison, the development of sensors capable of measuring a composite plating solution in real-time is still insufficient. Furthermore, there are few systems that can measure and control the concentration of the solution precisely. This study developed a sensor and system to control the concentration of composite plating solution accurately. The sensors were developed based on a spectrophotometric method and a feedback control method was applied in this system.