• 제목/요약/키워드: columnar structure

검색결과 277건 처리시간 0.025초

Hot Wire CVD법에 의한 미세결정 실리콘 박막의 저온 증착 (Low Temperature Deposition of $\mu$ c-Si:H Films by Hot Wire CVD)

  • 이정철;강기환;김석기;윤경훈;송진수;박이준
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2000년도 하계학술대회 논문집 C
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    • pp.1763-1765
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    • 2000
  • This paper presents deposition and characterizations of microcrystalline silicon ($\mu$ c-Si:H) films prepared by hot wire chemical vapor deposition at substrate temperature at 300$^{\circ}C$. The flow rates of $SiH_4$ gas are critical parameter for the formation of Si films with microcrystalline phase. We could obtain $\mu$ c-Si:H with columnar grain structure and volume fraction of 75% without H2 dilution. The electronic properties, hydrogen bonding configurations, and $H_2$ concentration inside the films are also strongly affected by $SiH_4$ flow rate, which is provided in this paper.

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CoCr(Mo) 박막의 자기적 특성 및 미세구조에 미치는 Si 하지층의 영향 (The Effect of Si Underlayer on the Magnetic Properties and Crystallographic Orientatation of CoCr(Mo) Thin Film)

  • 이호섭;남인탁
    • 한국자기학회지
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    • 제9권5호
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    • pp.256-262
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    • 1999
  • DC/RF magnetron sputtering system을 이용하여 CoCr 박막 및 CoCrMo 박막의 Si 하지층의 도입에 따른 자기적 특성 및 미세구조의 변화에 대해 살펴보았다. 박막의 자기적 특성을 VSM을 통하여 측정한 결과, 고온에서 증착된 CoCrMo/Si 박막의 경우가 CoCr/Si 박막과는 달리 Si 하지층의 두께가 증가할수록 수직보자력값이 증가하는 것을 알 수 있었으며 AFM과 SEM을 이용한 surface morphology의 변화를 통하여 결정립 미세화와 균일화가 수직보자력을 증진시킴을 알 수 있었다. 또한, 박막의 결정배향성 및 미세구조를 XRD와 SEM을 통하여 관찰한 결과, CoCrMo/Si 박막의 (0002)우선 배향성이 CoCr/Si 박막의 (0002) 우선 배향성보다 상당히 크게 증진된 것을 볼 수 있었으며, SEM의 단면 측정을 통하여 CoCrMo/Si 박막과 CoCr/Si 박막의 기판 표면에서 성장하는 columnar 구조의 발달을 잘 관찰할 수 있었다.

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Microstructure and electrical properties of high power laser thermal annealing on inkjet printed Ag films

  • Yoon, Yo-Han;Yi, Seol-Min;Yim, Jung-Ryoul;Lee, Ji-Hoon;Joo, Young-Chang
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2009년도 춘계학술발표대회
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    • pp.36.2-36.2
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    • 2009
  • In this work, the high power CW Nd:YAG laser has been used for thermal treatment of inkjet printed Ag films-involving eliminating organic additives (dispersant, binder, and organic solvent) of Ag ink and annealing Ag nanoparticles. By optimizing laser parameters, such as laser power and defocusing value, the laser energy can totally be converted to heat energy, which is used to thermal treatment of inkjet printed Ag films. This results in controlling the microstructures and the resistivity of films. We investigated the thermal diffusion mechanisms during laser annealing and the resulting microstructures. The impact of high power laser annealing on microstructures and electrical characteristic of inkjet printed Ag films is compared to those of the films annealed by a conventional furnace annealing. Focused ion beam (FIB) channeling image shows that the laser annealed Ag films have large columnar grains and dense structure (void free), while furnace annealed films have tiny grains and exhibit void formation. Due to these microstructural characteristics of laser annealed films, it has better electrical property (low resistivity) compared to furnace annealed samples.

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Deposition of Cu-Ni films by Magnetron Co-Sputtering and Effects of Target Configurations on Film Properties

  • Seo, Soo-Hyung;Park, Chang-Kyun;Kim, Young-Ho;Park, Jin-Seok
    • KIEE International Transactions on Electrophysics and Applications
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    • 제3C권1호
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    • pp.23-27
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    • 2003
  • Structural properties of Cu-Ni alloy films, such as preferred orientation, crystallite size, in-ter-planar spacing, cross-sectional morphology, and electrical resistivity, are investigated in terms of tar-get configurations that are used in the film deposition by means of magnetron co-sputtering. Two different target configurations are considered in this study: a dual-type configuration in which two separate tar-gets (Cu and Ni) and different bias types (RF and DC) are used and a Ni-on-Cu type configuration in which Ni chips are attached to a Cu target. The dual-type configuration appears to have some advantages over the Ni-on-Cu type regarding the accurate control of atomic composition of the deposited Cu-Ni alloy. However, the dual-type-produced film exhibits a porous and columnar structure, the relatively large internal stress, and the high electrical resistivity, which are mainly due to the relatively low mobility of adatoms. The affects of thermal treatment and deposition conditions on the structural and electrical properties of dual-type Cu-Ni films are also discussed.

벽면 모델링을 이용한 저압용 일체형 코드의 화재확산 패턴 (The Fire Dispersive Patterns of the Power Cord Sets for Low Voltage Appliances in Wall-modeling)

  • 송길목;김향곤;김동욱;김동우;김영석;최충석
    • 한국조명전기설비학회:학술대회논문집
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    • 한국조명전기설비학회 2004년도 춘계학술대회 논문집
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    • pp.330-334
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    • 2004
  • In this paper, we studied on the fire dispersive patterns and the fire progress at the power cord sets for low voltage appliances in the wall-model. For the experiment, we manufactured a wall-model and applied the external flame at the power cord sets. From the results, short-circuit of the power cord sets was haunted by the external flame it was disconnected with the flashing and the scattering. The fire progress on the polyvinyl chloride insulated flexibel cords is not observed because the ignition energy decreases. In case of rubber insulated flexible cords, however, the fire was progressed continuously. Molten marks were formed at a two electric wire by continuous electric discharge in power source part. A large molten mark was formed in load part. And the columnar structure and voids were observed in molten wire.

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Ti가 함유된 스테인리스강에서 Ti, Ti/Cr 코팅표면과 플라즈마질화표면의 부식특성 (Corrosion Characteristics of Ti, Ti/Cr Coated and Plasma-Nitrided Surface for Stainless Steel Containing Ti)

  • 최한철;이승훈;김관휴
    • 한국표면공학회지
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    • 제36권1호
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    • pp.89-98
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    • 2003
  • Corrosion characteristics of Ti, Ti/Cr coated and plasma-nitrided surface for stainless steel containing Ti have been studied. Stainless steels containing 0.09-0.92wt% Ti were fabricated by using vacuum furnace and solutionized for 1hr at $1050^{\circ}C$. Ti and Cr coatings were done on solutionized stainless steel surface by EB-PVD. The Ti coated specimen were coated by Cr and were nitrided by plasma at $450^{\circ}C$ for 5hr Microstructure and phase analysis were performed using SEM, OM and EDX. Corrosion behavior of the coated specimen was investigated by electrochemical test. The coated surface was of fine columnar structure. The Ti/Cr coated surface was denser than the Ti coated and the Ti coated-nitrided surfaces. The corrosion and pitting potential increased in proportion to the Ti content, coating temperature, coating thickness and formation of stable oxide film. The current density in active and passive region decreased in the case of Ti/Cr coated sample and Ti coated-nitrided samples. Especially the plasma nitrided specimen after Ti coating have a good corrosion resistance compared with the Ti coated specimen. The number and size of pits decreased as Ti content of matrix increased.

CrAlN과 CrZrN의 산화 (Oxidation of CrAlN and CrZrN Films)

  • 김민정;김슬기;이상율;이동복
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2011년도 춘계학술대회 및 Fine pattern PCB 표면 처리 기술 워크샵
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    • pp.33-35
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    • 2011
  • Films of CrAlN and CrZrN were deposited on a steel substrate by closed field unbalanced magnetron sputtering, and their oxidation behaviors were investigated. CrAlN films consisted of dense, polycrystalline CrN and AlN fine columns. The formed oxides consisted primarily of crystalline $Cr_2O_3$ incorporated with $Al_2O_3$. The oxide layers were thin and compact so as to make CrAlN films more protective than CrN films. In case of CrZrN films, Zr atoms were dissolved in the CrN phase. Zr atoms advantageously refined the columnar structure, reduced the surface roughness, and increased the micro-hardness. However, the addition of Zr did not increased oxidation resistance, mainly because Zr was not a protective element. All the deposited films displayed relatively good oxidation resistance, owing to the formation of the highly protective $Cr_2O_3$ on their surface. The $Cr_{40}Zr_9N$ and $Cr_{31}Zr_{16}N$ films oxidized to $Cr_2O_3$ as the major phase and ${\alpha}-ZrO_2$ as the minor one, whereas the CrN film oxidized to $Cr_2O_3$.

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Al doped ZnO 박막 증착을 위한 모듈레이티드 펄스 스퍼터링 (Modulated Pulse Power Sputtering Technology for Deposition of Al Doped ZnO Thin Film)

  • 양원균;주정훈
    • 한국표면공학회지
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    • 제45권2호
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    • pp.53-60
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    • 2012
  • Modulated Pulse Power (MPP) magnetron sputtering is a new high-power pulsed magnetron sputtering (HPPMS) technology which overcomes the low deposition rate problem by modulating the pulse voltage shape, amplitude, and the duration. Highly ionized magnetron sputtering can be performed without arcing because it can be controlled as multiple steps of micro pulses within one overall pulse period in the range of 500-3,000 ${\mu}s$. In this study, the various waveforms of discharge voltage and current for micro pulse sets of MPP were investigated to find the possibility of controlling the strongly ionized plasma mode. Enhanced ionization of the sputtered metal atoms was obtained by OES. Large grained columnar structure can be grown by the strongly ionized plasma mode in the AZO deposition using MPP. In the most highly ionized deposition condition, the preferred orientation of (002) plane decreased, and the resistivity, therefore, increased by the plasma damage.

증착속도에 따른 CSI layer의 기하학적 특성 연구 (Investigation of Geometrical Properties on Deposition Rate in Cesium Iodine Film)

  • 이규홍;박지군;강상식;차병열;조성호;남상희
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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    • pp.415-417
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    • 2003
  • CsI 형광체는 X선에 대한 분해능 및 변환효율이 우수한 물질이다. 최근 대면적 평판형 X선 영상검출기의 변환층으로 이용하기 위해 CsI 형광체의 대면적 제조에 대한 연구가 활발히 진행되고 있다. 본 논문은 진공 열증착법을 이용하여 증착속도(3, 3.8, $4.5\;{\mu}m/min$)에 따라 $20\;{\mu}m$ 두께의 CsI 필름을 제조하였고, XRD 및 SEM 분석을 통해 CsI 필름의 기하학적 구조를 조사하였다. 증착된 CsI 필름은 증착속도에 관계없이 복잡한 다결정 구조를 가지며, $3\;{\mu}m/min$의 증착속도에서 약 $1\;{\mu}m$ 크기로 needle-like 한 columnar structure를 가졌다. As results, about 3um/min evaporation rate formed as good geometry characteristics CsI layer.

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Effect of CrN barrier on fuel-clad chemical interaction

  • Kim, Dongkyu;Lee, Kangsoo;Yoon, Young Soo
    • Nuclear Engineering and Technology
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    • 제50권5호
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    • pp.724-730
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    • 2018
  • Chromium and chromium nitride were selected as potential barriers to prevent fuel-clad chemical interaction (FCCI) between the cladding and the fuel material. In this study, ferritic/martensitic HT-9 steel and misch metal were used to simulate the reaction between the cladding and fuel fission product, respectively. Radio frequency magnetron sputtering was used to deposit Cr and CrN films onto the cladding, and the gas flow rates of argon and nitrogen were fixed at certain values for each sample to control the deposition rate and the crystal structure of the films. The samples were heated for 24 h at 933 K through the diffusion couple test, and considerable amount of interdiffusion (max. thickness: $550{\mu}m$) occurred at the interface between HT-9 and misch metal when the argon and nitrogen were used individually. The elemental contents of misch metal were detected at the HT-9 through energy dispersive X-ray spectroscopy due to the interdiffusion. However, the specimens that were sputtered by mixed gases (Ar and $N_2$) exhibited excellent resistance to FCCI. The thickness of these CrN films were only $4{\mu}m$, but these films effectively prevented the FCCI due to their high adhesion strength (frictional force ${\geq}1,200{\mu}m$) and dense columnar microstructures.