• Title/Summary/Keyword: columnar growth

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Atomic structure of amorphous carbon deposited by various incidence angles -MD simulation study

  • Jo, Min-Ung;Lee, Gwang-Ryeol
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.02a
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    • pp.52-52
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    • 2010
  • Amorphous carbon films have a variety of potential applications. In most such applications film properties are crucial and highly dependent on the film growth conditions. We here investigate the atomic structure of the films, which is generated at various incidence angles, using the classical molecular dynamics. Varying incidence angle of the deposited carbon atoms, different level of sp hybridization and porosity of the film are captured in our model. As the incidence angle becomes glancing, subplantation of the deposited carbon in vertical direction is significantly reduced, rather bouncing back of the incident carbon with slight modification of surface structure is mainly occurred at the early stage of the film growth. As the surface becomes rougher, shadowing effect at these glancing incidences also becomes more significant, which tends to cause asymmetrical and columnar structure. We describe incidence angle dependence of the evolution of the atomic structure of the film and its corresponding properties.

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Effect of the Tertiary Recrystallization on the Magnetic Properties of High Silicon Iron (고규소철 강판의 자기적 특성에 미치는 3차 재결정의 영향)

  • Koo, J.M.
    • Journal of the Korean Society for Heat Treatment
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    • v.10 no.4
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    • pp.246-254
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    • 1997
  • The 6.5wt %Si-Fe alloy sheets were made by the twin roll process. The magnetic properties and microstructures of sheets annealed in the sulfur atmosphere were studied. In the as-prepared sheet, non-oriented columnar grains about $10{\mu}m$ in diameter were observed, which grew from the surface to the inner part of the sheet. When the annealing temperature was around $700^{\circ}C$, the primary recrystallization was formed around the middle part of the sheet thickness, and the grain size increased with increasing annealing temperature. At the annealing temperature of $900^{\circ}C$, the grain size became $30{\sim}40{\mu}m$. Around the annealing temperature, the motive force of the grain growth is the grain boundary energy. However, above $1000^{\circ}C$ the surface energy played an important role in the observed grain growth. When the sheet were annealed at $1200^{\circ}C$, the grains whose (100) planes were paralled to the thin plate surface grew, and all sheet surfaces were covered with these grains after 1 hour annealing. This phenomenon is called tertiary recrystallization. A difference in surface energy between (100) and (110) surfaces provides a driving force for growth of tertiary grains. The coercive force was 0.27 mOe and the AC core loss $W_{12/50}$ was 0.38w/kg for the 6.5wt%Si-Fe alloy.

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Effects of an External Magnetic Field During Electrodeposition on the Magnetic Properties of CoPtP Alloys (전기도금 시 외부자기장이 CoPtP 합금의 자기 특성에 미치는 영향)

  • Jeung, W.Y.;Park, H.D.
    • Journal of the Korean Magnetics Society
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    • v.15 no.5
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    • pp.276-281
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    • 2005
  • We have investigated the effects of an external magnetic field on the growth direction and the grain size of electrochemically prepared CoPtP alloys. Electrodeposited CoPtP alloys were synthesized by appling an external magnetic field with 0 to 1 T to the perpendicular direction of the films. In the electrodeposited CoPtP alloys without external magnetic field, the growth direction of the alloys was mixed by fcc (111) and hop (002), but only hop (002) was observed in the alloys with 1 T external magnetic field. CoPtP alloys were grown as the columnar growth and the grain size increases with growing the alloys. With appling an external field, the grain size of the alloys was controlled less than 20 nm which is smaller than single domain of Co, and the easy axis of alloys, hcp (002) direction, was grown perpendicular to the films up to 200 nm. We could obtain the optimal thickness of the alloys and electrodeposition condition from the above results. Coercivity and squareness of CoPtP alloys taken out-of-plane are 6.1 kOe and 0.9, respectively. The magnetic properties of CoPtP alloys were measured by VSM, and the microstructural characterization and crystalline orientation measurement of the alloys were carried out by TEM and XRD.

Breeding of a new cultivar of Lentinula edodes 'Charmjon' (표고버섯 신품종 '참존' 육성 및 특성)

  • Ji-Hoon Im;Youn-Lee Oh;Minji Oh;Minseek Kim;Kab-Yeul Jang
    • Journal of Mushroom
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    • v.21 no.4
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    • pp.261-265
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    • 2023
  • We aimed to develop outstanding domestic varieties suitable for both columnar and cylindrical-shape substrates, aiming to replace foreign varieties. and bred a high-quality new strain named 'Charmjon', using genetic resources collected from Japan and China. The optimal cultivation temperature for Charmjon's mycelial growth was found to be 25℃, and its mycelial growth at 15℃ and 25℃ was superior to the control variety. In terms of mycelial growth characteristics based on the substrate, Charmjon exhibited excellent mycelial strength on PDA medium compared to the control variety. Through columnar and cylindrical-shape substrates cultivation, we assessed the quantity and morphological characteristics of the fruiting bodies. The results confirmed that Charmjon can be produced stably using both cultivation methods, and it showed higher yields and individual weights than the control variety. In addition, the color of the pileus was notably darker, and the shape of the pileus varied depending on the cultivation method. The test of genetic diversity revealed that Charmjon has distinct genetic characteristics compared to the control varieties.

Fabrication of CVD SiC Double Layer Structure from the Microstructural Change Through Input Gas Ratio (입력기체비를 이용한 미세구조 변화로부터 화학증착 탄화규소의 복층구조 제작)

  • 오정환;왕채현;최두진;송휴섭
    • Journal of the Korean Ceramic Society
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    • v.36 no.9
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    • pp.937-945
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    • 1999
  • In an effort to protect a RBSC(reaction -bonded SiC) tube SiC films from methyltrichlorosilane(MTS) by low pressure chemical vapor deposition were deposited in hydrogen atmosphere on the RBSC(reaction-bonded SiC) substrates over a range of input gas ratio(${\alpha}=P_{H2}/P_{MTS}=Q_{H2}/Q_{MTS}$=1 to 10) and deposition temperatures(T=1050~1300$^{\circ}C$). At the temper-ature of 1250$^{\circ}C$ the growth rate of SiC films increased and then decreased with decreasing the input gas ratio. The microstructure of SiC films was changed from granular type structure exhibiting (111) preferred orientation in the high input gas ratios to faceted columnar grain structure showing (220) in the low input gas ratios. The similar microstructure change was obtained by increasing the deposition temperature. These results were closely related to a change of deposition mechanism. Double layer structure having granular type and faceted ciolumnar grain structure from the manipulation of mechanism. Double layer structure having granular type and faceted columnar grain structure from the manipulation of the input gas ratio without changing the deposition temperatue was successfully fabricated through in -site process.

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The Effect of Various Process Conditions on the Physical Properties of Dense Silver Films, Prepared by Using Sputter Deposition on Polyester Substrate (Polyester 상에서 Sputter 증착되는 고 밀도 은경 박막의 물리적 특성에 미치는 공정조건 변화의 효과)

  • Ri, Ui-Jae;Hwang, Tae-Su
    • Korean Journal of Materials Research
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    • v.9 no.7
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    • pp.707-714
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    • 1999
  • To save electrical energy as much as 40 % for fluorescent lighting, the reflectors coated with silver reflective thin films recently became popular with higher reflectivities and long life. The thin films fabricated by using sputtering techniques are produced mainly in U.S.A. On the other hand, some silver films deposited by using evaporation methods show low adhesion in general, although the reflectivity is no problem. We have studied various PVD methods to obtain thin films with high reflectivity and adhesion on a substrate of polyester, for a couple of years. Silver films manufactured byusing evaporation showed the reflectivity of 96.4 % and the adhesion of $12 kg/\textrm{cm}^2$. while samples manufactured by using sputtering depicted the adhesion as much as $20 Kg/\textrm{cm}^2$ that is almost double, although their reflectivity was not much different. X-ray diffraction spectra for the sputtered films demonstrated a preferential growth on (111) plane and the cross-sections of the specimens revealed a dense columnar structure to result in the enhanced adhesion.

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Improvement of semiconductor contact hole filling of Copper by ionized cluster beam deposition technique (이온화클러스터빔 증착법에 의한 구리 박막의 반도체 접촉구 메움 향상에 관한 연구)

  • Baek, Min;Son, Ki-Wang;Kim, Do-Jin
    • Journal of the Korean Vacuum Society
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    • v.7 no.2
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    • pp.118-126
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    • 1998
  • A study to improve filling of semiconductor contact holes by enhancement of the directionality of the source beams has been undertaken. The collimation of source beams was improved by the ionized cluster beam deposition technique with modification of the cell geometry. The collimation tested with neutral beam was excellent. But, the Cu flims were grown in a columnar mode due to the lack of surface mobilit of the impinged clusters. A shadow effect also caused cleavage and consequent discontinuity at the steos as films grow. By applying acceleration voltage, the columnar growth in a contact hole of 0.5 $\mu$m diameter and 1 $\mu$m height disappeared and considerable coverage at the side wall of the contacts as well as perfect bottom coverage were observed. These are all due to the assistants of the accelerated ionized clusters with high kinetic energy. Thus we demonstrated that the ICB deposition technique can be used to completely fill sub-half-micron contact holes with high aspect ratio.

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A Study on the Judgment of Fire Cause of Ballast for Fluorescent Lamp (형광등용 안정기의 화재원인 판정에 관한 연구)

  • 최충석;백동현
    • Fire Science and Engineering
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    • v.14 no.3
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    • pp.1-5
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    • 2000
  • In this paper, we analyzed the fire hazard of the ballast for fluorescent lamp used as the indoor lighting. In the result of being analyzed the ballast wire by stereo microscope, many melting points were discovered, it was impossible to judge a cause with the naked eye. In the Thermal-deteriorated ballast wire, elongation structure disappeared at above $700^{\circ}$, and it only showed the enlarged appearance of the copper particle. On the metallurgical microscope of short wire, as it was confirmed the regulation of the columnar structure and the void growth at the center of boundary-face, we found that electrical short-circuit generated. Also, it was confirmed the melted part on the analysis using SEM(scanning electron microscope). Not only CuL and Cuk line that is composition factor of copper but also OK line was observed uniformly on the spectra analysis using EDX(energy dispersive x-ray spectroscopy). It means that oxygen took part in reaction at the recombination process.

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The Effect of Plasma Gas Composition on the Nanostructures and Optical Properties of TiO2 Films Prepared by Helicon-PECVD

  • Li, D.;Dai, S.;Goullet, A.;Granier, A.
    • Nano
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    • v.13 no.10
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    • pp.1850124.1-1850124.12
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    • 2018
  • $TiO_2$ films were deposited from oxygen/titanium tetraisopropoxide (TTIP) plasmas at low temperature by Helicon-PECVD at floating potential ($V_f$) or substrate self-bias of -50 V. The influence of titanium precursor partial pressure on the morphology, nanostructure and optical properties was investigated. Low titanium partial pressure ([TTIP] < 0.013 Pa) was applied by controlling the TTIP flow rate which is introduced by its own vapor pressure, whereas higher titanium partial pressure was formed through increasing the flow rate by using a carrier gas (CG). Then the precursor partial pressures [TTIP+CG] = 0:027 Pa and 0.093 Pa were obtained. At $V_f$, all the films exhibit a columnar structure, but the degree of inhomogeneity is decreased with the precursor partial pressure. Phase transformation from anatase ([TTIP] < 0.013 Pa) to amorphous ([TTIP+CG] = 0:093 Pa) has been evidenced since the $O^+_2$ ion to neutral flux ratio in the plasma was decreased and more carbon contained in the film. However, in the case of -50 V, the related growth rate for different precursor partial pressures is slightly (~15%) decreased. The columnar morphology at [TTIP] < 0.013 Pa has been changed into a granular structure, but still homogeneous columns are observed for [TTIP+CG] = 0:027 Pa and 0.093 Pa. Rutile phase has been generated at [TTIP] < 0:013 Pa. Ellipsometry measurements were performed on the films deposited at -50 V; results show that the precursor addition from low to high levels leads to a decrease in refractive index.

Growth and Characterization of GaN on Sapphire and Porous SWCNT Using Single Molecular Precursor

  • Sekar, P.V. Chandra;Lim, Hyun-Chul;Kim, Chang-Gyoun;Kim, Do-Jin
    • Korean Journal of Materials Research
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    • v.21 no.5
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    • pp.268-272
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    • 2011
  • Due to their novel properties, GaN based semiconductors and their nanostructures are promising components in a wide range of nanoscale device applications. In this work, the gallium nitride is deposited on c-axis oriented sapphire and porous SWCNT substrates by molecular beam epitaxy using a novel single source precursor of $Me_2Ga(N_3)NH_2C(CH_3)_3$ with ammonia as an additional source of nitrogen. The advantage of using a single molecular precursor is possible deposition at low substrate temperature with good crystal quality. The deposition is carried out in a substrate temperature range of 600-750$^{\circ}C$. The microstructural, structural, and optical properties of the samples were analyzed by scanning electron microscopy, X-ray diffraction, Raman spectroscopy, and photoluminescence. The results show that substrate oriented columnar-like morphology is obtained on the sapphire substrate while sword-like GaN nanorods are obtained on porous SWCNT substrates with rough facets. The crystallinity and surface morphology of the deposited GaN were influenced significantly by deposition temperature and the nature of the substrate used. The growth mechanism of GaN on sapphire as well as porous SWCNT substrates is discussed briefly.