• 제어로봇시스템학회:학술대회논문집
• /
• 2001.10a
• /
• pp.139.2-139
• /
• 2001

This paper presents identification and control of a surface mounting system. The mount head of the system is modeled to analyze its dynamic characteristics, which is critical to the placement performance of the mounter. Based on this model, an identification work is carried out to estimate the modeled parameters by using genetic algorithm (GA), which plays a role of minimizing an error between the actual response and the model response. Having obtained the identified parameters, we design a disturbance observer control to compensate the friction. The disturbance observer can estimate the friction force and the uncertainty of the system. From the experimental results, it is found that the proposed disturbance observer plus PID controller show a better performance than PID controller alone. In order to accomplish a stable contact content control for fast mounting a ...

• Proceedings of the KIEE Conference
• /
• 2002.07d
• /
• pp.2442-2444
• /
• 2002

표면실장형 인쇄회로기판 조림용 칩마운터의 효율적인 운용을 위한 부품 장착 순서를 최적화하는 방법을 모색한다. 연구 과정은 멀티헤드 칩마운터 부품장착 순서를 동적계획법으로 수학식으로 모델링하고, 동적계획법의 방법으로 대상 칩마운터의 장착 순서를 생성한다. 생성된 결과는 다른 알고리즘을 적용하여 생성된 결과와 비교 분석을 한다.

• Journal of Institute of Control, Robotics and Systems
• /
• v.4 no.3
• /
• pp.384-391
• /
• 1998

When a device is mounted on the PCB, it is impossible to have zero defects due to many unpredictable problems. Among these problems, devices with bent corner leads due to mis-handling and which are not placed at a given point measured along the axis are principal problem in SMT(Surface Mounting Technology). It is obvious that given the complexity of the inspection task, the efficiency of a human inspection is questionable. Thus, new technologies for inspection of SMD(Surface Mounting Device) should be explored. An example of such technologies is the Automated Visual Inspection(AVI), wherein the vision system plays a key role to correct this problem. In implementing vision system, high-speed and high-precision are indispensable for practical purposes. In this paper, a new algorithm based on the Radon transform which uses a projection technique to inspect the FIC(Flat Integrated Circuit) device is proposed. The proposed algorithm is compared with other algorithms by measuring the position error(center and angle) and the processing time for the device image, characterized by line scan camera.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.16 no.2
• /
• pp.1398-1402
• /
• 2015

In surface mount technology, the use of technology implemented using a Chip Mounter relay that is inserted into the junction box, etc. car is increasing. On the other hand, there is a need for technology to reduce the weight of the heavy component of the relay attached to different Stick Tube generally chips. Therefore, rather than existing technology, this study improved the algorithm of the system to provide a mechanical structure using Air to supply greater stability using this the component feeder utilizing the Stick Tube proposed technology. When the equipment installed in the Air Stick Feeder was used, the effectiveness, such as increased production and reduced disposal expense, was improved.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
• /
• v.10 no.6
• /
• pp.506-511
• /
• 2017

LED lighting, which many companies are pursuing commercialization, is a representative green energy technology. However, the LED lighting for broadcasting image should have high output and easy portability compared with general LED lighting devices for street lamps, advertisement or transportation devices. Therefore, while shooting a broadcast image if you use LEDs as a substitute light source for halogen lamps and fluorescent lamps that are large in size and uncomfortable to handle it is expected that the lightening of the equipment will activate the broadcasting image lighting equipment industry. After considering the mass production of the LED module board and the SMT production size of the chip mounter, the board size was determined considering the overall size of the product by model. In this paper, four 20W LED boards are arranged vertically in order to produce an 80W board. In other words, by sharing LED module board size by model, high power LED lighting equipments of 120W and 200W can be selected as an increase in the number of boards.