• Bulletin of the Korean Chemical Society
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• v.27 no.10
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• pp.1685-1688
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• 2006

• Bulletin of the Korean Chemical Society
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• v.28 no.10
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• pp.1867-1870
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• 2007

• Bulletin of the Korean Chemical Society
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• v.24 no.2
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• pp.153-154
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• 2003

• Bulletin of the Korean Chemical Society
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• v.30 no.6
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• pp.1241-1242
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• 2009

• Journal of Welding and Joining
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• v.18 no.5
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• pp.90-97
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• 2000

Effect of alloy elements on joinability of insert metal for liquid phase diffusion bonding of heat resistant alloys was investigated in this study. Also, optimum chemical composition of insert metal was explained using interpolation method. The insert metals utilized was commercial Ni-base amorphous foils and newly developed Ni-base filler metals with B, Si and Cr in this study. Melting point and critical interlayer width(CIW) decreased with increasing additional amount of B, Si and Cr, melting point lowering element of the insert metal. Optimized chemical composition of insert metals could be estimated by interpolation method. The optimum amount of B, Si, Cr addition into the insert metal were found to be about 3%, 4% and 3%, respectively. The measured characteristic values, melting point, microhardness in the bonded interlayer and CIW of the insert metals were the almost identical to ones of the calculated results by interpolation method.

• Journal of Dental Rehabilitation and Applied Science
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• v.32 no.4
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• pp.293-300
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• 2016

Purpose: The purpose of this study is finding proper bonding agents to be used when adding bis-acryl composite provisional materials. Materials and Methods: Three bonding agents with different chemical compositions were included in this study. Forty disk shaped specimens of bis-acryl composite provisional material were prepared and divided into 4 groups according to the bonding agents. Control group didn't have bonding agent. Through the Teflon mould with 4.0 mm diameter hole with 4.0 mm thickness the same bis-acryl composite provisional material was added on the disks after the surface of each specimen was treated with designated bonding agent according to the manufacturer's instructions. Shear bond test was performed and the fractured surfaces were inspected with a microscope. One-way analysis of variance was conducted and the result was further analysed with Turkey post hoc test at the significance level of 0.05. Results: The highest strength was acquired from the specimens bonded with chemical cure system and it was statistically significant (P < 0.05). This group showed 100% cohesive failures. The lowest bonding strength was recorded from the specimens used conventional light cure bonding agent, and this group's result was similar with the control group. The group used a light cure bonding agent claiming improved compatibility revealed significantly higher bond strength to the traditional light cure bonding agent group in a statistically significant way (P = 0.043). Conclusion: According to the bonding agent used the shear bond strength was significantly affected. Therefore the choice of proper bonding agent is important when hiring a bonding agent to add bis-acryl composite provisional materials.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.5
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• pp.441-449
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• 2014

Thermoplastic fusion bonding is widely used to seal polymer microfluidic devices and optimal bonding protocol is required to obtain a successful bonding, strong bonding force without channel deformation. Besides, UV modification of the PMMA (poly-methyl methacrylate) is commonly used for chemical or biological application before the bonding process. However, study of thermal bonding for the UV modified PMMA was not reported yet. Unlike pristine PMMA, the optimal bonding parameters of the UV modified PMMA were $103^{\circ}C$, 71 kPa, and 35 minutes. A very low aspect ratio micro channel (AR=1:100, $20{\mu}m$ depth and $2000{\mu}m$ width) was successfully bonded (over 95%, n>100). Moreover, thermal bonding of multi stack PMMA chips was successfully demonstrated in this study. The results may applicable to fabricate a complex 3 dimensional microchannel networks.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.34 no.5
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• pp.56-62
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• 2002

Alternative way of shaping fibers suitable for papermaking was introduced. Impact refining, which was done simply by hitting wet fibers with a metal weight vertically, was intended to keep the fibers from shortening and to cause mostly internal fibrillation. Virgin chemical pulp, its recycled one and OCC were used in the experiment. It was noticed from the experiment that impact refining on virgin chemical pulp kept the fiber length and increased bonding properties greatly. However, in the recycled fibers from the chemical pulp, fiber length and bonding properties were decreased. In OCC, which seems to contain fractions of semi-chemical pulp and mechanical pulp (GP), and which is recycled pulp from corrugated boxes, fiber length and bonding properties were decreased disastrously. We believe recycled cellulosic fibers (recycled chemical pulp and OCC in this case), which went through hornification, were less resistant to the mechanical impact than virgin chemical pulp. For virgin chemical pulp, impact refining allowed no significant fiber length shortening, high WRV, and high mechanical strength.

• Bulletin of the Korean Chemical Society
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• v.34 no.2
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• pp.609-614
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• 2013

Extended H$\ddot{u}$ckel tight-binding band structure calculations are used to address the chemical bonding and elastic properties of $Zr_2AC$ (A=Al, Si, P, and S). Elastic properties are interpreted by analyzing the density of states and the crystal orbital overlap population for the respective phases. Our results show that the bulk modulus of these ternary compounds is determined by the strength of Zr-A bonds.

• Bulletin of the Korean Chemical Society
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• v.24 no.3
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• pp.325-333
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• 2003

An analysis of the electronic structure and bonding in the ternary silicide YNiSi₃is made, using extended Huckel tight-binding calculations. The YNiSi₃structure consists of Ni-capped Si₂dimer layers and Si zigzag chains. Significant bonding interactions are present between the silicon atoms in the structure. The oxidation state formalism of $(Y^{3+})(Ni^0)(Si^3)^{3-}$ for YNiSi₃constitutes a good starting point to describe its electronic structure. Si atoms receive electrons from the most electropositive Y in YNiSi₃, and Ni 3d and Si 3p states dominate below the Fermi level. There is an interesting electron balance between the two Si and Ni sublattices. Since the ${\pi}^*$ orbitals in the Si chain and the Ni d and s block levels are almost completely occupied, the charge balance for YNiSi₃can be rewritten as $(Y^{3+})(Ni^{2-})(Si^{2-})(Si-Si)^+$, making the Si₂layers oxidized. These results suggest that the Si zigzag chain contains single bonds and the Si₂double layer possesses single bonds within a dimer with a partial double bond character. Strong Si-Si and Ni-Si bonding interactions are important for giving stability to the structure, while essentially no metal-metal bonding exists at all. The 2D metallic behavior of this compound is due to the Si-Si interaction leading to dispersion of the several Si₂π bands crossing the Fermi level in the plane perpendicular to the crystallographic b axis.