• Proceedings of the KSME Conference
• /
• 2008.11a
• /
• pp.1821-1824
• /
• 2008

A novel in-mold packaging process has been developed to manufacture devices with closed channels. In this unified process, fabrication of open channels and forming the rigid cover on top of them are sequentially integrated in the same mold. The entire process is comprised of two phases. In the first phase, the open channels are fabricated under an exquisitely controlled temperature and pressure using the conventional micro injection molding technology. In the second phase, the closed channels are fabricated by conducting the injection molding process using the molded structure with the open channels as a mold insert. As a result, the in-mold technology can eliminate the bonding processes such as heating, ultrasonic or chemical processes for cohesion between the channel and the cover, which have been required in conventional methods.

• Journal of the Microelectronics and Packaging Society
• /
• v.2 no.1
• /
• pp.59-68
• /
• 1995

박막제조 기술 및 BGA패캐지를 이용하여 Wellcom 2000 system 소요 OCU Board 의 집적화를 구현하였다. 기존 PCB에 실장되는 소자 일부를 2 Channel BGA 패캐지로 모 듈화한 결과 약 1/6로 소형화시킬수 있었으며 8 Channel의 모율화는 현재 진행중인 다층 구조의 제조 기술 개발과 아울러 BGA 패캐지로 실현이 가능하며 1/10로집접화할수 있음을 알수 있었다. 또한 PCB위에 Bare Chip을 실장하여 Wire Bonding 한 COB를 구현하여 CBGGA의 PCB실장과 함께한 모듈을 형성해 보았다. CBGA패캐지에 Ball Shear Test, In Circuit Test 온도 환경주기시험(TCT) 진동시험을 통하여 신뢰성을 입증하였다. 이때 CBGA의 Coplanarity(3.2%) 증진을 위하여 Ceramic Pad에 선택적인 도금 방식을 개발적용 하였다.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
• /
• v.22 no.11
• /
• pp.751-759
• /
• 2010

A newly developed type PCHE(Printed Circuit Heat Exchanger), which has a longitudinal corrugation flow channel, was fabricated using etching and diffusion bonding to evaluate its hydraulic performance. The pressure drop characteristics obtained from the experimental results are presented and the local friction factors associated with different hydraulic diameters and inclination angles are discussed. The results of a three-dimensional numerical simulation are presented, conducted using commercial CFD(Computational Fluid Dynamics) software at lower Reynolds number range. The numerical results were validated by experimental data obtained from helium gas experimental apparatus. The results of CFD prediction show fairly good agreement with the experimental data.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2005.05a
• /
• pp.229-232
• /
• 2005

This paper presents the design and fabrication of backflow prevented Micropump using the metal membrane. The Micropump is consisted of the lower plate, metal membrane, upper plate and the piezoelectric-element. The lower plate includes the micro channel and the inlet, outlet of the Micropump. The upper plate includes the micro channel and connects the piezoelectric-element. These plate are fabricated on the Pyrex glass wafer by sandblasting process. The metal membrane does roll of check valve that is prevented backflow of the Micropump. The metal membrane is fabricated on the stainless steel by laser machining. Piezoelectric-element is actuated the Micropump and controlled flowing of fluid. The Micropump is fabricated by bonding process of these multi-layer.

• Proceedings of the Korea Concrete Institute Conference
• /
• 2008.11a
• /
• pp.173-176
• /
• 2008

The aim of this paper is to clarify the shear behavior of RC beams strengthened with channel-type Fiber Reinforced Polymer(FRP) plates. Fourteen RC beams were specifically designed. All the beams were tested under four point bending and extensively instrumented to monitor strains, cracking, load capacity and failure modes. The structural response of all beams is then critically analyzed in terms of deformability, strength and failure processes. It is shown that with channel-type Fiber Reinforced Polymer(FRP) plates, a brittle debonding failure of beams bonding FRP in the concrete surface can be transformed to an almost ductile failure with well-defined enhancement of structural performance in terms of both deformation and strength.

• ETRI Journal
• /
• v.46 no.2
• /
• pp.323-332
• /
• 2024

Receiver and transmitter monolithic microwave integrated circuit (MMIC) multifunction chips (MFCs) for active phased-array antennas for Ka-band satellite communication (SATCOM) terminals have been designed and fabricated using a 0.15-㎛ GaAs pseudomorphic high-electron mobility transistor (pHEMT) process. The MFCs consist of four-channel radio frequency (RF) paths and a 4:1 combiner. Each channel provides several functions such as signal amplification, 6-bit phase shifting, and 5-bit attenuation with a 44-bit serial-to-parallel converter (SPC). RF pads are implemented on the bottom side of the chip to remove the parasitic inductance induced by wire bonding. The area of the fabricated chips is 5.2 mm × 4.2 mm. The receiver chip exhibits a gain of 18 dB and a noise figure of 2.0 dB over a frequency range from 17 GHz to 21 GHz with a low direct current (DC) power of 0.36 W. The transmitter chip provides a gain of 20 dB and a 1-dB gain compression point (P1dB) of 18.4 dBm over a frequency range from 28 GHz to 31 GHz with a low DC power of 0.85 W. The P1dB can be increased to 20.6 dBm at a higher bias of +4.5 V.

• The Journal of Korean Institute of Communications and Information Sciences
• /
• v.34 no.11B
• /
• pp.1142-1150
• /
• 2009

In this paper, we propose an novel bandwidth scheduling algorithm for the MAC protocol employed by the Data Over Cable Service Interface Specifications (DOCSIS) 3.0 compliant cable networks. The proposed algorithm statistically improves the chances of request piggybacking to minimize the access delay. It utilizes the piggyback request feature of the segment packets that has been newly specified in DCOSIS 3.0. In DOCSIS 3.0, a bandwidth request can be granted to several upstream channels within an upstream bonding group. The grant on each individual channel is treated as a segment packet. We find the optimal segment placement to minimize the access delay in the proposed algorithm. We also use a self-similar traffic model for simulation and analysis to evaluate the performance of the proposed algorithm.

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
• /
• v.17 no.2 s.58
• /
• pp.38-49
• /
• 2006

In order to increase the spectrum efficiency, recently, there is the number of studies for CR technology. For instance, IEEE 802.22 WRAN(Wireless Regional Area Network) WG considered the CR technology as a solution of WRAN system to serve the high speed internet service(1.5 Mbps down stream and 384 kbps up stream) in 100 km overall coverage and 54 MHz-746 MHz band. Basically, in MAC point of view, the WRAN system have been standardizing based on the IEEE 802.16 MAC layer features such as Data transmission method, QoS provision and Bandwidth request schemes. Additionally, the WRAN system further include CR nature functions such as incumbent user protection, self coexistence which would be importantly considered. Also, the inherent WRAN functions are added such as channel bonding and fractional bandwidth usage. This paper mainly explained frame structure, IU protection, self coexistence which are key functions of WRAN system. Finally, in this paper, we expressed a prospect of IEEE 802.22 WRAN standardization.

• Korea-Australia Rheology Journal
• /
• v.15 no.1
• /
• pp.1-7
• /
• 2003

A new method is introduced to build up organic/organic multilayer films composed of cationic poly(allylamine hydrochloride) (PAH) and negatively charged poly (sodium 4-styrenesulfonate) (PSS) using the spinning process. The adsorption process is governed by both the viscous force induced by fast solvent elimination and the electrostatic interaction between oppositely charged species. On the other hand, the centrifugal and air shear forces applied by the spinning process significantly enhances desorption of weakly bound polyelectrolyte chains and also induce the planarization of the adsorbed polyelectrolyte layer. The film thickness per bilayer adsorbed by the conventional dipping process and the spinning process was found to be about 4 ${\AA}$ and 24 ${\AA}$, respectively. The surface of the multilayer films prepared with the spinning process is quite homogeneous and smooth. Also, a new approach to create multilayer ultrathin films with well-defined micropatterns in a short process time is Introduced. To achieve such micropatterns with high line resolution in organic multilayer films, microfluidic channels were combined with the convective self-assembly process employing both hydrogen bonding and electrostatic intermolecular interactions. The channels were initially filled with polymer solution by capillary pressure and the residual solution was then removed by the .spinning process.

• Transactions of the Korean Society of Pressure Vessels and Piping
• /
• v.14 no.1
• /
• pp.24-31
• /
• 2018

The mechanical design procedure is studied for the PCHE(printed circuit heat exchanger) with electrochemical etched flow channels. The effective heat transfer plates of PCHE are assembled by diffusion bonding to make a module. PCHE is widely used for industrial applications due to its compactness, cost efficiency, and serviceability at high pressure and/or temperature conditions. The limitations and technical barriers of PCHE are investigated for application to nuclear components. Rules for design and fabrication of PCHE are specified in ASME Section VIII but not in ASME Section III of nuclear components. Therefore, the calculation procedure of key dimensions of PCHE is defined based on ASME section VIII. The effective heat transfer region of PCHE is defined by several key dimensions such as the flow channel radius, edge width, wall thickness, and ridge width. The mechanical design procedure of key dimensions was incorporated into a program for easy use in the PCHE design. The effect of assumptions used in the key dimension calculation on stress values is numerically investigated. A comparative analysis is done by comparing finite element analysis results for the semi-circular flow channels with the formula based sizing calculation assuming rectangular cross sections.