• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.12
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• pp.5716-5720
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• 2012

To expand the use of three dimensional(3D) product modelling in the army, we have analyzed military technical data management system, as well as the military guidelines for the unique format and content of technical data package. Because traditional munition sector is based on the machinery and equipment industry, they have usually applied two dimensional(2D) drawings to prepare a design and to make a product. For that reason, there is no provision for 3D product modelling as a technical data package in the military guideline. In this study, we proposed an improvement scheme for the vitalization of 3D product modelling in the army not only in terms of related guideline but also military technical data management system.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.315-316
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• 2009

본 논문에서는 1W 급 이상의 고출력 LED 용 패키지로서 세라믹 LTCC 적층 패키지의 방열 특성을 평가하고 열해석 결과와의 차이에 대해 고찰하였다. 특히, 세라믹 패키지의 방열 특성을 향상시키기 위해 Thermal Via와 Heat slug를 LED Chip 하단부에 위치시켰을 때 방열 특성을 평가하기 위해 Transient Thermal Test를 이용하여 각각의 경우에 대한 열저항을 평가하여 방열 특성의 항상 정도를 확인하였으며, 열해석 시뮬레이션을 통해 얻은 결과와 비교하였다. 평가 결과 Heat slug를 배치한 패키지가 열저항이 $8^{\circ}C/W$로서 가장 우수한 특성을 보여주었으며, 열해석 결과와의 차이에 대해서는 광출력으로 방출된 전력을 계산하여 보정함으로써 $1^{\circ}C$ 이하의 편차를 보여주는 결과를 얻을 수 있었다.

• Proceedings of the KIPE Conference
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• 2005.07a
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• pp.78-80
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• 2005

This paper is described the stability and optimization according to each load of induction heating system for using half-bridge high-frequency series resonant inverter. Each metallic package is inserted into the ceramic type vessel with external working coil. This working coil is connected to the resonant inverter. It evaluates performance and stability of this system according to metallic package.

• Korean Journal of Materials Research
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• v.26 no.1
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• pp.22-28
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• 2016

In this study, we fabricated high quality color conversion component with green/red phosphor and low melting glass frit. The color conversion component was prepared by placing the green and red phosphor layer on slide glass via screen printing process. The properties of color conversion component could be controlled by changing coating sequence, layer thickness and heat treatment temperature. We discovered that optical properties of color conversion component were generally determined by the lowest layer. On the other hand, the heat treatment temperature also affected to correlated color temperature (CCT) and color rending index (CRI). The color conversion component with a green (lower) - red (upper) layer which was sintered at $550^{\circ}C$ showed the best optical properties: CCT, CRI and luminance efficacy were 3340 K, 78, and 56.5 lm/w, respectively.

• Journal of the Korean Ceramic Society
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• v.51 no.6
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• pp.533-538
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• 2014

Today, silicon and epoxy resin are used as materials of conversion lenses for white LEDs on the basis of their good bonding and transparency in LED packages. But these materials give rise to long-term performance problems such as reaction with water, yellowing transition, and shrinkage by heat. These problems are major factors underlying performance deterioration of LEDs. In this study, in order to address these problems, we fabricated a conversion lenses using glass, which has good chemical durability and is stable to heat. The fabricated conversion lenses were applied to a remote phosphor type. In this experiment, the conversion lens for white LED was coated on a glass substrate by a screen printing method using paste. The thickness of the coated conversion lens was controlled during 2 or 3 iterations of coating. The conversion lens fabricated under high heat treatment temperature and with a thin coating showed higher luminance efficiency and CCT closer to white light than fabricated lenses under low heat treatment temperature or a thick coating. The conversion lens with $32{\mu}m$ coating thickness showed the best optical properties: the measured values of the CCT, CRI, and luminance efficiency were 4468 K, 68, and 142.22 lm/w in 20 wt% glass frit, 80 wt% phosphor with sintering at $800^{\circ}C$.

• Journal of the Korean Ceramic Society
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• v.33 no.8
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• pp.863-870
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• 1996

Fabricated modified PZT system for pyroelectric IR sensor were analyzed and characterized for dielectric piezoelectric and pyroelectric properties. Particle size and distribution of source powders were controlled by attrition milling process. 0.05PSS+yPT+(0.95-y)PZ+0.4 wt%MnO2 system was fabricated and investigated sintering density crystal structure and micro-structure through sintering conditions sintering temperature and sintering atmosphere. The poled sintered system of y=0.11 showed the lowest dielectric constant. The dielectric constants were increased with increasing y-mole ratio. The pyroelectric properties of modified PZT systems which were assembled to TO-5 package were measured by IR measurement system average out-voltage of 0.05PSS+0.1PT+0.84PZ+ wt%MnO2 was 3V.

• Proceedings of the IEEK Conference
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• 2000.11b
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• pp.21-24
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• 2000

This paper introduces the design and implementation of a Ku-band 5-bit monolithic phase shifter with a ceramic package. The 5-bit phase shifter MMIC was designed and fabricated by using GaAs MESFET switches. The packaged phase shifter demonstrates a phase error less than 11.3 $^{\circ}$ RMS and an insertion loss variation less than 1.0㏈ RMS for 13∼15㎓. For all 32 states, an insertion loss is measured to be 12.2${\pm}$2.2㏈, an input return loss more than 5.0㏈, and an output return loss more than 6.2㏈ from 13㎓ to 15㎓. The chip size of the 5-bit phase shifter MMIC is 2.35${\times}$1.65mm$\^$2/ including digital control circuits. The size of the ceramic packaged phase shifter is 7.2${\times}$6.2mm$\^$2/.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.04a
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• pp.72-77
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• 2001

The use of hexagonal ceramic inserts for copper extrusion dies offers significant technical and economic advantages over other forms of manufacture. In this paper the data on the loading of the tools is determined from a commercial FEM package as the contact stress distribution on the die-workpiece interface and as temperature distributions in the die. This data can be processed as load input data for a finite element die-stress analysis. Process simulation and stress analysis are thus combined during the design, and a data exchange program has been developed that enables optimal design of the dies taking into account the elastic deflections generated in shrink fitting the die inserts and that caused by the stresses generated in the process. The stress analysis of the dies is used to determine the stress conditions on the ceramic insert by considering contact and interference effects under both mechanical and thermal loads.

• Journal of Mechanical Science and Technology
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• v.15 no.3
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• pp.357-365
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• 2001

The aim of this paper is to perform the experiment and the numerical simulation for investigating the heat transfer in a regenerator system with ceramic honeycomb and to suggest a useful correlation for optimization of the regenerator system. For achieving this, the effects of some parameters were investigated, e. g., switching time, cell size and length of honeycomb on the mean temperature efficiency. The measured temperatures by R-type thermocouples were compared with the predictions by means of the commercial package, STAR-CD. A useful correlation for thermal efficiency was newly proposed as a function of the normalized switching time, defined in terms of switching time, cell size and length of honeycomb. The results showed that the thermal efficiency is above 90% and the normalized heat exchange rate is higher than 80% when the normalized switching time is less than 1000.

• Journal of the Microelectronics and Packaging Society
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• v.2 no.1
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• pp.59-68
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• 1995

박막제조 기술 및 BGA패캐지를 이용하여 Wellcom 2000 system 소요 OCU Board 의 집적화를 구현하였다. 기존 PCB에 실장되는 소자 일부를 2 Channel BGA 패캐지로 모 듈화한 결과 약 1/6로 소형화시킬수 있었으며 8 Channel의 모율화는 현재 진행중인 다층 구조의 제조 기술 개발과 아울러 BGA 패캐지로 실현이 가능하며 1/10로집접화할수 있음을 알수 있었다. 또한 PCB위에 Bare Chip을 실장하여 Wire Bonding 한 COB를 구현하여 CBGGA의 PCB실장과 함께한 모듈을 형성해 보았다. CBGA패캐지에 Ball Shear Test, In Circuit Test 온도 환경주기시험(TCT) 진동시험을 통하여 신뢰성을 입증하였다. 이때 CBGA의 Coplanarity(3.2%) 증진을 위하여 Ceramic Pad에 선택적인 도금 방식을 개발적용 하였다.