• Title/Summary/Keyword: carbon black photoresist

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Synthesis of Fluorene-containing Photosensitive Polymer and Its Application to the Carbon Black-based Photoresist for LCD Color-Filter (Fluorene 단위 구조를 함유한 감광성 고분자의 합성 및 LCD 컬러필터용 카본블랙 포토레지스트로의 응용)

  • Kim, Joo-Sung;Park, Kyung-Je;Lee, Dong-Guen;Bae, Jin-Young
    • Polymer(Korea)
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    • v.35 no.1
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    • pp.87-93
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    • 2011
  • We developed a fluorene-containing multifunctional binder polymer for LCD color filter resist, and employing the binder polymer, carbon black based black photoresist (CBR) was prepared in order to apply it to the black matrix (BM). To obtain the multifunction of the binder polymer, we synthesized bisphenol fluorene epoxy acrylate-containing unsaturated polyester and identified the binder polymer structure with $^1H$ NMR, GPC and FTIR. The corresponding BFEA-polyester binder polymer was compared with the commercially available acryl binder toward the application to the CBR. From the BM lithography test, we found that the synthesized BFEA-polyester binder had better photocrosslinking capability and alkali solubility. In addition, the newly developed binder gave a good process margin, good resolution and adhesion property on a glass substrate.

Study of the Sludge Formation Mechanism in Advanced Packaging Process and Prevention Method for the Sludge (어드밴스드 패키징 공정에서 발생할 수 있는 슬러지의 인자 확인 및 형성 방지법의 제안)

  • Jiwon Kim;Suk Jekal;Ha-Yeong Kim;Min Sang Kim;Dong Hyun Kim;Chan-Gyo Kim;Yeon-Ryong Chu;Neunghi Lee;Chang-Min Yoon
    • Journal of the Korea Organic Resources Recycling Association
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    • v.31 no.1
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    • pp.35-45
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    • 2023
  • In this study, the sludge formation in the wastewater drain from the advanced packaging process mechanisms are revealed as well as the key factors, materials, and sludge prevention methods using surfactant. Compared with that of conventional packaging process, advanced packaging process employ similar process to the semiconductor fabrication process, and thus many processes may generate wastewater. In specific, a large amount of wastewater may generate during the carrier wafer bonding, photo, development, and carrier wafer debonding processes. In order to identify the key factors for the formation of sludge during the advanced packaging process, six types of chemicals including bonding glue, HMDS, photoresist (PR), PR developer, debonding cleaner, and water are utilized and mixing evaluation is assessed. As a result, it is confirmed that the black solid sludge is formed, which is originated by the sludge seed formation by hydrolysis/dehydration reaction of HMDS and sludge growth via hydrophobic-hydrophobic binding with sludge seed and PR. For the sludge prevention investigation, three surfactants of CTAB, PEG, and shampoo are mixed with the key materials of sludge, and it is confirmed that the sludge formations are successfully suppressed. The underlying mechanism behind the sludge formation is that the carbon tails of the surfactant bind to PR with hydrophobic-hydrophobic interaction and inhibit the reaction with HMDS-based slurry seeds to prevent the sludge formation. In this regard, it is expected that various problems like clogging in drains and pipes during the advanced packaging process may effectively solve by the injection of surfactants into the drains.