• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.84-87
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• 2003

Since Pb-free solder alloys have been used extensively in microelectronic packaging industry, the interaction between UBM (Under Bump Metallurgy) and solder is a critical issue because IMC (Intermetallic Compound) at the interface is critical for the adhesion of mechanical and the electrical contact for flip chip bonding. IMC growth must be fast during the reflow process to form stable IMC. Too fast IMC growth, however, is undesirable because it causes the dewetting of UBM and the unstable mechanical stability of thick IMC. UP to now. Ni and Cu are the most popular UBMs because electroplating is lower cost process than thin film deposition in vacuum for Al/Ni(V)/Cu or phased Cr-Cu. The consumption rate and the growth rate of IMC on Ni are lower than those of Cu. In contrast, the wetting of solder bumps on Cu is better than Ni. In addition, the residual stress of Cu is lower than that of Ni. Therefore, the alloy of Cu and Ni could be used as optimum UBM with both advantages of Ni and Cu. In this paper, the interfacial reactions of Sn-3.5Ag-0.7Cu solder on Ni-xCu alloy UBMs were investigated. The UBMs of Ni-Cu alloy were made on Si wafer. Thin Cr film and Cu film were used as adhesion layer and electroplating seed layer, respectively. And then, the solderable layer, Ni-Cu alloy, was deposited on the seed layer by electroplating. The UBM consumption rate and intermetallic growth on Ni-Cu alloy were studied as a function of time and Cu contents. And the IMCs between solder and UBM were analyzed with SEM, EDS, and TEM.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.1-7
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• 2008

We studied a growth behavior of Intermetallic compounds(IMCs) during solder bumping with two reflow methods. Ti(50 nm), Cu($1{\mu}m$), Au(50 nm) and Ti(50 nm) thin films were deposited on $SiO_2$/Si wafer using the DC magnetron sputtering system as the under bump metallization(UBM). And the $5{\mu}m$ thick Cu bumps and $20{\mu}m$ thick Sn bumps were fabricated on UBM by electroplating. Sn bumps were reflowed in RTA(Rapid Thermal Annealing) system and convection reflow oven. When RTA system was used, reflow was possible without using flux and IMC thickness formed in the solder interface was thinner than that of a convectional method.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.27-32
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• 2010

For the flip chip joints processed using Cu pillar bumps and Sn pads, thermal cycling and high temperature storage reliabilities were examined as a function of the Sn pad height. With increasing the height of the Sn pad, which composed of the flip chip joint, from 5 ${\mu}m$ to 30 ${\mu}m$, the contact resistance of the flip chip joint decreased from 31.7 $m{\Omega}$ to 13.8 $m{\Omega}$. Even after thermal cycles of 1000 times ranging from $-45^{\circ}C$ to $125^{\circ}C$, the Cu pillar flip chip joints exhibited the contact resistance increment below 12% and the shear failure forces similar to those before the thermal cycling test. The contact resistance increment of the Cu pillar flip chip joints was maintained below 20% after 1000 hours storage at $125^{\circ}C$.

• Journal of Institute of Control, Robotics and Systems
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• v.19 no.11
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• pp.979-983
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• 2013

The three-dimensional measurement method of confocal systems is a spot scanning method which has a high resolution and good illumination efficiency. However, conventional confocal systems had a weak point in that it has to perform XY axis scanning to achieve FOV (Field of View) vision through spot scanning. There are some methods to improve this problem involving the use of a galvano mirror [1], pin-hole array, etc. Therefore, in this paper we propose a method to improve a parallel mode confocal system using a micro-lens and pin-hole array in a dual microscope configuration. We made an area scan possible by using a combination MLA (Micro Lens Array) and pin-hole array, and used an objective lens to improve the light transmittance and signal-to-noise ratio. Additionally, we made it possible to change the objective lens so that it is possible to select a lens considering the reflection characteristic of the measuring object and proper magnification. We did an experiment using 5X, 2.3X objective lens, and did a calibration of height using a VLSI calibration target.

• The Korea Journal of Herbology
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• v.31 no.4
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• pp.61-69
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• 2016

Objectives : This study is to propose discriminative keys with stereoscope for minute seed herbs easily mixed up, but hard to discriminate by naked eyes: Alli Tuberosi Semen(ATS)✳Alli Fistulosi Semen(AFS), Malvae Semen(MS)✳ Abutili Semen(AS), Plantaginis Semen(PS)✳Schizonepetae Semen(SS).Objectives : We reviewed the description of original plants and medicinal herbs from literature. The specimen of original plant were collected, determinated and compared to samples in the market. Primary classification was performed with naked eyes. and we found out other discrimination keys for non-distinctive herbs with stereoscope. Discrimination keys were set as the morphological criteria of authentic herbs, percentage of adulteration, and standards for discriminating genuine herbs from adulteration.Results : 1) ATS is bigger, has reticulate pattern on protuberant side and unique garlic chives taste. AFS which is usually mixed up, is smaller, has 1~2 ridges and unique welsh onion taste. 2) MS is smaller, has no villus, but its length of bumps are similar. AS easily mixed up, is bigger and has white villus. Its upper side bump is longer and more sharp. 3) PS has dent at middle of the back side. It becomes very sticky when it is put or boiled in water. SS which can be mixed up has no dent and low viscosity compared to PS.Conclusions : With this result, we propose discriminative keys which can identify the original plants and processed herbal state of six herbs. Because minute medicinal herbs are hardly distinguishable by sensory test, It is essential to differentiate by using stereoscope.

• Journal of Korea Water Resources Association
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• v.47 no.12
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• pp.1177-1185
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• 2014

This study suggests a new hydrostatic pressure distribution corrected for nonuniform flow over a channel of large slope. For analyzing shallow-water flows over large slope accurately, it is developed a finite-volume model incorporating the pressure distribution to the shallow water equations. Traveling speed of the hydraulic jump downstream a parabolic bump in the drain case is quite reduced by the weakened bottom gradient source term in the model with the pressure correction. In simulating the dam-break flow over a triangular sill, it is identified that the model with pressure correction could capture the water surface by the digital imaging measurements more than the model without that. Due to the pressure correction decreasing the reflected flows on and increasing overflows over the sill, there are good agreements in the experiment and the simulation with that. Therefore, this model is expected to be applied to such practical problems as flows in the spillway of dam or run-up on the beach.

• Journal of Veterinary Clinics
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• v.32 no.3
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• pp.243-246
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• 2015

A 9 month-old female Chihuahua (weighing 1.5 kg) was referred with loud left basal murmur and exercise intolerance. Diagnostic imaging studies revealed the elongation of left ventricle (LV) with classic triple bumps on the main pulmonary artery, aorta and left atrium on the dorsoventral view of radiograph. Echocardiography revealed patent ductus arteriosus (PDA) duct and continuous turbulent shunt flow (maximal velocity 5.73 m/s) between the aorta and pulmonary artery with left to right direction. The PDA in this dog was successfully closed though femoral vein (transvenous approach) using an Amplatzer$^{(R)}$ vascular plug. To the best of author's knowledge, this is the first case of PDA occlusion treated with vascular plug through femoral vein.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.4
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• pp.395-403
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• 2012

This is direct bonding many of the metal bumps between FPCB and HPCB substrate. By using an ultrasonic horn mounted on an ultrasonic bonding machine, it is possible to bond gold pads onto the FPCB and HPCB at room temperature without an adhesive like ACA or NCA and high heat and solder. This ultrasonic bonding technology minimizes damage to the material. The process conditions evaluated for obtaining a greater bonding strength than 0.6 kgf, which is commercially required, were 40 kHz of frequency; 0.6MPa of bonding pressure; and 0.5, 1.0, 1.5, and 2.0 s of bonding time. The peel off test was performed for evaluating bonding strength, which was found to be more than 0.80 kgf.

• Transactions of the Korean Society of Automotive Engineers
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• v.23 no.4
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• pp.396-401
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• 2015

A door checker holds a car door at several opening angles and limits the maximum door opening, so that the door does not bump against to passengers. Recently, the performance of door checker becomes more important as the feeling of door opening and closing effects on the quality of a car. However, some of door checkers make squealing noise when they are used for ages, which causes consumer's complaints as well as decreasing commercial value of the product. In this study, after various experiments for the noise, we concluded that the major reasons of the noise are acceleration of wearing and loss of lubricant due to impurities in working parts. Therefore, we developed a new mechanism of door checker which can resolve the major reasons of the noise. The developed mechanism is effective to prevent inflow of impurities and loss of lubricant by locating working parts in the case. We also proved that the developed mechanism does not make any noise after the test of 50,000 times of operations.

• Journal of the Korean institute of surface engineering
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• v.36 no.5
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• pp.373-378
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• 2003

With increasing environmental concerns, application of lead-free solder and fluxless soldering process have been taken attention from the electronic packaging industry. Plasma treatment is one of the soldering methods for the fluxless soldering, and it can prevent environmental pollution cased by flux. On this study fluxless soldering process under $Ar-H_2$plasma using lead free solders such as Sn-3.5 wt%Ag, Sn-3.5 wt%Ag-0.7 wt%Cu and Sn-37%Pb for a reference was investigated. As the plasma reflow has higher soldering temperature than normal air reflow, the effects of UBM(Under Bump Metallization) thickness on the interfacial reaction and bonding strength can be critical. Experimental results showed in case of the thin UBM, Au(20 nm)/Cu(0.3 $\mu\textrm{m}$)/Ni(0.4 $\mu\textrm{m}$)/Al(0.4 $\mu\textrm{m}$), shear strength of the soldered joint was relatively low as 19-27㎫, and it's caused by the crack observed along the bonded interface. The crack was believed to be produced by the exhaustion of the thin UBM-layer due to the excessive reaction with solder under plasma. However, in case of thick UBM, Au(20 nm)/Cu(4 $\mu\textrm{m}$)/Ni(4 $\mu\textrm{m}$)/Al(0.4 $\mu\textrm{m}$), the bonded interface was sound without any crack and shear strength gives 32∼42㎫. Thus, by increasing UBM thickness in this study the shear strength can be improved to 50∼70%. Fluxed reflow soldering under hot air was also carried out for a reference, and the shear strength was 48∼52㎫. Consequently the fluxless soldering with plasma showed around 65∼80% as those of fluxed air reflow, and the possibility of the $Ar-H_2$ plasma reflow was evaluated.