• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.53-58
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• 2013

An innovative packaging solution, Flip Chip with Copper (Cu) Column bond on lead (BOL) Enhanced Process (fcCuBE$^{(R)}$) delivers a cost effective, high performance packaging solution over typical bond on capture pad (BOC) technology. These advantages include improved routing efficiency on the substrate top layer thus allowing conversion functionality; furthermore, package cost is lowered by means of reduced substrate layer count and removal of solder on pad (SOP). On the other hand, as electronic packaging technology develops to meet the miniaturization trend from consumer demand, reliability testing will become an important issue in advanced technology area. In particular, electromigration (EM) of flip chip bumps is an increasing reliability concern in the manufacturing of integrated circuit (IC) components and electronic systems. This paper presents the results on EM characteristics on BOL and BOC structures under electrical current stressing in order to investigate the comparison between two different typed structures. EM data was collected for over 7000 hours under accelerated conditions (temperatures: $125^{\circ}C$, $135^{\circ}C$, and $150^{\circ}C$ and stress current: 300 mA, 400 mA, and 500 mA). All samples have been tested without any failures, however, we attempted to find morphologies induced by EM effects through cross-sectional analysis and investigated the interfacial reaction characteristics between BOL and BOC structures under current stressing. EM damage was observed at the solder joint of BOC structure but the BOL structure did not show any damage from the effects of EM. The EM data indicates that the fcCuBE$^{(R)}$ BOL Cu column bump provides a significantly better EM reliability.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.81-85
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• 2013

Wafer stacking technology becomes more important for the next generation IC technology. It requires new process development such as TSV, wafer bonding, and wafer thinning and also needs to resolve wafer warpage, power delivery, and thermo-mechanical reliability for high volume manufacturing. In this study, Cu CMP which is the key process for wafer bonding has been studied using Cu CMP and oxide CMP processes. Wafer samples were fabricated on 8" Si wafer using a damascene process. Cu dishing after Cu CMP and oxide CMP was $180{\AA}$ in average and the total height from wafer surface to bump surface was approximately $2000{\AA}$.

• Electronics and Telecommunications Trends
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• v.35 no.4
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• pp.1-10
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• 2020

Since the 1960s, semiconductor packaging technology has developed into electrical joining techniques using lead frames or C4 bumps using tin-lead solder compositions based on traditional reflow processes. To meet the demands of a highly integrated semiconductor device, high reliability, high productivity, and an eco-friendly simplified process, packaging technology was required to use new materials and processes such as lead-free solder, epoxy-based non cleaning interconnection material, and laser based high-speed processes. For next generation semiconductor packaging, the study status of two epoxy-based interconnection materials such as fluxing and hybrid underfills along with a laser-assisted bonding process were introduced for fine pitch semiconductor applications. The fluxing underfill is a solvent-free and non-washing epoxy-based material, which combines the underfill role and fluxing function of the Surface Mounting Technology (SMT) process. The hybrid underfill is a mixture of the above fluxing underfill and lead-free solder powder. For low-heat-resistant substrate applications such as polyethylene terephthalate (PET) and high productivity, laser-assisted bonding technology is introduced with two epoxy-based underfill materials. Fluxing and hybrid underfills as next-generation semiconductor packaging materials along with laser-assisted bonding as a new process are expected to play an active role in next-generation large displays and Augmented Reality (AR) and Virtual Reality (VR) markets.

• Journal of Korea Society of Industrial Information Systems
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• v.17 no.3
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• pp.35-42
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• 2012

The database for driving patterns can be utilized in various system such as automatic driving system, driver safety system, and it can be helpful to monitor driving style. Therefore, we propose a driving pattern recognition system in which the sensor streams from a smartphone are recorded and used for recognizing driving events. In this paper we focus on the driving pattern recognition that is an essential and preliminary step of driving style recognition. We divide input sensor streams into 7 driving patterns such as, Left-turn(L), U-turn(U), Right-turn(R), Rapid-Braking(RB), Quick-Start(QS), Rapid-Acceleration (RA), Speed-Bump(SB). To classify driving patterns, first, a preprocessing step for data smoothing is followed by an event detection step. Last the detected events are classified by DTW(Dynamic Time Warping) algorithm. For assisting drivers we provide the classified pattern with the corresponding video stream which is recorded with its sensor stream. The proposed system will play an essential role in the safety driving system or driving monitoring system.

• Tribology and Lubricants
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• v.34 no.3
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• pp.107-114
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• 2018

This paper presents a computational model of a gas foil journal bearing with shim foils between the top foil and bumps, and predicts its static and dynamic performance. The analysis takes the previously developed simple elastic foundation model for the top foil-bump structure and advances it by adding foil models for the "shim foil" and "outer top foil." The outer top foil is installed between the (inner) top foil and bumps, and the shim foil is installed between the inner top foil and outer top foil. Both the inner and outer top foils have an arc length of $360^{\circ}$, but the arc length of the shim foil is shorter, which causes a ramp near its leading edge in the bearing clearance profile. The Reynolds equation for isothermal and isoviscous ideal gas solves the hydrodynamic pressure that develops within the bearing clearance with preloads due to the ramp. The centerline pressure and film thickness predictions show that the shim foil mitigates the peak pressure occurring at the loading direction, and broadens the positive pressure as well as minimum film thickness zones except for the shortest shim foil arc length of $180^{\circ}$. In general, the shim foil decreases the journal eccentricity, and increases the power loss, direct stiffness, and damping coefficients. As the shim foil arc length increases, the journal eccentricity decreases while the attitude angle, minimum film thickness, and direct stiffness/damping coefficients in the horizontal direction increase.

• Journal of Welding and Joining
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• v.20 no.4
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• pp.505-509
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• 2002

Pb is considered to be eliminated from solder, due to its toxicity. However, melting temperatures of most Pb-free solders are known higher than that of Sn37Pb. Therefore, there is a difficulty to apply Pb-free solders to electronic industry. Since Sn3Ag8Bi5In has relatively lower melting range as $188~200^{\circ}C$, on this study. Wettability and soldering characteristics of Sn3Ag8Bi5In solder in BGA were investigated to solve for what kind of problem. Zero cross time, wetting time, and equilibrium force of Sn3Ag8Bi5In solder for Cu and plated Cu such as Sn, Ni, and Au/Ni-plated on Cu were estimated. Plated Sn on Cu showed best wettability for zero cross time, wetting time and equilibrium farce. Shear strength of the reflowed joint with Sn3Ag8Bi5In ball in BGA was investigated. Diameter of the ball was 0.5mm, UBM(under bump metallurgy) was $Au(0.5\mu\textrm{m})Ni(5\mu\textrm{m})/Cu(18\mu\textrm{m})$ and flux was RMA type. For the reflow soldering, the peak reflow temperature was changed in the range of $220~250^{\circ}C$, and conveyor speed was 0.6m/min.. The shear strength of Sn3Ag8Bi5In ball showed similar level as those of Sn37Pb. The soldered balls are aged at $110^{\circ}C$ for 36days and their shear strengths were evaluated. The shear strength of Sn3Ag8Bi5In ball was increased from 480gf to 580gf by aging for 5 days.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.82-82
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• 2010

표면실장 공법을 통해 CSP 패키지를 보드에 실장 하는데 있어 무연솔더 접합부의 신뢰성에 영향을 미치는 인자 중 가장 중요한 것은 접합부에 형성되는 IMC (Intermetallic compound, 금속간화합물)인 것으로 알려져 있다. 접합부의 칩 부분에는 솔더와 칩의 UBM (Under bump metalization)이 접합하여 IMC가 형성되나, 보드 부분에는 솔더와 보드의 UBM 뿐만 아니라 그 사이에 솔더 페이스트가 함께 접합되어 IMC가 형성된다. 본 연구에서는 패키지의 신뢰성 연구를 위해 솔더 페이스트의 유무 및 두께에 따른 무연 솔더 접합부의 미세조직의 변화를 분석하였다. 본 실험에서는 Sn-3.0(Wt.%)Ag-0.5Cu 조성과 본 연구진에 의해 개발된 Sn-Ag-Cu-In 조성의 직경 $450{\mu}m$ 솔더 볼을 사용하였으며, 솔더 페이스트는 상용 Sn-3.0Ag-0.5Cu (ALPHA OM-325)를 사용하였다. 칩은 ENIG (Electroless nickel immersion gold) finish pad가 형성된 CSP (Chip scale package)를, 보드는 OSP (Organic solderability preservative)/Cu finish pad가 형성된 것을 사용하였다. 실험 방법은 보드를 솔더 페이스트 없이 플라즈마 처리 한 것, 솔더 페이스트를 $30{\mu}m$ 두께로 인쇄한 것, $120{\mu}m$의 두께로 인쇄한 것, 이렇게 3가지 조건으로 준비한 후, 솔더 볼이 bumping된 칩을 mounting하여, $242^{\circ}C$의 peak 온도 조건의 oven(1809UL, Heller)에서 reflow를 실시하여 패키지를 형성하였다. 이후 시편은 정밀 연마한 후, OM(Optical Microscopic)과 SEM(scanning electron microscope) 및 EDS(energy dispersive spectroscope)를 사용하여 솔더 접합부 IMC의 미세조직을 관찰, 분석하였다.

• Journal of Korean Society of Steel Construction
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• v.9 no.3 s.32
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• pp.309-321
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• 1997

The prediction of the dynamic response of a bridge resulting from passing vehicles across the span is a significant problem in bridge design. In this paper. the static and dynamic experiments are performed to understand the dynamic behavior of an actual two-span steel plate girder bridge. The road surface roughness of the roadway and bridge deck is directly measured by Intelligent Total Station. Numerical scheme to obtain the dynamic responses of the bridges in consideration of measuring road surface roughness and 3-D vehicle model is also presented. The bridge and vehicle are modeled as 3-D bridge and vehicle model, respectively. The main girder and concrete deck are modeled as beam and shell elements, respectively and rigid link is used for the structure between main girder and concrete deck. Bridge-vehicle interaction equations are derived and the impact factors of the responses for different vehicle speeds are calculated and compared with those predicted by several foreign specifications.

• Journal of Korean Society of Steel Construction
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• v.14 no.1
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• pp.95-104
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• 2002

In this paper, research for dynamic wheel loads of 3-D vehicle model considering tire enveloping model is carried out. Heavy trucks with 2-axles and 3-axles are modeled by 7-d.o.f. and 8-d.o.f., in which contact length of tire and pitching of tandem spring axles is considered. Dynamic equations of vehicle are derived by using the Lagrange's equation and solution of the equation is calculated by 5th Runge-Kutter method. The validity of the developed 3-D vehicle model is demonstrated by comparing the results obtained by the present method and experimental data by Whittemore. The maximum impact factors of tire force are calculated when vehicle models of 8ton and 15ton dump truck are running on the different class roads with 1.0km and on the various step bump.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.4
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• pp.1-10
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• 2001

Chip-on-glass(COG) mounting of area array electronic packages was attempted by heating the rear surface of a contact pad film deposited on a glass substrate. The pads consisted of an adhesion (i.e. Cr or Ti) and a top coating layer(i.e. Ni or Cu) were healed by the UV laser beam transmitted through the glass substrate. The lather energy absorbed on the pad raised the temperature of a solder ball which is in physical contact with the pad, and formed a reflowed solder bump. The effects of the adhesion and top coating layer on the laser reflow soldering were studied by measuring temperature profile of the ball during the laser heating process. The results were discussed based on the measurement of reflectivity of the adhesion layer. In addition, the microstructures of solder bumps and their mechanical properties were examined.