• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.140-140
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• 2018

The 3D interconnect technologies have been appeared, as the density of Integrated Circuit (IC) devices increases. Through Silicon Via (TSV) process is an important technology in the 3D interconnect technologies. And the process is used to form a vertically electrical connection through silicon dies. This TSV process has some advantages that short length of interconnection, high interconnection density, low electrical resistance, and low power consumption. Because of these advantages, TSVs could improve the device performance higher. The fabrication process of TSV has several steps such as TSV etching, insulator deposition, seed layer deposition, metallization, planarization, and assembly. Among them, TSV metallization (i.e. TSV filling) was core process in the fabrication process of TSV because TSV metallization determines the performance and reliability of the TSV interconnect. TSVs were commonly filled with metals by using the simple electrochemical deposition method. However, since the aspect ratio of TSVs was become a higher, it was easy to occur voids and copper filling of TSVs became more difficult. Using some additives like an accelerator, suppressor and leveler for the void-free filling of TSVs, deposition rate of bottom could be fast whereas deposition of side walls could be inhibited. The suppressor was adsorbed surface of via easily because of its higher molecular weight than the accelerator. However, for high aspect ratio TSV fillers, the growth of the top of via can be accelerated because the suppressor is replaced by an accelerator. The substitution of the accelerator and the suppressor caused the side wall growth and defect generation. The suppressor was used as Single additive electrodeposition of TSV to overcome the constraints. At the electrochemical deposition of high aspect ratio of TSVs, the suppressor as single additive could effectively suppress the growth of the top surface and the void-free bottom-up filling became possible. Generally, copper was used to fill TSVs since its low resistivity could reduce the RC delay of the interconnection. However, because of the large Coefficients of Thermal Expansion (CTE) mismatch between silicon and copper, stress was induced to the silicon around the TSVs at the annealing process. The Keep Out Zone (KOZ), the stressed area in the silicon, could affect carrier mobility and could cause degradation of the device performance. Cobalt can be used as an alternative material because the CTE of cobalt was lower than that of copper. Therefore, using cobalt could reduce KOZ and improve device performance. In this study, high-aspect ratio TSVs were filled with cobalt using the electrochemical deposition. And the filling performance was enhanced by using the suppressor as single additive. Electrochemical analysis explains the effect of suppressor in the cobalt filling bath and the effect of filling behavior at condition such as current type was investigated.

• Membrane and Water Treatment
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• v.11 no.4
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• pp.237-245
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• 2020

The effects of the mixed two solvents, Dimethylacetamide (DMAc) and Dimethylformamide (DMF), and Polyethylene glycol (PEG) and Polyvinylpyrrolidone (PVP) as additives on performance of Polyvinylidene fluoride (PVDF) membranes were studied. Initially, PEG200 was used as a primary additive at fixed percentage of 5% wt. PVP was then blended with PEG200 in different concentrations. PVDF and DMAc were used as polymer and solvent in the casting solutions, respectively. To control the diffusion rate of PVP in the presence of PEG200 and PVP blend, mixtures of DMAc and DMF were used as the mixed solvent in the casting solutions. Asymmetric PVDF membranes were prepared via phase inversion process in a water bath and the effects of two additives and two solvents on the membrane morphology, pure water flux (PWF), hydrophilicity and rejection (R) were investigated. Attenuated Total Reflection Fourier Transform Infrared Spectra (ATR-FTIR) analysis was used to show the residual PVP on the surface of the membranes. Atomic Force Microscopy (AFM) was utilized to determine roughness of membrane surface. The use of mixed solvents in the casting solution resulted in reduction of PVP diffusion rate and increment of PEG diffusion rate. Eventually, PWF and R values reduced, while porosity and hydrophilicity increased.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.3
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• pp.37-42
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• 2007

Copper deposition studies have been actively studied since interests on 3D SiP were increased. The defects inside via can be easily formed due to the current density differences on entrance, bottom and wall of via. So far many different additives and current types were discussed and optimized to obtain void-free copper via filling. In this research acid cupric sulfate plating bath containing additives such as PEG, SPS, JGB, PEI and wave current applied electroplating were examined. The size and shape of grain were influenced by the types of organic additives. The cross section of specimen were analyzed by FESEM. When PEI was added, the denser copper deposits were obtained. Electroplaing time was reduced when 2 step via filling was employed.

• Journal of the Korean institute of surface engineering
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• v.23 no.1
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• pp.16-26
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• 1990

The standrd electrolyte for the electrodeposition of chromium were preparwith reagent grade chromic acid(200g/L), sulfuric acid(pH=1.8)and oxalic acalic acid(640g/L)as additive. Carbon content in chromium plating varied about2.0-3.8 wt% with current density and temperatures of the bath. The hardeness of chromium platings incresed with increasing the annealing temperatures and showed maximum value of about Hv 1700 after annealing at$ 700^{\circ}C$for 60min. But, decreased it as annealing at above $700^{\circ}C$. The reason for varing thee hardness of chromium codeposited with carbon gradually foumed chromium carbide(Cr7C3), but that changed to Cr23C6 as annealing temperature at above $^700{\circ}C$. The X-ray diffraction pattern indicated that chromium carbides, such as Cr7C3 or Cr3C2, formed at formed at above $300^{\circ}C$. titanium coating sputtered on the on surface of chromium plating had performed and determined the hardness after annealing at 500, 600, $700^{\circ}C$ for 60min. the maximum hardeness was about Hv 2400 as annealing at $700^{\circ}C$. The titanium carbide formed in layer was identified by X-ray diffraction. It was confirmed that chromium and titanium carbide has effect of increasing the hardness.

• Proceedings of the KIEE Conference
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• 2000.11c
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• pp.413-415
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• 2000

Piezoelectric ceramics of PZT have been developed to apply for transformers in notebook. Use of piezoelectric ceramics in applications like piezoelectric transformers was made possible by the development of new materials with high electromechanical coupling coefficients and high mechanical quality factor. "Hard" ferroelectiric ceramics of complex composition based on lead zirconate titanate with Mn additive have been prepared. The perovskitic phase reaction of the oxides. The crucial role played by the intermediate mixing and grinding procedures in the assessment of the final properties of the material was investigated. Densification up to approximately the theoretical density value was achieved. The polarization was obtained by subjecting the samples at $30kVcm^{-1}$ poling electric field, in a silicon oil bath heated at $110^{\circ}C$. Their microstructural and morphological properties were checked by X-ray diffraction analysis and scanning electron microscopy. The optimized samples presented very high qualify and electromechanical coupling factors, together with small dielectric loss.

• The Journal of Korean Medicine Ophthalmology and Otolaryngology and Dermatology
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• v.15 no.1
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• pp.276-284
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• 2002

Aromatherapy is becoming increasingly popular, however there are few clear indications for its use. To systematically review the clinical studies on aromatherapy, computcrized literature searches were performed from PubMed. Fourteen trials were located. The conclusions were as follows: 1. All the trials were published after 1993. 2. To analyze the publication journals, five of fourteen trials were on nursing, three of them on neuropsychiatry and one on dermatology. 3. Most widely used indications of aromatherapy were on general physical, psychological and physiological field. 4. On the procedure of aromatherapy, eight of them were by massage, three by inhalation, one by massage & inhalation and one by bath additive. 5. To analyze the publication type, all fourteen trials were clinical trials. Twelve of them were randomized controlled trials. Two of them were using single subject design. 6. To observe the sample size, five of them were under 10, four from 10 to 50, two from 50 to 100 and three above 100. 7. Eleven of fourteen trials were using inferential statistics. Eight of the eleven trials were significantly effective, but three had no statistical significance.

• Korean Journal of Materials Research
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• v.18 no.3
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• pp.163-168
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• 2008

The morphology of three-dimensional (3D) cross-linked electrodeposits of copper and tin was investigated as a function of the content of metal sulfate and acetic acid in a deposition bath. The composition of copper sulfate had little effect on the overall copper network structure, whereas that of tin sulfate produced significant differences in the tin network structure. The effect of the metal sulfate content on the copper and tin network is discussed in terms of whether or not hydrogen evolution occurs on electrodeposits. In addition, the hydrophobic additive, i.e., acetic acid, which suppresses the coalescence of evolved hydrogen bubbles and thereby makes the pore size controllable, proved to be detrimental to the formation of a well-defined network structure. This led to a non-uniform or discontinuous copper network. This implies that acetic acid critically retards the electrodeposition of copper.

• Journal of the Korean institute of surface engineering
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• v.36 no.6
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• pp.444-454
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• 2003

The effect of trace metallic additives of Al-Fe-X on microstructure, glossiness and hardness of Zn electrodeposits was investigated by using sulfate bath. The preferred orientation of Zn deposits with Al-Fe additives was (10 l)(l:3,4,2), while that of Zn deposits with Al-Fe-X(Ni,Co) additives was either (002) or (002)＋(103)ㆍ(104) mixed orientation. The preferred orientation of Zn deposits with Al-Fe-Cr additives changed from (002)+(10 l) to (10 l) orientation with increasing amount of Al additive. The surface morphology of the Zn deposits was closely related to the preferred orientation of the deposits. The glossiness of Zn deposits with Al-Fe additives increased in comparison with that of pure Zn deposit. That of the Zn deposits with Al-Fe-X additives was related to the morphology of the deposits and changed according to type of additives. The hardness of Zn deposits with Al-Fe-X(Ni,Co,Cr) additives was noticeably higher than that of Zn deposits with Al-Fe additives.

• Journal of Electrochemical Science and Technology
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• v.11 no.2
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• pp.172-179
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• 2020

The impact of effective parameters on the electrodeposition rate optimization of Au-Cu alloy at high thicknesses on the silver substrate was investigated in the present study. After ensuring the formation of gold alloy deposits with the desired and standard percentage of gold with the cartage of 18K and other standard karats that should be observed in the manufacturing of the gold and jewelry artifacts, comparing the rate of gold-copper deposition by direct and pulsed current was done. The rate of deposition with pulse current was significantly higher than direct current. In this process, the duty cycle parameter was effectively optimized by the "one factor at a time" method to achieve maximum deposition rate. Particular parameters in this work were direct and pulse current densities, bath temperature, concentration of gold and cyanide ions in electrolyte, pH, agitation and wetting agent additive. Scanning electron microscopy (SEM) and surface chemical analysis system (EDS) were used to study the effect of deposition on the cross-sections of the formed layers. The results revealed that the Au-Cu alloy layer formed with concentrations of 6gr·L^-1 Au, 55gr·L^-1 Cu, 24 gr·L^-1 KCN and 1 ml·L^-1 Lauryl dimethyl amine oxide (LDAO) in the 0.6 mA·cm^-2 average current density and 30% duty cycle, had 0.841 ㎛·min^-1 Which was the highest deposition rate. The use of electrodeposition of pure and alloy gold thick layers as a production method can reduce the use of gold metal in the production of hallow gold artifacts, create sophisticated and unique models, and diversify production by maintaining standard karats, hardness, thickness and mechanical strength. This will not only make the process economical, it will also provide significant added value to the gold artifacts. By pulsating of currents and increasing the duty cycle means reducing the pulse off-time, and if the pulse off-time becomes too short, the electric double layer would not have sufficient growth time, and its thickness decreases. These results show the effect of pulsed current on increasing the electrodeposition rate of Au-Cu alloy confirming the previous studies on the effect of pulsed current on increasing the deposition rate of Au-Cu alloy.

• Membrane Journal
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• v.18 no.1
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• pp.84-93
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• 2008

Poly(vinylidene fluoride) has received much attention in the last several years for the lithium secondary batteries. In this study, to enhance the porosity, PVdF was prepared by phase inversion method using as an additive, PEG (poly(ethylene glycol)), with N,N-dimethylformamid as a solvent. The pores are generated during the solvent and non-solvent exchange process in the coagulation bath filled with non-solvent (distilled water). The surface and cross-section of the membranes were observed with a scanning electron microscopy (SEM). The mechanical property of the membrane was determined by using an universal testing machine (UTM) and thermal property was verified by heat shrinkage. Uniformed sponge structure of PVdF-PEG membrane for the lithium secondary batteries was prepared with 10 wt% of PEG concentration in the PVdF-PEG solution. Porosity, elongation and tensile strengh of the membrane were 87%, 75.45%, and 275. 27 MPa respectively.