• The Transactions of the Korean Institute of Electrical Engineers D
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• v.55 no.5
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• pp.240-247
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• 2006

Frequent arousals during sleep degrade the quality of sleep and result in sleep fragmentation. Visual inspection of physiological signals to detect the arousal events is cumbersome and time-consuming work. The purpose of this study is to develop an automatic algorithm to detect the arousal events. The proposed method is based on time-frequency analysis and the support vector machine classifier using single channel electroencephalogram (EEG). To extract features, first we computed 6 indices to find out the informations of a subject's sleep states. Next powers of each of 4 frequency bands were computed using spectrogram of arousal region. And finally we computed variations of power of EEG frequency to detect arousals. The performance has been assessed using polysomnographic (PSG) recordings of twenty patients with sleep apnea, snoring and excessive daytime sleepiness (EDS). We could obtain sensitivity of 79.65%, specificity of 89.52% for the data sets. We have shown that proposed method was effective for detecting the arousal events.

• The Journal of the Korea institute of electronic communication sciences
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• v.15 no.3
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• pp.389-396
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• 2020

In order to obtain a good quality product, a proper verification of production/test facilities must be preceded before the quality conformity inspection of the product. Among the various production/test facilities, ATE is widely used in the civilian industry such as the automotive industry, aerospace industry, semiconductor industry today. In addition, ATE is actively used in the defense industry production and performance tests. This paper is the result of systematically verifying the Design Conformance of ATS which is ATE of military FM radio set using various methods. And It is expected to be a good reference at the present time when the design conformity verification procedure for ATE for military supplies is not documented.

• 제어로봇시스템학회:학술대회논문집
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• 1988.10a
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• pp.353-359
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• 1988

In this paper, the design and implementation of a multi-processor based die bonder machine for the semiconductor will be described. This is a final research results carried out for two years from June, 1986 to July, 1988. The mechanical system consists of three subsystems such as bonding head module, wafer feeding module, and lead frame feeding module. The overall control system consists of the following three subsystems each of which employs a 16 bit microprocessor MC 68000 : (i) supervisory control system, (ii) visual recognition / inspection system and (iii) the display system. Specifically, the supervisory control system supervises the whole sequence of die bonder machine, performs a self-diagnostics while it controls the bonding head module according to the prespecified bonding cycle. The vision system recognizes the die to inspect the die quality and deviation / orientation of a die with respect to a reference position, while it controls the wafer feeding module. Finally, the display system performs a character display, image display ans various error messages to communicate with operator. Lead frame feeding module is controlled by this subsystem. It is reported that the proposed control system were applied to an engineering sample and tested in real-time, and the results are sucessful as an engineering sample phase.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.4
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• pp.390-396
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• 2013

Due to the development of technology, there is a considerable increase in the number of skyscrapers in the world. Accordingly, there are rapid growing requests about maintenances such as cleaning, painting, and inspection. However, it is extremely dangerous working the walls of buildings, and crashes from buildings have accounted for large proportion of constructional accidents. Especially, as the number of buildings with irregular shapes increases, the accident rate during the maintenance work increases each year, and most of the accidents lead to death. An alternative solution must be developed with the commercialization of automatic systems. In this research, a fundamental research has been conducted for drafting and commercializing an automation tool that is carried in the built-in guide system, which can perform cleaning.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.6
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• pp.88-95
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• 2003

This paper presents the measurement and correction method of PCB alignment errors for PCB screen printer. Electronic equipment is getting smaller and yet must satisfy high performance standard. Therefore, there is a great demand for PCB with high density. However conventional PCB screen printer doesn't have enough accuracy to accommodate the demand fur high-resolution circuit pattern and high-density mounting capacity of electronic chips. It is because the alignment errors of PCB occur when it is loaded to the screen printer. Therefore, this study focuses on the development of the system which is able to measure and correct alignment errors with high-accuracy. An automatic optical inspection part measures the PCB alignment errors using machine vision, and the high-accuracy 3-axis stage makes correction for these errors. This system used two CCD cameras to get images of two fiducial marks of PCB. The geometrical relationship between PCB, cameras, and xy$\theta$ stage is derived, and analytical equations for alignment errors are also obtained. The unknown parameters including camera declining angles and etc. can be obtained by initialization process. Finally, the proposed algorithm is verified by experiments by using test bench.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.6
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• pp.96-104
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• 2003

This paper presents the measurement and correction method of PCB alignment errors for PCB screen printer. Electronic equipment is getting smaller and yet must satisfy high performance standard. Therefore, there is a great demand for PCB with high density. However conventional PCB screen printer doesn't have enough accuracy to accommodate the demand for high-resolution circuit pattern and high-density mounting capacity of electronic chips. It is because the alignment errors of PCB occur when it is loaded to the screen printer. Therefore, this study focuses on the development of the system which is able to measure and correct alignment errors with high-accuracy. An automatic optical inspection part measures the PCB alignment errors using machine vision, and the high-accuracy 3-axis stage makes correction for these errors. This system used two CCD cameras to get images of two fiducial marks of PCB. The centers of fiducial marks are obtained by using moment, gradient method. The first method is calculating the centroid by using first moment of blob, and the latter method is calculating the center of the circle whose equation is obtained by curve-fitting the boundaries of fiducial mark. The operating system used to implement the whole set-up is carried in Window 98 (or NT) environment. Finally we implemented this system to PCB screen printer.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.16 no.1
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• pp.221-225
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• 2016

This paper is about vision system that exhibits automatic examination of the conditions of fuses and relay boxes using a camera. Proposed vision system is composed of three parts: image acquisition, vision algorithm, and user interface. The image acquisition part is composed of illumination and optics. The vision algorithmis the examining part, using the grabbed fuse box image. Lastly, user interface is divided into two parts, user interface for registering features of fuse box and user interface for examination operation.

• Journal of Korea Multimedia Society
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• v.18 no.12
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• pp.1519-1527
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• 2015

TFT-LCD automatic defect inspection system for detecting defects in place of the visual tester does pre-processing, candidate defect pixel detection, and recognition and classification through a blob analysis. An over-detection result of defects acts as an undue burden of blob analysis for recognition and classification. In this paper, we propose defect detection method based on the histogram distribution modeling of TFT-LCD image to minimize over-detection of candidate defective pixels. Primary defect candidate pixels are detected estimating the skewness of the luminance distribution histogram of the background pixels. Based on the detected defect pixels, the defective pixels other than noise pixels are detected using the distribution histogram model of the local area. Experimental results confirm that the proposed method shows an excellent defect detection result on the image containing the various types of defects and the reduction of the degree of over-detection as well.

• Journal of Information Display
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• v.10 no.4
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• pp.202-205
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• 2009

An automated circuit repair system was developed for enhancing the yield of nondefective liquid crystal panels, focusing on the resist patterns on the circuit material layer of thin-film transistor (TFT) substrates prior to etching. The developed system has an advantage over the parallel conventional system: In the former, the repair conditions depend on the type of resist whereas in the latter, the repair parameters must be fine-tuned for each circuit material. The developed system consists of a resist pattern defect inspection system and a pattern repair system for short and open defects. The repair system performs fine corrections of abnormal areas of the resist pattern. The open-repair system is equipped with a syringe to dispense resist. To maintain a stable resist diameter, a thermal insulator was installed in the syringe system. As a result, the diameter of the dispensed resist became much more stable than when no thermal insulator was used. The resist diameter was kept within the target of $400{\pm}100{\mu}m$. Furthermore, a prototype system was constructed, and using a dummy pattern, it was confirmed that the system worked automatically and correctly.

• Korean Journal of Poultry Science
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• v.22 no.4
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• pp.233-238
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• 1995

A computer vision system was built to generate images of a single, stationary egg. This system includes a CGD camera, a frame grabber, and incandescent back lighting system. Image processing algorithms were developed to inspect egg shell and to sort eggs. Those values of both gray level and area of dark spots in the egg image were used as criteria to detect holes in egg and those values of both area and roundness of dark spots in the egg image were used to detect cracks in egg. For a sample of 300 eggs, this system was able to correctly analyze an egg for the presence of a defect 97.5% of the time. The weights of eggs were found to be linear to both the projected area and the perimeter of eggs viewed from above. Those two values were used as criteria to sort eggs. The coefficients of determination(r$^2$) for the regression equations between weights and those two values were 0.967 and 0.972 in the two sets of experiment. Accuracies in grading were found to be 95.6% and 96.7% as compared with results from sizing by electronic weight scale.